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公开(公告)号：US20170287886A1
公开(公告)日：2017-10-05
申请号：US15087959
申请日：2016-03-31
Applicant: STMicroelectronics PTE LTD
Inventor： David Gani
IPC: H01L25/16 , H01L31/167 , H01L31/18 , G06F3/041 , H01L31/02 , H01S5/022 , H04M1/02 , H01L23/48 , H01L21/768
CPC classification number: H01L25/167 , G01S17/026 , G06F3/0416 , G06F2203/04105 , H01L21/76898 , H01L23/481 , H01L31/02005 , H01L31/167 , H01L31/1804 , H01L31/186 , H01S5/02248 , H04M1/026
Abstract: Wafer level proximity sensors are formed by processing a silicon substrate wafer and a silicon cap wafer separately, bonding the cap wafer to the substrate wafer, forming an interconnect structure of through-silicon vias within the substrate, and singulating the bonded wafers to yield individually packaged sensors. The wafer level proximity sensor is smaller than a conventional proximity sensor and can be manufactured using a shorter fabrication process at a lower cost. The proximity sensors are coupled to external components by a signal path that includes the through-silicon vias and a ball grid array formed on a lower surface of the silicon substrate. The design of the wafer level proximity sensor passes more light from the light emitter and more light to the light sensor.
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公开(公告)号：US20150138420A1
公开(公告)日：2015-05-21
申请号：US14086507
申请日：2013-11-21
Applicant: STMicroelectronics Pte Ltd.
Inventor： Hk Looi , David Gani , Wee Chin Judy Lim , Bs Aw , Cheng-Hai Cheh
IPC: H04N5/225 , G02F1/1341 , G02F1/1345 , G02F1/1333 , G02F1/1343
CPC classification number: H04N5/2257 , G02F1/13452 , G03B3/10 , G03B5/00 , G03B17/02 , G03B2205/0046 , Y10T29/49117
Abstract: Electronics modules and methods of making electronics modules are provided. An electronics module includes a substrate having an electronic circuit mounted thereon, a lens mount affixed to the substrate, the lens mount having a lens assembly mounted therein, and a liquid crystal cell affixed to the lens mount over the lens assembly, the liquid crystal cell having electrical terminals, wherein the lens mount includes adhesive containment pockets that are filled with a conductive adhesive so as to contact the electrical terminals of the liquid crystal cell, wherein the adhesive containment pockets include contacts that are electrically connected to the substrate. In some embodiments, the electronics module is a camera module.
Abstract translation: 提供电子模块和制造电子模块的方法。 电子模块包括其上安装有电子电路的基板，固定到基板的透镜座，安装有透镜组件的透镜座，以及固定在透镜组件上方的透镜座的液晶单元，液晶盒 具有电端子，其中所述透镜座包括粘合剂容纳袋，其填充有导电粘合剂以便接触所述液晶单元的电端子，其中所述粘合剂容纳袋包括电连接到所述基板的触点。 在一些实施例中，电子模块是相机模块。
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公开(公告)号：US11996397B2
公开(公告)日：2024-05-28
申请号：US17360925
申请日：2021-06-28
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David Gani
IPC: H01L25/16 , G01S17/04 , H01L21/768 , H01L23/48 , H01L31/02 , H01L31/167 , H01L31/18 , H01S5/02325 , H04M1/02
CPC classification number: H01L25/167 , G01S17/04 , H01L21/76898 , H01L23/481 , H01L31/02005 , H01L31/167 , H01L31/1804 , H01L31/186 , H01S5/02325 , H04M1/026 , G06F2203/04105
Abstract: Wafer level proximity sensors are formed by processing a silicon substrate wafer and a silicon cap wafer separately, bonding the cap wafer to the substrate wafer, forming an interconnect structure of through-silicon vias within the substrate, and singulating the bonded wafers to yield individually packaged sensors. The wafer level proximity sensor is smaller than a conventional proximity sensor and can be manufactured using a shorter fabrication process at a lower cost. The proximity sensors are coupled to external components by a signal path that includes the through-silicon vias and a ball grid array formed on a lower surface of the silicon substrate. The design of the wafer level proximity sensor passes more light from the light emitter and more light to the light sensor.
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公开(公告)号：US11908831B2
公开(公告)日：2024-02-20
申请号：US17483076
申请日：2021-09-23
Applicant: STMicroelectronics PTE LTD
Inventor： Chun Yi Teng , David Gani
IPC: H01L23/00 , H01L21/768 , H01L21/78
CPC classification number: H01L24/95 , H01L21/768 , H01L21/78 , H01L24/03 , H01L24/11 , H01L2224/0231 , H01L2224/03019 , H01L2224/0401 , H01L2224/11849 , H01L2224/95001
Abstract: Trenches are opened from a top surface of a production wafer that extend down through scribe areas to a depth that is only partially through a semiconductor substrate. Prior to performing a bumping process, a first handle is attached to the top surface of the production wafer. A back surface of the semiconductor substrate is then thinned to reach the trenches and form a wafer level chip scale package at each integrated circuit location delimited by the trenches. A second handle is then attached to a bottom surface of the thinned semiconductor substrate, and the first handle is removed to expose underbump metallization pads at the top surface. The bumping process is then performed to form a solder ball at each of the exposed underbump metallization pads.
