公开(公告)号：US20190318885A1

公开(公告)日：2019-10-17

申请号：US16453737

申请日：2019-06-26

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Giovanni CAMPARDO ,  Carlo VALZASINA

IPC: H01H1/00 ,  B81B7/04 ,  B81B7/00 ,  H01H59/00

Abstract: A microelectromechanical device, in particular a non-volatile memory module or a relay, comprising: a mobile body including a top region and a bottom region; top electrodes facing the top region; and bottom electrodes, facing the bottom region. The mobile body is, in a resting condition, at a distance from the electrodes. The latter can be biased for generating a movement of the mobile body for causing a direct contact of the top region with the top electrodes and, in a different operating condition, a direct contact of the bottom region with the bottom electrodes. In the absence of biasing, molecular-attraction forces maintain in stable mutual contact the top region and the top electrodes or, alternatively, the bottom region and the bottom electrodes.

公开(公告)号：US20180335326A1

公开(公告)日：2018-11-22

申请号：US16049262

申请日：2018-07-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Dario PACI ,  Francesco PROCOPIO ,  Carlo VALZASINA ,  Paolo ANGELINI ,  Francesco DIAZZI ,  Roberto Pio BAORDA ,  Danilo Karim KADDOURI

IPC: G01D18/00 ,  H05B3/16 ,  G01R33/09 ,  G01R33/00 ,  G01K13/00 ,  B81C99/00

CPC classification number: G01D18/00 ,  B81B2207/012 ,  B81B2207/03 ,  B81C99/003 ,  G01K13/00 ,  G01R33/0017 ,  G01R33/09 ,  H05B3/16

Abstract: An integrated sensor device including a first die, housing a sensor element to detect a quantity external to the sensor device and transduce the external quantity into an electrical sensing signal; a second die mechanically coupled to the first die so that the first and second dies are stacked on one another along one and the same axis; and at least one heater of a resistive type integrated in the first die and/or in the second die, having a first conduction terminal and a second conduction terminal configured to couple respective first and second conduction terminals of a signal generator for causing an electric current to flow, in use, between the first and second conduction terminals of the heater and generate heat by the Joule effect. It is possible to carry out calibration in temperature of the sensor element.

公开(公告)号：US20160091528A1

公开(公告)日：2016-03-31

申请号：US14964469

申请日：2015-12-09

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Barbara SIMONI ,  Carlo VALZASINA

IPC: G01P15/18

CPC classification number: G01P15/18 ,  G01C19/574 ,  G01P15/125

Abstract: A microelectromechanical device includes: a supporting structure; two sensing masses, movable with respect to the supporting structure according to a first axis and a respective second axis; a driving device for maintaining the sensing masses in oscillation along the first axis in phase opposition; sensing units for supplying sensing signals indicative of displacements respectively of the sensing masses according to the respective second axis; processing components for combining the sensing signals so as to: in a first sensing mode, amplify effects on the sensing signals of concordant displacements and attenuate effects of discordant displacements of the sensing masses; and in a second sensing mode, amplify effects on the sensing signals of discordant displacements and attenuate effects of concordant displacements of the sensing masses.

公开(公告)号：US20240003685A1

公开(公告)日：2024-01-04

申请号：US18339084

申请日：2023-06-21

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Luca Giuseppe FALORNI ,  Patrick FEDELI ,  Gabriele GATTERE ,  Carlo VALZASINA ,  Paola CARULLI

IPC: G01C19/5733 ,  G01C19/5712 ,  G01C19/5769

CPC classification number: G01C19/5733 ,  G01C19/5712 ,  G01C19/5769

Abstract: MEMS gyroscope, having a first movable mass configured to move with respect to a fixed structure along a first drive direction and along a first sense direction, transverse to the first drive direction; a first drive assembly, coupled to the first movable mass and configured to generate a first alternate drive movement; a first drive elastic structure, coupled to the first movable mass and to the first drive assembly, rigid in the first drive direction and compliant in the first sense direction; a second movable mass, configured to move with respect to the fixed structure in a second drive direction parallel to the first drive direction and in a second sense direction parallel to the first sense direction; a second drive assembly, coupled to the second movable mass and configured to generate a second alternate drive movement in the second drive direction; and a second drive elastic structure, coupled to the second movable mass and to the second drive assembly, rigid in the second drive direction and compliant in the second sense direction.

