公开(公告)号：US20190210868A1

公开(公告)日：2019-07-11

申请号：US15866380

申请日：2018-01-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Marco DEL SARTO ,  Mikel AZPEITIA URQUIA

IPC: B81C1/00 ,  B81B7/00 ,  B81B3/00

Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.

公开(公告)号：US20180299337A1

公开(公告)日：2018-10-18

申请号：US15958461

申请日：2018-04-20

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Lorenzo BALDO ,  Sarah ZERBINI ,  Enri DUQI

IPC: G01L9/00 ,  B81C1/00 ,  B81B3/00 ,  B81B7/00

CPC classification number: G01L9/0052 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C1/00182 ,  B81C2201/0116 ,  G01L9/0072

Abstract: A process for manufacturing a MEMS pressure sensor having a micromechanical structure envisages: providing a wafer having a substrate of semiconductor material and a top surface; forming a buried cavity entirely contained within the substrate and separated from the top surface by a membrane suspended above the buried cavity; forming a fluidic-communication access for fluidic communication of the membrane with an external environment, set at a pressure the value of which has to be determined; forming, suspended above the membrane, a plate made of polysilicon, separated from the membrane by an empty space; and forming electrical-contact elements for electrical connection of the membrane and of the plate, which are designed to form the plates of a sensing capacitor, the value of capacitance of which is indicative of the value of pressure to be detected. A corresponding MEMS pressure sensor having the micromechanical structure is moreover described.

公开(公告)号：US20180282152A1

公开(公告)日：2018-10-04

申请号：US15870429

申请日：2018-01-12

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Roberto CARMINATI

IPC: B81C1/00

CPC classification number: B81C1/00222 ,  B81B3/0021 ,  B81B7/02 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/097 ,  B81C1/00261 ,  B81C1/00349 ,  B81C2201/01

Abstract: MEMS device, in which a body made of semiconductor material contains a chamber, and a first column inside the chamber. A cap of semiconductor material is attached to the body and forms a first membrane, a first cavity and a first channel. The chamber is closed on the side of the cap. The first membrane, the first cavity, the first channel and the first column form a capacitive pressure sensor structure. The first membrane is arranged between the first cavity and the second face, the first channel extends between the first cavity and the first face or between the first cavity and the second face and the first column extends towards the first membrane and forms, along with the first membrane, plates of a first capacitor element.

公开(公告)号：US20240081660A1

公开(公告)日：2024-03-14

申请号：US18243361

申请日：2023-09-07

Applicant: STMicroelectronics S.r.l.

Inventor： Enrico Rosario ALESSI ,  Enri DUQI ,  Fabio PASSANITI

IPC: A61B5/0205 ,  A61B5/00 ,  A61B5/01

CPC classification number: A61B5/02055 ,  A61B5/0008 ,  A61B5/0022 ,  A61B5/01 ,  A61B5/6817 ,  A61B5/6824 ,  H04R1/1016 ,  H04R2420/07

Abstract: An earphone device has a casing having a measurement portion dedicated to acquisition of at least one measurement quantity with the earphone device arranged outside an ear of a subject. The earphone device is provided with at least one sensor, operatively coupled to the measurement portion within the casing for acquiring signals indicative of the measurement quantity, and a processing module that processes the signals acquired by the sensor so as to provide a processed output signal for monitoring the measurement quantity, as a function of the acquired signals. Electrical-connection elements define electrical paths within the casing in electrical connection with the sensor.

公开(公告)号：US20230273084A1

公开(公告)日：2023-08-31

申请号：US18171163

申请日：2023-02-17

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Domenico GIUSTI ,  Enri DUQI

IPC: G01L9/00 ,  G01L19/14 ,  G01L27/00

CPC classification number: G01L9/0054 ,  G01L19/147 ,  G01L19/148 ,  G01L27/007

Abstract: A pressure sensor device has: a pressure detection structure provided in a first die of semiconductor material; a package, configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure and a body structure, arranged on the base structure, with an access opening in contact with an external environment and internally defining a housing cavity, in which the first die is arranged covered with a coating material. A piezoelectric transduction structure, of a ultrasonic type, is accommodated in the housing cavity, in order to allow detection of foreign material above the coating material and within the package. In particular, the piezoelectric transduction structure is integrated in the first die, which comprises a first portion, wherein the pressure detection structure is integrated, and a second portion, separate and distinct from the first portion, wherein the piezoelectric transduction structure is integrated.

