公开(公告)号：US20200328530A1

公开(公告)日：2020-10-15

申请号：US16739177

申请日：2020-01-10

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ju Hyoung PARK ,  Sung Yong AN ,  Myeong Woo HAN ,  Sung Nam CHO ,  Jae Yeong KIM

IPC: H01Q21/06

Abstract: A chip antenna module includes: a first dielectric layer; a first feed via extending through the first dielectric layer; a second feed via extending through the first dielectric layer; a first patch antenna pattern disposed on an upper surface of the first dielectric layer, electrically connected to the first feed via, and having a through-hole through which the second feed via passes; a second patch antenna pattern disposed above the first patch antenna pattern and electrically connected to the second feed via; and a second dielectric layer and a third dielectric layer, respectively located vertically between the first patch antenna pattern and the second patch antenna pattern, and having different dielectric constants that form a first dielectric constant boundary surface between the first and second patch antenna patterns.

公开(公告)号：US20150015359A1

公开(公告)日：2015-01-15

申请号：US14330817

申请日：2014-07-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hak Kwan KIM ,  Sang Kyun KWON ,  Sung Jae LEE ,  Sung Yong AN

IPC: H01F27/255 ,  B22F1/00 ,  B22F3/14

CPC classification number: H01F27/255 ,  B22F1/007 ,  B22F3/14 ,  B22F2003/145 ,  C22C33/0228 ,  H01F1/24 ,  H01F3/08 ,  H01F41/0246

Abstract: Disclosed herein are a soft magnetic composite including an insulating layer formed along an inter-particle boundary of a soft magnetic core metal powder, a method for preparing the same, and electronic components including the same as a core material.The soft magnetic composite according to the present invention may include the insulating layer formed along the inter-particle boundary of the soft magnetic core metal particles, such that damage to a coating film caused by a molding of the existing soft magnetic powder having the insulation coating film formed therein may be prevented, whereby an eddy current loss may be minimized.

Abstract translation: 本文公开了一种软磁性复合材料，其包括沿着软磁芯金属粉末的颗粒间边界形成的绝缘层，其制备方法以及包含该芯材的电子部件。 根据本发明的软磁性复合体可以包括沿软磁芯金属颗粒的颗粒间边界形成的绝缘层，使得由具有绝缘涂层的现有软磁性粉末的模制而导致的涂膜损伤 可以防止在其中形成的膜，从而可以使涡流损耗最小化。

公开(公告)号：US20140265716A1

公开(公告)日：2014-09-18

申请号：US13897174

申请日：2013-05-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hak Kwan KIM ,  Sung Yong AN ,  No Il PARK ,  Dong Hyeok CHOI

IPC: H01F3/08 ,  H02K1/00

CPC classification number: H01F3/08 ,  B22F1/0062 ,  B22F1/02 ,  H02K1/02 ,  H02K1/04

Abstract: There is provided a soft magnetic core including: soft magnetic powder particles having an insulating coating layer formed on surfaces thereof and metal powder particles positioned between the soft magnetic powder particles.

Abstract translation: 提供了一种软磁芯，其包括：在其表面上形成有绝缘涂层的软磁性粉末颗粒和位于软磁性粉末颗粒之间的金属粉末颗粒。

公开(公告)号：US20140239219A1

公开(公告)日：2014-08-28

申请号：US14273118

申请日：2014-05-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Sung Yong AN ,  Myeong Gi KIM ,  Ic Seob KIM

IPC: H01F1/01

CPC classification number: H01F1/01 ,  H01F1/33 ,  H01F1/36 ,  H01F17/04 ,  H01F27/255

Abstract: Disclosed herein are a ferrite powder having a core-shell structure, the core being made of iron (Fe) or iron-based compounds comprising iron (Fe) and the shell being made of metal oxides, a ferrite material comprising the ferrite powder and the glass, and multilayered chip components including the ferrite layer using the ferrite material, inner electrodes, and outer electrodes. According to the exemplary embodiments of the present invention, it is possible to provide the ferrite material capable of improving the change in the inductance L value in response to applied current by suppressing magnetization at high current. The multilayered chip components including the ferrite material according to the exemplary embodiment of the present invention can also be used in a band of MHz.

Abstract translation: 本发明公开了一种具有核 - 壳结构的铁氧体粉末，该芯由铁（Fe）或铁（Fe）构成的铁基化合物和壳由金属氧化物制成，铁氧体材料包含铁氧体粉末和 玻璃和多层芯片部件，包括使用铁氧体材料的铁氧体层，内部电极和外部电极。 根据本发明的示例性实施例，可以提供能够通过抑制高电流下的磁化来响应于施加的电流来改进电感L值的变化的铁氧体材料。 包括根据本发明的示例性实施例的铁氧体材料的多层芯片组件也可以用于MHz频带。

公开(公告)号：US20140152245A1

公开(公告)日：2014-06-05

申请号：US13767065

申请日：2013-02-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD

Inventor： Kang Ryong CHOI ,  Seung Min KIM ,  Sung Yong AN ,  Chang Ryul JUNG

IPC: H05K9/00 ,  H04B5/00 ,  H02J7/00

CPC classification number: H04B5/0037 ,  H02J7/0042 ,  H02J7/025 ,  H02J50/10 ,  H02J50/90

Abstract: There is provided a contactless power receiver including a receiving coil part formed on a substrate, a magnetic receiving sheet positioned on the receiving coil part, a power storing part positioned on the magnetic receiving sheet, and a shielding layer positioned on the power storing part.

Abstract translation: 提供了一种非接触式电力接收器，包括形成在基板上的接收线圈部分，位于接收线圈部分上的磁性接收片，位于磁性接收片上的电力存储部分和位于电力存储部分上的屏蔽层。

公开(公告)号：US20220085485A1

公开(公告)日：2022-03-17

申请号：US17536406

申请日：2021-11-29

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Ji Hyung JUNG ,  Sung Yong AN

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/38

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.

公开(公告)号：US20210384633A1

公开(公告)日：2021-12-09

申请号：US17405286

申请日：2021-09-01

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Chin Mo KIM ,  Ji Hyung JUNG ,  Sung Nam CHO ,  Sung Yong AN

IPC: H01Q9/04 ,  H01Q1/48 ,  H01Q1/38

Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.

公开(公告)号：US20210175612A1

公开(公告)日：2021-06-10

申请号：US17177512

申请日：2021-02-17

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jae Yeong KIM ,  Sung Yong AN ,  Chang Hak CHOI

IPC: H01Q1/24 ,  H01Q1/52 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/22 ,  H01Q21/00 ,  H01Q21/28 ,  H01Q21/06 ,  H01Q9/04

Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.

公开(公告)号：US20210151899A1

公开(公告)日：2021-05-20

申请号：US16822867

申请日：2020-03-18

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ju Hyoung PARK ,  Young Sik HUR ,  Sung Yong AN ,  Myeong Woo HAN ,  Kyu Bum HAN ,  Dae Ki LIM

IPC: H01Q21/06 ,  H01Q1/22

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

公开(公告)号：US20210143527A1

公开(公告)日：2021-05-13

申请号：US17151952

申请日：2021-01-19

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Sung Nam CHO ,  Sung Yong AN ,  Jae Yeong KIM ,  Ju Hyoung PARK

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/24

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.