公开(公告)号：US20190363458A1

公开(公告)日：2019-11-28

申请号：US16537919

申请日：2019-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungmin PARK ,  Byungchul KIM ,  Hyunjin KIM ,  Kwanghyun BAEK ,  Youngju LEE ,  Jinsu HEO

IPC: H01Q21/29 ,  H01Q19/10 ,  H01Q15/14 ,  H01Q1/52 ,  H01Q1/22

Abstract: An antenna device for providing a higher data transmission rate in a wireless communication system is provided. The antenna device includes a first radiating body mounted to a side surface of a multiple layer circuit board to transmit and receive a wireless signal and a second radiating body mounted to a top surface of the multiple layer circuit board and electrically connected to the first radiating body to transmit and receive the wireless signal together with the first radiating body.

公开(公告)号：US20190094196A1

公开(公告)日：2019-03-28

申请号：US16137026

申请日：2018-09-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungmin PARK ,  Byungchul KIM ,  Youngju LEE ,  Dongkyu CHOI ,  Junghwan CHOI ,  Seungku HAN

IPC: G01N33/00 ,  H04B17/391 ,  G01S7/48 ,  H04B17/10

Abstract: A method for identifying radio signal transmission characteristics in a wireless communication system and an apparatus therefor are provided. The method may include identifying a signal transmission site, identifying a signal reception site, finding an area where a tree is present between the signal transmission site and the signal reception site, checking characteristics of the crown of the tree and characteristics of the trunk of the tree, and examining transmission characteristics of a radio signal sent from the signal transmission site to the signal reception site on the basis of the characteristics of the crown and the trunk. The method and apparatus relate to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for internet of things (IoT), and may be applied to intelligent services based on the 5G communication and the IoT-related technologies.

公开(公告)号：US20170193593A1

公开(公告)日：2017-07-06

申请号：US15399135

申请日：2017-01-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inhak NA ,  Byungchul KIM ,  Sang-Jun MOON ,  Sin-Seok SEO ,  Sanghyun CHANG ,  Daekyu CHOI

IPC: G06Q30/06 ,  H04W4/02

CPC classification number: G06Q30/0639 ,  H04W4/023 ,  H04W4/025 ,  H04W4/70 ,  H04W88/08

Abstract: The present disclosure relates to a sensor network, Machine Type Communication (MTC), Machine-to-Machine (M2M) communication, and technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the above technologies, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The present disclosure may be used for intelligent services (smart home, smart building, smart city, smart car or connected car, healthcare, digital education, retail, security and safety-related service, and the like) on the basis of the technology. The present disclosure provides an appropriate service by reflecting the location information of a user within a store in real or substantially real time. A method of operating a server device according to an example embodiment comprises: receiving at least one of distance information and direction information of the terminal device; determining a location of the terminal device using at least one of the distance information and the direction information; determining a target product based on the location of the terminal device; and transmitting service information related to the target product to the terminal device.

公开(公告)号：US20240413129A1

公开(公告)日：2024-12-12

申请号：US18626034

申请日：2024-04-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonsik CHOI ,  Byungchul KIM ,  Yoonsuk LEE ,  Mingyu LEE ,  Seungryong HAN

IPC: H01L25/075 ,  H01L21/683

Abstract: A transfer substrate for a light emitting diode is provided. The transfer substrate includes a substrate, a laser ablation layer provided to the substrate, and an adhesive layer provided on the laser ablation layer and attached with a plurality of light emitting diodes, and the laser ablation layer and the adhesive layer may be divided into a plurality of portions corresponding to the plurality of light emitting diodes.

公开(公告)号：US20230198167A1

公开(公告)日：2023-06-22

申请号：US18109607

申请日：2023-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsub KIM ,  Junsig KUM ,  Seungtae KO ,  Byungchul KIM ,  Yoongeon KIM ,  Seungho CHOI ,  Jungmin PARK ,  Youngju LEE

IPC: H01Q21/24 ,  H01Q1/24 ,  H01Q9/04

CPC classification number: H01Q21/24 ,  H01Q1/248 ,  H01Q9/045 ,  H01Q9/0442

Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments of the disclosure, an antenna module in a wireless communication system may include: a plurality of antenna elements; a first antenna substrate; a second antenna substrate; and a Printed Circuit Board (PCB). A first side of the first antenna substrate may be coupled to each of the plurality of antenna elements, and a second side of the first antenna substrate opposite to the first side of the first antenna substrate may be coupled to the PCB. A first side of the second antenna substrate may be coupled to each of the plurality of antenna elements, and a second side of the second antenna substrate opposite to the first side of the second antenna substrate may be coupled to the PCB. A face between the first side of the first antenna substrate and the second side of the first antenna substrate may face a face between the first side of the second antenna substrate and the second side of the second antenna substrate.

