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21.发明申请公开(公告)号：US20210183828A1
公开(公告)日：2021-06-17
申请号：US17121651
申请日：2020-12-14
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jong Hyeon Chae , Ik Kyu You , Seom Geun Lee , Seong Kyu Jang , Yong Woo Ryu
IPC: H01L25/075 , H01L33/62 , H01L23/00
Abstract: A display panel including a circuit board having first pads, a plurality of light emitting devices disposed on the circuit board and having second pads, at least one of the light emitting devices including a repaired light emitting device, and a metal bonding layer bonding the first pads and the second pads, in which the metal bonding layer of the repaired light emitting device has at least one of a thickness and a composition different from that of the metal bonding layer of the remaining light emitting devices.
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公开(公告)号：US20210043678A1
公开(公告)日：2021-02-11
申请号：US16943373
申请日：2020-07-30
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Hyeon CHAE , Seom Geun Lee , Seong Kyu Jang
IPC: H01L27/15
Abstract: A display panel including a circuit board having pads thereon, and a plurality of pixel regions arranged on the circuit board, each of the pixel regions including a first LED stack disposed on the circuit board, a first bonding layer disposed between the first LED stack and the circuit board, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, first through-vias passing through the first LED stack and the first bonding layer, second through-vias passing through the second LED stack, and third through-vias passing through the third LED stack, in which the first through-vias pass through the first LED stack and the first bonding layer, and are connected to the pads of the circuit board.
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公开(公告)号：US20200373348A1
公开(公告)日：2020-11-26
申请号：US15930979
申请日：2020-05-13
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seom Geun LEE , Seong Kyu Jang , Chan Seob Shin , Ho Joon Lee
Abstract: A light emitting device for a display including a first LED stack, a second LED stack disposed thereunder, a third LED stack disposed thereunder and including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, an insulation layer between the second bonding layer and the second LED stack, lower buried layers passing through the second LED stack and the insulation layer and electrically connected to the first and second conductivity type semiconductor layers of the third LED stack, respectively, upper buried layers passing through the first LED stack and the second bonding layer and electrically connected to the lower buried layers, and upper connectors disposed on the first LED stack and including upper connectors covering and electrically connected to the upper buried layers, respectively.
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公开(公告)号：US10573780B2
公开(公告)日：2020-02-25
申请号：US16069665
申请日：2017-01-11
Applicant: Seoul Viosys Co., Ltd.
Inventor： Seong Kyu Jang , Hong Suk Cho , Kyu Ho Lee , Chi Hyun In
Abstract: An ultraviolet light-emitting device including a substrate, a first conductive type semiconductor layer disposed on the substrate, a mesa disposed on the first conductive type semiconductor layer and including a second conductive type semiconductor layer and an active layer disposed between the semiconductor layers, a first contact electrode contacting the exposed first conductive type semiconductor layer around the mesa, a second contact electrode contacting the second conductive type semiconductor layer on the mesa, a passivation layer covering the first contact electrode, the mesa, and the second contact electrode and having openings disposed above the first and second contact electrodes, and first and second bump electrodes electrically connected to the first and second contact electrodes through the openings of the passivation layer, in which the mesa has depressions in plan view, and the first and second bump electrodes cover the openings and a portion of the passivation layer.
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公开(公告)号：US12159861B2
公开(公告)日：2024-12-03
申请号：US17722369
申请日：2022-04-17
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seong Kyu Jang , Yong Woo Ryu , Seom Geun Lee , Cha E Kim
Abstract: A light emitting device including a first LED stack, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and a common electrode electrically connected to a first conductivity type semiconductor layer of each of the first, second, and third LED stacks, in which the common electrode includes a step in at least one of the first, second and third LED stacks.
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Patent Agency Ranking
公开(公告)号：US12132148B2
公开(公告)日：2024-10-29
申请号：US17536074
申请日：2021-11-28
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seong Kyu Jang , Chan Seob Shin , Seom Geun Lee , Ho Joon Lee
IPC: H01L33/24 , H01L25/075 , H01L33/62 , G02B27/01 , G06F1/16
CPC classification number: H01L33/24 , H01L25/0753 , H01L33/62 , G02B27/0172 , G02B2027/0178 , G06F1/163
Abstract: A method of fabricating a light emitting device for a display, the method including the steps of growing a first LED stack on a first growth substrate, the first LED stack including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, growing a second LED stack on a second growth substrate, the second LED stack including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, bonding the second LED stack to a first temporary substrate, removing the second growth substrate from the second LED stack, bonding the second LED stack to the first LED stack, and removing the first temporary substrate from the second LED stack.
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公开(公告)号：US12125941B2
公开(公告)日：2024-10-22
申请号：US17106150
申请日：2020-11-29
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Hyeon Chae , Seom Geun Lee , Seong Kyu Jang
CPC classification number: H01L33/08 , H01L33/382 , H01L33/42
Abstract: A light emitting device for a display including a first LED stack, a second LED stack disposed under the first LED stack, a third LED stack disposed under the second LED stack, and including a first conductivity type semiconductor layer and a second conductivity type semiconductor layer, a surface protection layer at least partially covering side surfaces of the first LED stack, the second LED stack, or the third LED stack, a first bonding layer interposed between the second LED stack and the third LED stack, a second bonding layer interposed between the first LED stack and the second LED stack, lower buried vias passing through the second LED stack and the first bonding layer, and electrically connected to the first conductivity type semiconductor layer and the second conductivity type semiconductor layer of the third LED stack, respectively, and upper buried vias passing through the first LED stack.
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公开(公告)号：US12046587B2
公开(公告)日：2024-07-23
申请号：US18226779
申请日：2023-07-27
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seom Geun Lee , Seong Kyu Jang , Yong Woo Ryu , Jong Hyeon Chae
IPC: H01L25/075 , H01L33/42 , H01L33/62
CPC classification number: H01L25/0756 , H01L25/0753 , H01L33/42 , H01L33/62
Abstract: A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material.
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公开(公告)号：US11756940B2
公开(公告)日：2023-09-12
申请号：US17902893
申请日：2022-09-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seom Geun Lee , Seong Kyu Jang , Yong Woo Ryu , Jong Hyeon Chae
IPC: H01L25/075 , H01L33/42 , H01L33/62
CPC classification number: H01L25/0756 , H01L25/0753 , H01L33/42 , H01L33/62
Abstract: A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material, in which a width of an upper end of the upper conductive material is greater than a width of the corresponding upper conductive material.
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30.发明授权公开(公告)号：US11749652B2
公开(公告)日：2023-09-05
申请号：US17990735
申请日：2022-11-20
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Hyeon Chae , Ik Kyu You , Seom Geun Lee , Seong Kyu Jang , Yong Woo Ryu
IPC: H01L25/075 , H01L33/62 , H01L23/00
CPC classification number: H01L25/0753 , H01L24/16 , H01L33/62 , H01L2224/16227 , H01L2224/16505
Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.
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