公开(公告)号：US5841191A

公开(公告)日：1998-11-24

申请号：US837530

申请日：1997-04-21

申请人： Chok J. Chia ,  Qwai H. Low ,  Maniam Alagaratnam

发明人： Chok J. Chia ,  Qwai H. Low ,  Maniam Alagaratnam

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/50 ,  H01L23/52 ,  H01L23/48

CPC分类号： H01L24/49 ,  H01L23/50 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107

摘要： A ball grid array package in which one or more conductive rings are positioned on a surface of the package substrate along with solder bond contacts on the surface of the substrate to facilitate the interconnection of wire bonds to an integrated circuit chip on the surface of the substrate. The use of rings allows for better distribution of power to the chip since a plurality of wires can be connected between the chip and the conductive rings for power distribution. The rings create a different shelf for the power and ground bonds on the substrate, and by providing a vertical separation between the surfaces of the rings and bonding pads on the surface of the substrate more bonds in the package can be accommodated.

摘要翻译： 一种球栅阵列封装，其中一个或多个导电环与衬底表面上的焊料接合位置一起定位在封装衬底的表面上，以便于引线键合到衬底表面上的集成电路芯片 。 由于可以在芯片和用于配电的导电环之间连接多根导线，所以使用环允许更好地将功率分配到芯片。 这些环形成不同的搁板，用于基板上的电源和接地键，并且通过在环的表面和衬底表面上的接合焊盘之间提供垂直间隔，可以容纳封装中更多的接合。

公开(公告)号：US5814881A

公开(公告)日：1998-09-29

申请号：US770872

申请日：1996-12-20

申请人： Maniam Alagaratnam ,  Qwai H. Low ,  Chok J. Chia

发明人： Maniam Alagaratnam ,  Qwai H. Low ,  Chok J. Chia

IPC分类号： H01L21/98 ,  H01L23/495 ,  H01L23/02

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/49575 ,  H01L25/50 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181

摘要： A single leadframe package having stacked integrated chips mounted therein provides multiple electrical functions. The leadframe package construction includes a leadframe die having a substantially smaller outer peripheral dimension than a first integrated circuit chip mounted face down thereon for supporting from below the first integrated chip without obstructing its bond pads. A second integrated circuit is supported from below in a backside to backside configuration by the first integrated circuit without obstructing the bond pads of the second integrated circuit. A plurality of substantially short conductive wires interconnect electrically the first and second integrated circuit chips with selective ones of a plurality of leadframe conductors. An encapsulating material molds the construction into the single leadframe package.

摘要翻译： 具有安装在其中的堆叠集成芯片的单个引线框封装提供多个电功能。 引线框封装结构包括引线框模具，该引线框模具具有比面向下安装的第一集成电路芯片更小的外周尺寸，用于从第一集成芯片的下方支撑而不阻碍其键合焊盘。 第二集成电路在下面被第一集成电路的背面配置支持，而不会阻碍第二集成电路的接合焊盘。 多个基本上短的导电线将第一和第二集成电路芯片与多个引线框架导体中的选择性导体互连。 封装材料将结构模制成单引线框封装。

公开(公告)号：US5386144A

公开(公告)日：1995-01-31

申请号：US79489

申请日：1993-06-18

申请人： Patrick Variot ,  Qwai H. Low ,  Maniam Alagaratnam ,  Teresa Dalao

发明人： Patrick Variot ,  Qwai H. Low ,  Maniam Alagaratnam ,  Teresa Dalao

IPC分类号： H01L23/40 ,  H01L23/02

CPC分类号： H01L23/4093 ,  H01L2924/0002

摘要： A heat sink (44-48) is detachably mechanically connected to an electronic component package (10) by means of a pair of mutually spaced and parallel spring rods (16, 18) that are fixed to the electronic component package and span a recess (14) formed in a surface of the package. The heat sink is formed with a projecting latching member (50) having a short shank (52) on the end of which is formed a laterally outwardly extending flange (60). The flange has shoulders (62) that slope outwardly and away from the heat sink body and distal ends on which are formed cam surfaces (66) that slope inwardly away from the heat sink body. The latching member (50) of the heat sink is pressed into the electronic component package recess between the resilient rods (16, 18) to force the rods apart and to pass the outer most ends (64) of the flange this causes the rods to contact the flange shoulders (62) in a slightly outwardly bowed position of the rods. The resilience of the rods accordingly tends to exert a constant force on the latching member flange tending to pull the heat sink against the electronic component package. Thus, the heat sink may be snapped into a latching engagement with the component package and the two parts may be readily snapped apart or disengaged.

摘要翻译： 散热器（44-48）借助于一对相互间隔开的和平行的弹簧杆（16,18）可拆卸地机械连接到电子部件封装（10），所述弹簧杆固定到电子部件封装并跨越凹部 14）形成在包装的表面中。 散热器形成有具有短柄（52）的突出的闩锁构件（50），其端部形成有横向向外延伸的凸缘（60）。 凸缘具有向外倾斜并远离散热体的肩部（62），远端处形成有从散热体本体向内倾斜的凸轮表面（66）。 散热器的闩锁构件（50）被压入弹性杆（16,18）之间的电子部件封装凹部中，以迫使杆分开并使法兰的最外端（64）通过，从而将杆引导到 在凸缘的稍微向外弯曲的位置接触凸缘（62）。 因此，杆的弹性倾向于对锁定构件法兰施加恒定的力，倾向于将散热器拉向电子部件封装。 因此，散热器可以卡扣成与组件封装件的闩锁接合，并且两个部件可以容易地分开或脱开。