公开(公告)号：US20210095949A1

公开(公告)日：2021-04-01

申请号：US17025977

申请日：2020-09-18

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Gabriele GATTERE ,  Carlo VALZASINA ,  Enri DUQI

IPC: G01B7/16 ,  B81B7/00

Abstract: A button device includes a MEMS sensor having a MEMS strain detection structure and a deformable substrate configured to undergo deformation under the action of an external force. The MEMS strain detection structure includes a mobile element carried by the deformable substrate via at least a first and a second anchorage, the latter fixed with respect to the deformable substrate and configured to displace and generate a deformation force on the mobile element in the presence of the external force; and stator elements capacitively coupled to the mobile element. The deformation of the mobile element causes a capacitance variation between the mobile element and the stator elements. Furthermore, the MEMS sensor is configured to generate detection signals correlated to the capacitance variation.

公开(公告)号：US20200326010A1

公开(公告)日：2020-10-15

申请号：US16842474

申请日：2020-04-07

Applicant: STMicroelectronics S.r.l.

Inventor： Enri DUQI ,  Lorenzo BALDO

IPC: F16K31/00 ,  H01L41/09 ,  B23P15/00

Abstract: A microfluidic valve formed in a body having a first and a second surface; an inlet channel extending in the body from the second surface; a first transverse channel extending in the body in a transverse direction with respect to the inlet channel; and an outlet channel extending in the body from the first surface. The inlet channel, the first transverse channel and the outlet channel form a fluidic path. The microfluidic valve further has an occluding portion, formed by the body and extending over the transverse channel; and a piezoelectric actuator coupled to the occluding portion and configured to move the occluding portion from an opening position of the valve, where the occluding portion does not interfere with the fluidic path, and a closing position of the valve, where the occluding portion interferes with and interrupts the fluidic path.

公开(公告)号：US20200262699A1

公开(公告)日：2020-08-20

申请号：US16869159

申请日：2020-05-07

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Marco DEL SARTO ,  Mikel AZPEITIA URQUIA

IPC: B81C1/00 ,  B81B3/00 ,  B81B7/00

Abstract: A micro-electro-mechanical device, comprising a monolithic body of semiconductor material accommodating a first buried cavity; a sensitive region facing the first buried cavity; a second cavity facing the first buried cavity; a decoupling trench extending from the monolithic body and separating the sensitive region from a peripheral portion of the monolithic body; a cap die, forming an ASIC, bonded to and facing the first face of the monolithic body; and a first gap between the cap die and the monolithic body. The device also comprises at least one spacer element between the monolithic body and the cap die; at least one stopper element between the monolithic body and the cap die; and a second gap between the stopper element and one between the monolithic body and the cap die. The second gap is smaller than the first gap.

公开(公告)号：US20190330056A1

公开(公告)日：2019-10-31

申请号：US16509367

申请日：2019-07-11

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Enri DUQI ,  Lorenzo BALDO ,  Domenico GIUSTI

IPC: B81C1/00 ,  B81B7/00

Abstract: An integrated device includes: a first die; a second die coupled in a stacked way on the first die along a vertical axis; a coupling region arranged between facing surfaces of the first die and of the second die, which face one another along the vertical axis and lie in a horizontal plane orthogonal to the vertical axis, for mechanical coupling of the first and second dies; electrical-contact elements carried by the facing surfaces of the first and second dies, aligned in pairs along the vertical axis; and conductive regions arranged between the pairs of electrical-contact elements carried by the facing surfaces of the first and second dies, for their electrical coupling. Supporting elements are arranged at the facing surface of at least one of the first and second dies and elastically support respective electrical-contact elements.

公开(公告)号：US20190064020A1

公开(公告)日：2019-02-28

申请号：US16101987

申请日：2018-08-13

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Enri DUQI ,  Lorenzo Baldo

IPC: G01L9/00

CPC classification number: G01L9/0045 ,  G01L9/0052 ,  G01L9/0054 ,  G01L13/025

Abstract: Microelectromechanical transducer comprising a semiconductor body, four cavities buried within the semiconductor body and four membranes, each membrane being suspended over a respective cavity and being capable of being deflected by the action of a pressure external to the microelectromechanical transducer; the microelectromechanical transducer further comprising four transducer elements housed by a respective membrane and electrically coupled to one another in a Wheatstone bridge configuration to convert said external pressure into an electrical signal.