公开(公告)号：US20220382624A1

公开(公告)日：2022-12-01

申请号：US17885216

申请日：2022-08-10

Applicant: Samsung Electronics Co., LTD.

Inventor： Byungchul KIM ,  Kiseok KIM ,  Mingyu KIM ,  Jaemin OH ,  Sanghyun LEE

IPC: G06F11/07 ,  G06F9/4401

Abstract: The present disclosure refers to apparatuses and methods for initializing electronic devices. An electronic device according to various embodiments includes a memory, and a processor operatively connected to the memory. The processor is configured to record, in the memory, software binaries received from an external device during a download mode. The processor is further configured to, when the download mode has ended, perform booting in a normal mode using a bootloader based on a determination indicating that a predetermined software binary is present among the software binaries recorded in the memory, and perform booting in a recovery mode using the bootloader based on the determination indicating that the predetermined software binary is absent from among the software binaries recorded in the memory.

公开(公告)号：US20220375907A1

公开(公告)日：2022-11-24

申请号：US17880027

申请日：2022-08-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wonsik CHOI ,  Doyoung KWAG ,  Byungchul KIM ,  Sangmoo PARK

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/00

Abstract: A method for manufacturing a display module includes the steps of: transferring LEDs of a substrate to a first relay substrate; transferring the LEDs of the first relay substrate to a second relay substrate in a primary stretch array such that a gap between adjacent LEDs on the second relay substrate is greater than a gap between adjacent LEDs on the first relay substrate in one direction from among a row direction and a column direction; and transferring the LEDs of the second relay substrate to a target substrate in a secondary stretch array such that a gap between adjacent LEDs on the target substrate is greater than a gap between adjacent LEDs on the second relay substrate in a remaining direction from among the row direction and the column direction.

公开(公告)号：US20210034354A1

公开(公告)日：2021-02-04

申请号：US16981489

申请日：2019-03-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jongho LEE ,  Heechae YOON ,  Byungchul KIM ,  Jiseong LEE ,  Junghoon CHO

IPC: G06F8/65 ,  G06F8/71 ,  G06F9/4401 ,  G06F12/06

Abstract: An electronic device according to various embodiments of the present invention comprises: a first memory including a boot area, a kernel area, and a recovery area; a second memory configured to load data corresponding to at least one from among the boot area, the kernel area, and the recovery area included in the first memory; a communication module; and a processor electrically connected to the communication module, the first memory, and the second memory. The first memory includes instructions that cause, when executed, the processor to: download data in the first memory through the communication module; when there is a request for updating the downloaded data, perform rebooting; when performing the rebooting, confirm whether a new version of recovery data is included in the downloaded data; and when the new version of recovery data is included in the data, update the downloaded data on the basis of the new version of recovery data. Thus, by reducing procedures unnecessarily repeated in the process of updating data, it is possible to rapidly and easily update data. Additionally, other embodiments are possible.

公开(公告)号：US20200343297A1

公开(公告)日：2020-10-29

申请号：US16861728

申请日：2020-04-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul KIM ,  Doyoung KWAG ,  Eunhye Kim ,  Sangmoo PARK ,  Minsub OH ,  Dongyeob LEE ,  Yoonsuk LEE

IPC: H01L27/15 ,  H01L33/00 ,  H01L33/38

Abstract: A micro light emitting diode (LED) transferring method includes setting a micro LED transfer substrate and a target substrate to initial positions and transferring a plurality of micro LEDs arranged in a partial region of the micro LED transfer substrate to the target substrate. Once the micro LEDs in the partial region are transferred to the target substrate, the micro LED transfer substrate is rotated and a plurality of micro LEDs, arranged in a remaining region of the micro LED transfer substrate, are then transferred to the target substrate.

公开(公告)号：US20200313035A1

公开(公告)日：2020-10-01

申请号：US16832884

申请日：2020-03-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yoonsuk LEE ,  Sangmoo PARK ,  Doyoung KWAG ,  Byungchul KIM ,  Eunhye KIM ,  Minsub OH ,  Dongyeob LEE

IPC: H01L33/00 ,  H01L33/62

Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.