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    OPTO-MECHANICAL TRANSDUCER APPARATUS AND CORRESPONDING METHOD
    21.
    发明申请
    OPTO-MECHANICAL TRANSDUCER APPARATUS AND CORRESPONDING METHOD 有权

    公开(公告)号：US20210382332A1

    公开(公告)日：2021-12-09

    申请号：US17326955

    申请日：2021-05-21

    Applicant: STMicroelectronics S.r.l.

    Inventor： Luca Maggi ,  Mark Andrew Shaw

    IPC: G02F1/01 ,  H01L41/053

    Abstract: An embodiment apparatus comprises an optically transparent substrate having first and second surfaces; a piezoelectric membrane, arranged at the first surface, that oscillates in response to a light beam propagated through the substrate; at least one reflective facet facing the substrate and arranged at the piezoelectric membrane; and an optical element receiving the light beam at an input end and guiding the light beam towards an output end coupled to the second surface. The optical element incorporates a light focusing path focusing the light beam at a focal point at the piezoelectric membrane, and at least one light collimating path collimating the light beam onto the at least one reflective facet. The optical element guides light reflected from the at least one reflective facet to the input end, the reflected light indicating a position of the optical element with respect to the focal point.

    Optical integrated circuit systems, devices, and methods of fabrication
    22.
    发明授权
    Optical integrated circuit systems, devices, and methods of fabrication 有权

    公开(公告)号：US10714468B2

    公开(公告)日：2020-07-14

    申请号：US16279092

    申请日：2019-02-19

    Applicant: STMicroelectronics S.r.l.

    Inventor： Luca Maggi ,  Piero Orlandi

    IPC: H01L23/60 ,  G02B6/13 ,  H02H9/04 ,  H01L23/02 ,  G02B6/122 ,  H01L27/02 ,  G02B6/12

    Abstract: An optical integrated circuit device includes a semiconductor substrate and a first waveguide made of a first material and disposed over the semiconductor substrate. The first waveguide includes a parallel region and a tapered region. The optical integrated circuit device further includes a first cladding structure disposed over and surrounding the parallel region of the first waveguide, a first extension made of the first material and disposed over the semiconductor substrate, and an electrostatic discharge (ESD) protection structure electrically coupled to the first extension. The first extension physically contacts the parallel region of the first waveguide. The first extension includes a first portion within the first cladding structure and a second portion outside the first cladding structure.

    System for coupling light to integrated devices and corresponding method
    23.
    发明授权
    System for coupling light to integrated devices and corresponding method 有权

    公开(公告)号：US10677993B2

    公开(公告)日：2020-06-09

    申请号：US15078785

    申请日：2016-03-23

    Applicant: STMicroelectronics S.r.l.

    Inventor： Luca Maggi ,  Marco Piazza ,  Giuseppe Cusmai

    IPC: G02B6/32 ,  G02B6/34 ,  G02B6/30 ,  G02B6/293

    Abstract: System for coupling light to integrated devices, comprising a grating coupler which couples light, such as light from a light source, into an optic fiber. The system includes an optic subsystem comprising a transmitter portion receiving the light emitted by the grating coupler and a receiver portion receiving light from the transmitter and focusing the light into the integrated device, the transmitter portion being configured to modify an angle distribution of the light emitted by the grating coupler and the receiving portion being configured to focus the light with modified angle distribution into the integrated device.

    Optical Integrated Circuit Systems, Devices, and Methods of Fabrication
    24.
    发明申请
    Optical Integrated Circuit Systems, Devices, and Methods of Fabrication 审中-公开

    公开(公告)号：US20200013771A1

    公开(公告)日：2020-01-09

    申请号：US16279092

    申请日：2019-02-19

    Applicant: STMicroelectronics S.r.l.

    Inventor： Luca Maggi ,  Piero Orlandi

    IPC: H01L27/02 ,  G02B6/13 ,  G02B6/122 ,  H02H9/04 ,  H01L23/60

    Abstract: An optical integrated circuit device includes a semiconductor substrate and a first waveguide made of a first material and disposed over the semiconductor substrate. The first waveguide includes a parallel region and a tapered region. The optical integrated circuit device further includes a first cladding structure disposed over and surrounding the parallel region of the first waveguide, a first extension made of the first material and disposed over the semiconductor substrate, and an electrostatic discharge (ESD) protection structure electrically coupled to the first extension. The first extension physically contacts the parallel region of the first waveguide. The first extension includes a first portion within the first cladding structure and a second portion outside the first cladding structure.

    Method of Producing a Device for Adiabatic Coupling, Corresponding Device and System
    25.
    发明申请
    Method of Producing a Device for Adiabatic Coupling, Corresponding Device and System 审中-公开

    公开(公告)号：US20190369341A1

    公开(公告)日：2019-12-05

    申请号：US16428428

    申请日：2019-05-31

    Applicant: STMicroelectronics S.r.l.

    Inventor： Mark Andrew Shaw ,  Luca Maggi ,  Antonio Fincato

    IPC: G02B6/42 ,  G02B6/122

    Abstract: A method includes providing a semiconductor body comprising a surface with a recessed portion therein. The recessed portion includes a bottom surface. Optical waveguide cores in a first array of optical waveguide cores extend side-by-side at the bottom surface. The method further includes providing a second array of optical waveguide cores over the first array of optical waveguide cores. Optical waveguide cores in the second array of optical waveguide cores extend side-by-side. Each optical waveguide core in the second array of optical waveguide cores is in an adiabatic coupling relationship with a corresponding optical waveguide core in the first array of optical waveguide cores. The method also includes applying an optical waveguide cladding material over the second array of optical waveguide cores.

    SEMICONDUCTOR INTEGRATED DEVICE ASSEMBLY PROCESS
    29.
    发明申请
    SEMICONDUCTOR INTEGRATED DEVICE ASSEMBLY PROCESS 有权
    半导体集成器件组装工艺

    公开(公告)号：US20130214368A1

    公开(公告)日：2013-08-22

    申请号：US13772210

    申请日：2013-02-20

    Applicant: STMicroelectronics Ltd (Malta) ,  STMicroelectronics S.r.l.

    Inventor： Kenneth Fonk ,  Luca Maggi ,  Jeremy Spiteri

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0045 ,  B81B2201/0264 ,  B81B2207/012 ,  B81C1/00238 ,  B81C1/00325 ,  B81C2203/0785 ,  B81C2203/0792 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A process for assembly of an integrated device, envisages: providing a first body of semiconductor material integrating at least one electronic circuit and having a top surface; providing a second body of semiconductor material integrating at least one microelectromechanical structure and having a bottom surface; and stacking the second body on the first body with the interposition, between the top surface of the first body and the bottom surface of the second body, of an elastic spacer material. Prior to the stacking step, the step is envisaged of providing, in an integrated manner, at the top surface of the first body a confinement and spacing structure that confines inside it the elastic spacer material and supports the second body at a distance from the first body during the stacking step.

    Abstract translation: 集成装置的组装方法设想：提供集成至少一个电子电路并具有顶表面的第一半导体材料体; 提供集成至少一个微机电结构并具有底表面的第二半导体材料; 并且在所述第一主体的顶表面和所述第二主体的所述底表面之间插入所述第一主体上的所述第二主体的弹性间隔件材料。 在层叠步骤之前，该步骤被设想为以第一体积的方式在第一体的顶表面处提供约束和间隔结构，该限制和间隔结构在其内部限定弹性间隔物材料，并且将第二体与第一体 身体在堆叠步骤。

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