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公开(公告)号:USD930606S1
公开(公告)日:2021-09-14
申请号:US29758792
申请日:2020-11-18
Applicant: Samsung Electronics Co., Ltd.
Designer: Seungho Lee , Jaewook Yoo , Eunah Kim , Jangho Kim
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公开(公告)号:USD922342S1
公开(公告)日:2021-06-15
申请号:US29685225
申请日:2019-03-27
Applicant: Samsung Electronics Co., Ltd.
Designer: Seungho Lee , Jaewook Yoo , Eunah Kim , Jangho Kim
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公开(公告)号:US20210074691A1
公开(公告)日:2021-03-11
申请号:US16874722
申请日:2020-05-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minho Lee , Jaewook Yoo
IPC: H01L25/10 , H01L23/498 , H01L23/544 , H01L23/13 , H01L23/31 , H01L21/48 , H01L25/00
Abstract: Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.
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公开(公告)号:USD828313S1
公开(公告)日:2018-09-11
申请号:US29595247
申请日:2017-02-27
Applicant: Samsung Electronics Co., Ltd.
Designer: Seungho Lee , Jaewook Yoo , Jaeneung Lee
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公开(公告)号:USD819614S1
公开(公告)日:2018-06-05
申请号:US29595062
申请日:2017-02-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Seungho Lee , Jaewook Yoo , Jaeneung Lee
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公开(公告)号:USD760678S1
公开(公告)日:2016-07-05
申请号:US29494709
申请日:2014-06-24
Applicant: Samsung Electronics Co., Ltd.
Designer: Chulyong Cho , Jaewook Yoo
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公开(公告)号:USD1042378S1
公开(公告)日:2024-09-17
申请号:US29842119
申请日:2022-06-10
Applicant: Samsung Electronics Co., Ltd.
Designer: Jaewook Yoo , Ji-Gwang Kim , Daehun Jung , Byungmin Woo
Abstract: FIG. 1 is a front perspective view of a television receiver showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the encircled portion 9 in FIG. 1;
FIG. 10 is an enlarged view of the encircled portion 10 in FIG. 1;
FIG. 11 is an enlarged view of the encircled portion 11 in FIG. 2;
FIG. 12 is an enlarged view of the encircled portion 12 in FIG. 2;
FIG. 13 is an enlarged view of the encircled portion 13 in FIG. 3;
FIG. 14 is an enlarged view of the encircled portion 14 in FIG. 3;
FIG. 15 is an enlarged view of the encircled portion 15 in FIG. 3;
FIG. 16 is an enlarged view of the encircled portion 16 in FIG. 3;
FIG. 17 is an enlarged view of the encircled portion 17 in FIG. 4;
FIG. 18 is an enlarged view of the encircled portion 18 in FIG. 6;
FIG. 19 is an enlarged view of the encircled portion 19 in FIG. 7; and,
FIG. 20 is an enlarged view of the encircled portion 20 in FIG. 8.
The evenly-dashed broken lines in the figures depict environmental subject matter and form no part of the claimed design. The dot-dash broken lines encircling portions of the claimed design that are illustrated in enlargements form no part of the claimed design.-
公开(公告)号:USD1035601S1
公开(公告)日:2024-07-16
申请号:US29842086
申请日:2022-06-10
Applicant: Samsung Electronics Co., Ltd.
Designer: Jaewook Yoo , Ji-Gwang Kim , Daehun Jung , Byungmin Woo
Abstract: FIG. 1 is a front perspective view of a television receiver showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the encircled portion 9 in FIG. 1;
FIG. 10 is an enlarged view of the encircled portion 10 in FIG. 1;
FIG. 11 is an enlarged view of the encircled portion 11 in FIG. 2;
FIG. 12 is an enlarged view of the encircled portion 12 in FIG. 2;
FIG. 13 is an enlarged view of the encircled portion 13 in FIG. 3;
FIG. 14 is an enlarged view of the encircled portion 14 in FIG. 3;
FIG. 15 is an enlarged view of the encircled portion 15 in FIG. 4;
FIG. 16 is an enlarged view of the encircled portion 16 in FIG. 6;
FIG. 17 is an enlarged view of the encircled portion 17 in FIG. 7;
FIG. 18 is an enlarged view of the encircled portion 18 in FIG. 8; and,
FIG. 19 is an enlarged view of the encircled portion 9 in FIG. 8.
The evenly-dashed broken lines in the figures depict environmental subject matter and form no part of the claimed design. The dot-dash broken line circles depict the limits of the enlarged views and form no part of the claimed design.-
公开(公告)号:USD1008202S1
公开(公告)日:2023-12-19
申请号:US29795005
申请日:2021-06-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Sinwi Moon , Jaewook Yoo , Daehun Jung , Byungmin Woo , Dongwook Kim , Jeewon Kim
Abstract: FIG. 1 is a front perspective view of a television, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left-side view thereof;
FIG. 5 is a right-side view thereof;
FIG. 6 is a top view thereof;
FIG. 7 is a bottom view thereof;
FIG. 8 is a rear perspective view thereof;
FIG. 9 is an enlarged view of the portion 9 in FIG. 1;
FIG. 10 is an enlarged view of the portion 10 in FIG. 1;
FIG. 11 is an enlarged view of the portion 11 in FIG. 1;
FIG. 12 is an enlarged view of the portion 12 in FIG. 2;
FIG. 13 is an enlarged view of the portion 13 in FIG. 3;
FIG. 14 is an enlarged view of the portion 14 in FIG. 4;
FIG. 15 is an enlarged view of the portion 15 in FIG. 5;
FIG. 16 is an enlarged view of the portion 16 in FIG. 6;
FIG. 17 is an enlarged view of the portion 17 in FIG. 7;
FIG. 18 is an enlarged view of the portion 18 in FIG. 8; and,
FIG. 19 is an exploded front perspective view thereof.
The even-dash broken lines illustrating portions of the television form no part of the claimed design. The dot-dot-dash broken lines encircling enlargement portions of the claimed design form no part of the claimed design.-
公开(公告)号:US20230223387A1
公开(公告)日:2023-07-13
申请号:US18185526
申请日:2023-03-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Minho Lee , Jaewook Yoo
IPC: H01L25/10 , H01L21/48 , H01L23/544 , H01L23/498 , B81C99/00 , H01L25/075 , H01L25/065 , H01L25/00 , H01L23/31 , H01L23/13 , H01L25/16 , H01L25/04 , H01L25/07
CPC classification number: H01L25/105 , H01L21/4857 , H01L23/544 , H01L23/49838 , B81C99/007 , H01L25/0756 , H01L25/0657 , H01L25/50 , H01L23/3128 , H01L23/49816 , H01L23/13 , H01L25/162 , H01L25/043 , H01L25/074 , H01L2224/0213 , H01L2224/75753 , H01L2225/1035 , H01L2223/5442 , H01L2224/0217 , H01L2224/0224 , H01L2225/1058 , H01L2223/54426
Abstract: Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.
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