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公开(公告)号：US11742437B2
公开(公告)日：2023-08-29
申请号：US17187510
申请日：2021-02-26
Applicant: STMICROELECTRONICS LTD , STMICROELECTRONICS PTE LTD
Inventor： David Gani , Yiying Kuo
IPC: H01L31/0203 , H01L31/18 , H01L31/0392 , H01L31/02 , H01L21/78
CPC classification number: H01L31/0203 , H01L21/78 , H01L31/02002 , H01L31/02005 , H01L31/0392 , H01L31/1876 , H01L31/1896
Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP), with a die coupled to a central portion of a transparent substrate. The transparent substrate includes a central portion having and a peripheral portion surrounding the central portion. The package includes a conductive layer coupled to a contact of the die within the package that extends from the transparent substrate to an active surface of the package. The active surface is utilized to mount the package within an electronic device or to a printed circuit board (PCB) accordingly. The package includes a first insulating layer separating the die from the conductive layer, and a second insulating layer on the conductive layer.
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Patent Agency Ranking
公开(公告)号：US11581280B2
公开(公告)日：2023-02-14
申请号：US17104968
申请日：2020-11-25
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David Gani
IPC: H01L23/00 , H01L23/498
Abstract: The present disclosure is directed to a wafer level chip scale package (WLCSP) with various combinations of contacts and Under Bump Metallizations (UBMs) having different structures and different amounts solder coupled to the contacts and UBMs. Although the contacts have different structures and the volume of solder differs, the total standoff height along the WLCSP remains substantially the same. Each portion of solder coupled to each respective contact and UBM includes a point furthest away from an active surface of a die of the WLCSP. Each point of each respective portion of solder is co-planar with each other respective point of the other respective portions of solder. Additionally, the contacts with various and different structures are positioned accordingly on the active surface of the die of the WLCSP.
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公开(公告)号：US11562937B2
公开(公告)日：2023-01-24
申请号：US17145028
申请日：2021-01-08
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yun Liu , David Gani
Abstract: A semiconductor package having a die with a sidewall protected by molding compound, and methods of forming the same are disclosed. The package includes a die with a first surface opposite a second surface and sidewalls extending between the first and second surfaces. A redistribution layer is formed on the first surface of each die. An area of the first surface of the die is greater than an area of the redistribution layer, such that a portion of the first surface of the die is exposed. When molding compound is formed over the die and the redistribution layer to form a semiconductor package, the molding compound is on the first surface of the die between an outer edge of the redistribution layer and an outer edge of the first surface. The molding compound is also on the sidewalls of the die, which provides protection against chipping or cracking during transport.
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公开(公告)号：US11270946B2
公开(公告)日：2022-03-08
申请号：US16987002
申请日：2020-08-06
Applicant: STMICROELECTRONICS PTE LTD
Inventor： Yong Chen , David Gani
IPC: H01L23/538 , H01L25/065 , H01L23/00
Abstract: The present disclosure is directed to a package that includes openings that extend into the package. The openings are filled with a conductive material to electrically couple a first die in the package to a second die in the package. The conductive material that fills the openings forms electrical interconnection bridges between the first die and the second die. The openings in the package may be formed using a laser and a non-doped molding compound, a doped molding compound, or a combination of doped or non-doped molding compounds.
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公开(公告)号：US11226399B2
公开(公告)日：2022-01-18
申请号：US16539295
申请日：2019-08-13
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David Gani
Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.
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公开(公告)号：US10422860B2
公开(公告)日：2019-09-24
申请号：US15818465
申请日：2017-11-20
Applicant: STMICROELECTRONICS PTE LTD
Inventor： David Gani
Abstract: A semiconductor package that is a proximity sensor includes a light transmitting die, a light receiving die, an ambient light sensor, a cap, and a substrate. The light receiving die and the light transmitting die are coupled to the substrate. The cap is coupled to the substrate forming a first chamber around the light transmitting die and a second chamber around the light receiving die. The cap further includes a recess with contact pads. The ambient light sensor is mounted within the recess of the cap and coupled to the contact pads. The cap includes electrical traces that are coupled to the contact pads within the recess coupling the ambient light sensor to the substrate. By utilizing a cap with a recess containing contact pads, a proximity sensor can be formed in a single semiconductor package all while maintaining a compact size and reducing the manufacturing costs of proximity sensors.
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