SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME

    公开(公告)号:US20250087584A1

    公开(公告)日:2025-03-13

    申请号:US18666962

    申请日:2024-05-17

    Abstract: A semiconductor device includes a first semiconductor structure including, circuit devices on a substrate, a lower interconnection structure, and a capacitor structure on a same level as a level of at least a portion of the lower interconnection structure, and a second semiconductor structure on the first semiconductor structure and including a plurality of memory cells arranged three-dimensionally. The lower interconnection structure includes a lower contact, a lower line on the lower contact, an upper contact on the lower line, and an upper line on the upper contact. The capacitor structure includes first electrode structures extending in a first direction and spaced apart from each other in a second direction intersecting the first direction, second electrode structures positioned alternately alongside the first electrode structures and spaced apart from each other in the second direction, and dielectric layers between the first electrode structures and the second electrode structures.

    PRINTED CIRCUIT BOARDS AND MEMORY MODULES

    公开(公告)号:US20220408550A1

    公开(公告)日:2022-12-22

    申请号:US17573156

    申请日:2022-01-11

    Abstract: A PCB includes a plurality of layers spaced apart in a vertical direction, a first detection pattern and a second detection pattern and pads connected to the first detection pattern and the second detection pattern. The first detection pattern and the second detection pattern are provided in a respective one of a first layer and a second layer adjacent to each other such that the first detection pattern and the second detection pattern are opposed to each other. The pads are provided in an outmost layer. Each of the first detection pattern and the second detection includes at least one main segment extending in at least one of first and second horizontal directions and a diagonal direction. A time domain reflectometry connected to a pair of pads detects a misalignment of the PCB by measuring differential characteristic impedance of the first detection pattern and the second detection pattern.

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