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公开(公告)号:US20240030935A1
公开(公告)日:2024-01-25
申请号:US18480261
申请日:2023-10-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changkyu SEOL , Jiyoup KIM , Hyejeong SO , Myoungbo KWAK , Pilsang YOON , Sucheol LEE , Youngdon CHOI , Junghwan CHOI
IPC: H03M7/14
CPC classification number: H03M7/14 , G06F13/1673
Abstract: Encoding and decoding apparatuses and methods for implementing multi-mode coding are provided. The apparatus includes a transmitter and a receiver connected to a data bus. When data bursts are converted by the transmitter into codewords each including a plurality of symbols and/or a codeword received by the receiver is recovered as data bursts, maximum transition avoidance (MTA) codeword mappings in which no maximum transition (MT) event occurs between the plurality of symbols and minimum DC current (MDC) codeword mappings related to minimum power consumption of the plurality of symbols are used.
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公开(公告)号:US20230185754A1
公开(公告)日:2023-06-15
申请号:US17899883
申请日:2022-08-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Eunseok SHIN , Woochul JUNG , Jungho KO , Myoungbo KWAK , Jaewoo PARK , Sunjae LIM , Junghwan CHOI
CPC classification number: G06F13/4204 , H03M9/00 , G06F13/4282 , H03K17/6871
Abstract: A parallel-to-serial interface circuit includes an equalizer to delay odd data by a half period and sequentially generate odd pre data, odd main data, and odd post data, and delay even data by a half period and sequentially generate even pre data, even main data, and even post data, a final parallel-to-serial converter to sequentially and alternately select the even pre data and the odd pre data to generate pre data, sequentially and alternately select inverted odd main data and inverted even main data to generate inverted main data, and sequentially and alternately select the even post data and the odd post data to generate post data, and a driver to drive the pre data to generate a pre data level, drive the inverted main data to generate an inverted main data level, and drive the post data to generate a post data level.
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公开(公告)号:US20230072675A1
公开(公告)日:2023-03-09
申请号:US17695168
申请日:2022-03-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Mingyu LEE , Youngchul CHO , Seungjin PARK , Youngdon CHOI , Junghwan CHOI
Abstract: A clock signal delay path unit includes a first delay cell including a first root signal line for delaying and transmitting a clock signal, a first repeater to transmit the clock signal transmitted through the first root signal line without signal attenuation, and a second root signal line for delaying and transmitting the clock signal output from the first repeater, a second delay cell including a first inverting circuit configured to invert the clock signal provided from the first delay cell to generate an inverted clock signal, and a third delay cell including a first branch signal line for delaying and transmitting the inverted clock signal provided from the second delay cell, a second repeater to transmit the inverted clock signal transmitted through the first branch signal line, and a second branch signal line for delaying and transmitting the inverted clock signal output from the second repeater.
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公开(公告)号:US20220294476A1
公开(公告)日:2022-09-15
申请号:US17689462
申请日:2022-03-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changkyu SEOL , Jiyoup KIM , Hyejeong SO , Myoungbo KWAK , Pilsang YOON , Sucheol LEE , Youngdon CHOI , Junghwan CHOI
Abstract: Encoding and decoding apparatuses and methods for implementing multi-mode coding are provided. The apparatus includes a transmitter and a receiver connected to a data bus. When data bursts are converted by the transmitter into codewords each including a plurality of symbols and/or a codeword received by the receiver is recovered as data bursts, maximum transition avoidance (MTA) codeword mappings in which no maximum transition (MT) event occurs between the plurality of symbols and minimum DC current (MDC) codeword mappings related to minimum power consumption of the plurality of symbols are used.
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公开(公告)号:US20220190936A1
公开(公告)日:2022-06-16
申请号:US17366329
申请日:2021-07-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyungmin JIN , Younghoon SON , Hyunyoon CHO , Youngdon CHOI , Junghwan CHOI
Abstract: A translation device, a test system, and a memory system are provided. The translation device includes plural first input/output (I/O) circuits that respectively transmit and receive first signals through plural pins based on a pulse amplitude modulation (PAM)-M mode, a second I/O circuit that transmits and receives a second signal through one or more pins based on a PAM-N mode, and a translation circuit that translates the first signals into the second signal and translates the second signal into the first signals. M and N are different integers of 2 or more.