公开(公告)号：US20210363000A1

公开(公告)日：2021-11-25

申请号：US17320993

申请日：2021-05-14

Applicant: STMicroelectronics S.r.l.

Inventor： Giorgio ALLEGATO ,  Lorenzo CORSO ,  Ilaria GELMI ,  Carlo VALZASINA

IPC: B81B3/00 ,  B81C1/00

Abstract: A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.

公开(公告)号：US20210190814A1

公开(公告)日：2021-06-24

申请号：US17122793

申请日：2020-12-15

Applicant: STMicroelectronics S.r.l.

Inventor： Jean Marie DARMANIN ,  Carlo VALZASINA ,  Alessandro TOCCHIO ,  Gabriele GATTERE

IPC: G01P15/125

Abstract: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.

公开(公告)号：US20210095949A1

公开(公告)日：2021-04-01

申请号：US17025977

申请日：2020-09-18

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Gabriele GATTERE ,  Carlo VALZASINA ,  Enri DUQI

IPC: G01B7/16 ,  B81B7/00

Abstract: A button device includes a MEMS sensor having a MEMS strain detection structure and a deformable substrate configured to undergo deformation under the action of an external force. The MEMS strain detection structure includes a mobile element carried by the deformable substrate via at least a first and a second anchorage, the latter fixed with respect to the deformable substrate and configured to displace and generate a deformation force on the mobile element in the presence of the external force; and stator elements capacitively coupled to the mobile element. The deformation of the mobile element causes a capacitance variation between the mobile element and the stator elements. Furthermore, the MEMS sensor is configured to generate detection signals correlated to the capacitance variation.

公开(公告)号：US20240199408A1

公开(公告)日：2024-06-20

申请号：US18590533

申请日：2024-02-28

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Giorgio ALLEGATO ,  Lorenzo CORSO ,  Ilaria GELMI ,  Carlo VALZASINA

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0051 ,  B81C1/00595 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C2201/0198

Abstract: A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.

公开(公告)号：US20230135941A1

公开(公告)日：2023-05-04

申请号：US18048370

申请日：2022-10-20

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Gabriele GATTERE ,  Manuel RIANI ,  Carlo VALZASINA

IPC: G01C19/5712 ,  B81B3/00

Abstract: The present disclosure is directed to a MEMS gyroscope formed by a substrate and a movable mass suspended on the substrate and configured to carry out a movement in a driving direction and in a detection direction perpendicular to each other. The movable mass has a first face and a second face opposite to the first face. The gyroscope also has a first and a second quadrature compensation electrode group, fixed to the substrate and capacitively coupled to the movable mass. The first quadrature compensation electrode group faces the first face of the movable mass, and the second quadrature compensation electrode group faces the second face of the movable mass. The first and the second quadrature compensation electrode groups each have a respective variable facing area on the movable mass as a result of the movement of the movable mass in the driving direction and are configured to exert an electrostatic force on the movable mass during the movement of the movable mass in the driving direction.

公开(公告)号：US20200156114A1

公开(公告)日：2020-05-21

申请号：US16684289

申请日：2019-11-14

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Gabriele GATTERE ,  Carlo VALZASINA ,  Federico VERCESI ,  Giorgio ALLEGATO

IPC: B06B1/06 ,  B81B7/00 ,  B81C1/00

Abstract: An ultrasonic MEMS acoustic transducer formed in a body of semiconductor material having first and second surfaces opposite to one another. A first cavity extends in the body and delimits at the bottom a sensitive portion, which extends between the first cavity and the first surface of the body. The sensitive portion houses a second cavity and forms a membrane that extends between the second cavity and the first surface of the body. An elastic supporting structure extends between the sensitive portion and the body and is suspended over the first cavity.