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    Electronic component with SA/BW ratio and board having the same mounted thereon
    23.
    发明授权
    Electronic component with SA/BW ratio and board having the same mounted thereon 有权

    公开(公告)号：US11166376B2

    公开(公告)日：2021-11-02

    申请号：US16846806

    申请日：2020-04-13

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Se Hun Park ,  Hun Gyu Park ,  Woo Chul Shin ,  Ji Hong Jo

    IPC: H05K1/18 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H05K1/11 ,  H01G4/30

    Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.

    Composite electronic component
    24.
    发明授权
    Composite electronic component 有权

    公开(公告)号：US11004608B2

    公开(公告)日：2021-05-11

    申请号：US16202900

    申请日：2018-11-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Se Hun Park ,  Gu Won Ji

    IPC: H01G4/228 ,  H01G2/06 ,  H01G4/30 ,  H01G4/12 ,  H05K1/02

    Abstract: A composite electronic component includes a multilayer ceramic capacitor including a ceramic body configured by stacking a plurality of dielectric layers and configured by stacking a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween and first and second external electrodes disposed on opposing end portions of the ceramic body, and a pair of substrates spaced apart from a lower portion of the multilayer ceramic capacitor and each including, on opposing end portions, first terminal electrodes connected to the first external electrode and second terminal electrodes connected to the second external electrode.

    Electronic component
    26.
    发明授权
    Electronic component 有权

    公开(公告)号：US10777356B2

    公开(公告)日：2020-09-15

    申请号：US16207047

    申请日：2018-11-30

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Se Hun Park ,  Gu Won Ji ,  Young Ghyu Ahn

    IPC: H01G4/248 ,  H01G4/232 ,  H01G4/30 ,  H01G4/008 ,  H01G4/12

    Abstract: An electronic component includes: a capacitor body; first and second external electrodes disposed on a mounting surface of the capacitor body to be spaced apart from each other; and first and second connection terminals including an insulator, electrically connected to the first and second external electrodes, respectively, through land patterns each disposed on upper and lower surfaces thereof and electrically connected to each other, and having first and second bridge portions protruding so as to face each other in the length direction of the capacitor body, respectively.

    Multilayer electronic component and board having the same
    27.
    发明授权
    Multilayer electronic component and board having the same 有权

    公开(公告)号：US10650970B2

    公开(公告)日：2020-05-12

    申请号：US15813779

    申请日：2017-11-15

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Se Hun Park ,  Gu Won Ji

    IPC: H01G4/232 ,  H01G4/30 ,  H01G2/06 ,  H05K3/34 ,  H01G4/12

    Abstract: A multilayer electronic component includes: a capacitor body including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with respective dielectric layers interposed between each pair of first and second internal electrodes, the capacitor body having third and fourth surfaces opposing each other, an end of each the first and second internal electrodes being exposed through the third and fourth surfaces, respectively; first and second external electrodes disposed on the third and fourth surfaces of the capacitor body, respectively; and first and second connection terminals connected to the first and second external electrodes, respectively, wherein each of the first and second connection terminals includes a vertical portion disposed to face the external electrode, a horizontal portion extended from a lower end of the vertical portion, and a cut portion formed in a portion connecting the vertical portion and the horizontal portion to each other.

    Multilayer capacitor and board having the same mounted thereon
    28.
    发明授权
    Multilayer capacitor and board having the same mounted thereon 有权

    公开(公告)号：US10192684B2

    公开(公告)日：2019-01-29

    申请号：US15644227

    申请日：2017-07-07

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Jong Hwan Park ,  Se Hun Park

    IPC: H01G4/012 ,  H01G4/248 ,  H01G4/30 ,  H05K1/11 ,  H05K1/18 ,  H01G4/12

    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and a plurality of first and second internal electrodes exposed through the third and fourth surfaces, and having first to sixth surfaces; first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces, and first and second band portions extending from the first and second connection portions to portions of the first and second surfaces and the fifth and sixth surfaces; first and second conductive resin layers covering portions of the first and second band portions; an insulating layer disposed on the first surface; and first and second terminal electrodes spaced apart from each other, covering portions of the insulating layer, and connected to the first and second external electrodes.

    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
    30.
    发明申请
    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON 有权

    公开(公告)号：US20220030719A1

    公开(公告)日：2022-01-27

    申请号：US17493569

    申请日：2021-10-04

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Heung Kil Park ,  Se Hun Park ,  Hun Gyu Park ,  Woo Chul Shin ,  Ji Hong Jo

    IPC: H05K1/18 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H05K1/11 ,  H01G4/30

    Abstract: A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.

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