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公开(公告)号:US20220068332A1
公开(公告)日:2022-03-03
申请号:US17344610
申请日:2021-06-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sucheol LEE , Jaewoo PARK , Younghoon SON , Youngdon CHOI , Junghwan CHOI
IPC: G11C7/22 , G11C7/10 , H03K19/017 , H03K19/1776 , H03K19/17736
Abstract: A memory device includes a memory cell array and a data input and output circuit configured to output a data signal (DQ signal) including data read from the memory cell array and a data strobe signal (DQS signal) including a toggle pattern associated with an operating condition of the memory device based on n-level pulse amplitude modulation (PAMn), wherein n is an integer greater than or equal to 4.
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公开(公告)号:US20250080135A1
公开(公告)日:2025-03-06
申请号:US18953753
申请日:2024-11-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changkyu SEOL , Jiyoup KIM , Hyejeong SO , Myoungbo KWAK , Pilsang YOON , Sucheol LEE , Youngdon CHOI , Junghwan CHOI
Abstract: Encoding and decoding apparatuses and methods for implementing multi-mode coding are provided. The apparatus includes a transmitter and a receiver connected to a data bus. When data bursts are converted by the transmitter into codewords each including a plurality of symbols and/or a codeword received by the receiver is recovered as data bursts, maximum transition avoidance (MTA) codeword mappings in which no maximum transition (MT) event occurs between the plurality of symbols and minimum DC current (MDC) codeword mappings related to minimum power consumption of the plurality of symbols are used.
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公开(公告)号:US20240203466A1
公开(公告)日:2024-06-20
申请号:US18230776
申请日:2023-08-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junyoung PARK , Garam KIM , Joohwan KIM , Jindo BYUN , Eunseok SHIN , Hyunyoon CHO , Junghwan CHOI
IPC: G11C7/10 , H03K19/017
CPC classification number: G11C7/1066 , G11C7/1063 , H03K19/01742
Abstract: A transmitter configured to receive first to N-th data in parallel and sequentially output the first to N-th data in response to first to N-th clock signals having different phases from each other, where N is an integer of at least 2, the transmitter including first to N-th data selectors including a first data selector and a second data selector in correspondence to the first to N-th data, each of the first to N-th data selectors being configured to perform a logical operation on one of the first to N-th data and the first to N-th clock signals and output a plurality of data selection signals, a first pre-driver in correspondence to at least two data selectors among the first to N-th data selectors, the first pre-driver being configured to receive the plurality of data selection signals from the at least two data selectors.
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公开(公告)号:US20240055395A1
公开(公告)日:2024-02-15
申请号:US18206201
申请日:2023-06-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Manho LEE , Jungmin SEO , Kwangseob SHIN , Woosin CHOI , Junghwan CHOI
IPC: H01L25/065 , H01L23/00 , H10B80/00
CPC classification number: H01L25/0652 , H01L24/49 , H10B80/00 , H01L2225/06506 , H01L2225/0651 , H01L2225/06562 , H01L2224/49052 , H01L2224/49096
Abstract: A buffer chip is wire-bonded to memory dies. A semiconductor package includes a semiconductor die stack, a first set of wire bonds connected to a first set of semiconductor dies, a second set of wire bonds connected to a second set of semiconductor dies, and the buffer chip. The second set of semiconductor dies are on the first set of semiconductor dies. The buffer chip includes a first set of die bond pads being close to the semiconductor die stack, and a second set of die bond pads being distant from the semiconductor die stack. The second set of wire bonds extends to the first set of die bond pads of the buffer chip, and the first set of wire bonds extends to the second set of die bond pads of the buffer chip.
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公开(公告)号:US20230045744A1
公开(公告)日:2023-02-09
申请号:US17709853
申请日:2022-03-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jinook JUNG , Jaewoo PARK , Junhan CHOI , Myoungbo KWAK , Junghwan CHOI
IPC: G05F1/575 , G11C11/4074 , G11C11/4093 , G11C11/4076
Abstract: Disclosed is a low dropout regulator which includes a first resistor, a first transistor including a gate terminal connected with a first end of the first resistor, a source terminal connected with a power supply voltage terminal, and a drain terminal connected with a first node, an operational amplifier including input terminals respectively connected with a reference voltage and the first node and an output terminal, a second transistor including a gate terminal connected with the output terminal of the operational amplifier, a source terminal connected with the first node, and a drain terminal connected with a second node, a third transistor including a gate terminal connected with a second end of the first resistor, a source terminal connected with the power supply voltage terminal, and a drain terminal connected with a third node, and a current source connected between the second node and a ground voltage terminal.
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