公开(公告)号：US09892980B2

公开(公告)日：2018-02-13

申请号：US15437566

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Younghoon Sohn ,  Jinsung Kim ,  Yusin Yang ,  Chungsam Jun

IPC: H01L21/66 ,  H01L21/768 ,  H01L21/027 ,  H01L21/311 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L21/56 ,  H01L21/67 ,  H01L21/02

CPC classification number: H01L22/12 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02271 ,  H01L21/0274 ,  H01L21/31144 ,  H01L21/4846 ,  H01L21/565 ,  H01L21/67259 ,  H01L21/6835 ,  H01L21/76802 ,  H01L21/76895 ,  H01L22/20 ,  H01L24/06 ,  H01L24/11 ,  H01L2221/68345 ,  H01L2224/02311 ,  H01L2224/13024 ,  H01L2224/14131 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/152 ,  H01L2924/15747

Abstract: A method of fabricating a package includes providing a mold substrate supporting dies in cavities of a fan-out substrate, detecting positions of the dies with respect to the fan-out substrate, and forming interconnection lines. At least one of the interconnection lines includes a first portion extending from the fan-out substrate to a target position on the cavity disposed between the fan-out substrate and one of the dies the one of the dies disposed at a detected position different from the target position, and a second portion extending from the one die to the fan-out substrate.

公开(公告)号：US09466537B2

公开(公告)日：2016-10-11

申请号：US14988991

申请日：2016-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minkook Kim ,  Wooseok Ko ,  Yusin Yang ,  Sangkil Lee ,  Chungsam Jun

IPC: H01L21/00 ,  H01L21/66

CPC classification number: H01L22/12 ,  H01L27/11565 ,  H01L27/11582

Abstract: A method of inspecting a semiconductor device includes providing a substrate, on which a mold layer with a plurality of mold openings is provided, milling the mold layer in a direction inclined at a predetermined angle with respect to a direction normal to a top surface of the substrate, such that an inclined cutting surface exposing milled mold openings is formed, the milled mold openings including first milling openings along a first column extending in a first direction and having different heights, obtaining image data of the cutting surface, the image data including first contour images of the first milling openings, and obtaining a first process parameter, which represents an extent of bending of the mold openings according to a distance from a top surface of the substrate, using positions of center points of the first contour images.

Abstract translation: 一种检查半导体器件的方法包括提供一个衬底，在其上提供具有多个模具开口的模具层，在相对于垂直于该顶部表面的方向倾斜预定角度的方向上铣削模具层 基板，使得形成露出铣削模具开口的倾斜切割表面，所述铣削模具开口包括沿着第一方向延伸并具有不同高度的第一列的第一铣削开口，获得切割表面的图像数据，所述图像数据包括第一 并且使用第一轮廓图像的中心点的位置获得第一加工参数，该第一加工参数代表与基材顶表面距离的距离的模具开口的弯曲程度。