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    Image sensors and electronic devices
    24.
    发明授权
    Image sensors and electronic devices 有权

    公开(公告)号：US11929384B2

    公开(公告)日：2024-03-12

    申请号：US18186402

    申请日：2023-03-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyung Bae Park ,  Yong Wan Jin ,  Sung Young Yun ,  Sung Jun Park ,  Feifei Fang ,  Chul Joon Heo

    IPC: H01L27/146 ,  H01L31/0352

    CPC classification number: H01L27/14647 ,  H01L31/035209

    Abstract: An image sensor may include a first photo-sensing device on a semiconductor substrate and configured to sense light of a first wavelength spectrum, and second and third photo-sensing devices integrated in the semiconductor substrate and configured to sense light of a second and third wavelength spectrum, respectively. The first photo-sensing device may overlap each of the second and third photo-sensing devices in a thickness direction of the semiconductor substrate. The second and third photo-sensing devices do not overlap in the thickness direction and each have an upper surface, a lower surface, and a doped region therebetween. The third photo-sensing device includes an upper surface deeper further from the upper surface of the semiconductor substrate than the upper surface of the second photo-sensing device and a doped region thicker than the doped region of the second photo-sensing device. The image sensor may omit the first photo-sensing device.

    Image sensors and electronic devices
    26.
    发明授权
    Image sensors and electronic devices 有权

    公开(公告)号：US11683599B2

    公开(公告)日：2023-06-20

    申请号：US17227676

    申请日：2021-04-12

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Gae Hwang Lee ,  Kwang Hee Lee ,  Kyung Bae Park ,  Sung Young Yun ,  Dong-Seok Leem ,  Yong Wan Jin

    IPC: H04N25/79 ,  H04N25/17 ,  H04N5/32 ,  H01L27/146

    CPC classification number: H04N25/17 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14629 ,  H04N5/32

    Abstract: An image sensor may include a photoelectric device configured to selectively absorb light associated with a first color of three primary colors, a semiconductor substrate stacked with the photoelectric device and including first and second photo-sensing devices configured to sense light associated with second and third colors of the three primary colors, respectively, a first color filter corresponding to the first photo-sensing device and configured to selectively transmit light of the first wavelength spectrum, a second color filter corresponding to the second photo-sensing device and configured to selectively transmit light associated with a mixed color of the first color and the third color, and a first insulating layer between the photoelectric device and the semiconductor substrate and corresponding to the second photo-sensing device, and configured to selectively reflect light of a part of visible light.

    Signal processing apparatuses and signal processing methods
    28.
    发明授权
    Signal processing apparatuses and signal processing methods 有权

    公开(公告)号：US11317068B2

    公开(公告)日：2022-04-26

    申请号：US16675698

    申请日：2019-11-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Mineki Taoka ,  Takashi Okazaki ,  Chul Joon Heo ,  Gae Hwang Lee ,  Kyung Bae Park ,  Yong Wan Jin

    IPC: H04N9/64 ,  H04N9/04 ,  H04N5/369 ,  H01L27/146 ,  H01L27/28 ,  H01L27/30

    Abstract: In a signal processing apparatus, a photoelectric conversion member includes a first photoelectric conversion layer configured to photoelectrically convert at least one of blue light or red light, and a second photoelectric conversion layer on an incident light surface of the first photoelectric conversion layer and configured to photoelectrically convert green light. An interpolation circuit is configured to interpolate at least one of a blue light signal or a red light signal obtained by photoelectric conversion in the first photoelectric conversion layer L1, using a green light signal obtained by photoelectric conversion in the second photoelectric conversion layer L2. An absorption correction circuit is configured to perform absorption correction on the green light signal, using at least one of the blue light signal or the red light signal that are interpolated by the interpolation circuit.

    FINGERPRINT SENSORS AND FINGERPRINT SENSOR ARRAYS AND DEVICES
    29.
    发明申请
    FINGERPRINT SENSORS AND FINGERPRINT SENSOR ARRAYS AND DEVICES 有权

    公开(公告)号：US20220036028A1

    公开(公告)日：2022-02-03

    申请号：US17503663

    申请日：2021-10-18

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Gae Hwang Lee ,  Kyung Bae Park ,  Sung Jun Park ,  Sung Young Yun ,  Yong Wan Jin ,  Chul Joon Heo

    IPC: G06K9/00 ,  H01L51/52

    Abstract: A fingerprint sensor may include first and second electrodes, a light absorption layer isolated from direct contact with the first and second electrodes, and an insulation layer between the first electrode and the light absorption layer and further between the second electrode and the light absorption layer. A reflective layer may be between the light absorption layer and the first electrode. The insulation layer may include a first insulation layer between the first electrode and the light absorption layer, and a second insulation layer between the second electrode and the light absorption layer. A fingerprint sensor array including a plurality of fingerprint sensors may at least partially expose a plurality of sub-pixels of a display panel on which the fingerprint sensor array is located.

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