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    Transducing head suspension with resonance system
    24.
    发明授权
    Transducing head suspension with resonance system 有权

    公开(公告)号：US10395679B2

    公开(公告)日：2019-08-27

    申请号：US15836151

    申请日：2017-12-08

    Applicant: Seagate Technology, LLC

    Inventor： Ravishankar Ajjanagadde Shivarama ,  Bradley J. Ver Meer ,  Razman Zambri

    IPC: G11B5/48 ,  G11B5/31

    Abstract: A data storage system can employ at least one transducing head that is suspended above a data storage medium to access data. The transducing head suspension can be configured with a resonance system where a gimbal flexure is mounted to a load beam via a physical connection. The gimbal flexure may support a transducing head and contact the load beam via the physical connection, a dimple, and a first contact feature concurrently while the physical connection, dimple, and first contact feature are each separate and different points of physical contact.

    Flex circuit having a multiple layered structure and interconnect
    27.
    发明授权
    Flex circuit having a multiple layered structure and interconnect 有权
    Flex电路具有多层结构和互连

    公开(公告)号：US08934200B2

    公开(公告)日：2015-01-13

    申请号：US13840197

    申请日：2013-03-15

    Applicant: Seagate Technology LLC

    Inventor： Ravishankar Ajjanagadde Shivarama ,  Bradley J. Ver Meer ,  Razman Zambri

    IPC: G11B5/48 ,  H05K1/00 ,  G11B13/04 ,  H05K1/02

    CPC classification number: H05K1/111 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/4866 ,  G11B13/04 ,  H05K1/0277 ,  H05K1/0298 ,  H05K1/115

    Abstract: A flex circuit including a multiple layer structure is disclosed. The multiple layered structure includes a first or top layer and a second or base layer. Top traces and bond pads are fabricated on the top or obverse layer and interlayer traces and bond pads are fabricated between the first and second layers to provide an electrical interconnect to electrical components on a head assembly. In an illustrated embodiment, the flex circuit includes portions including the first or base layer and the second or top layer and one or more reduced thickness portion including the first or base layer and not the second layer. In one embodiment, the gimbal portion of the flex circuit includes the first layer and not the second layer of the multiple layer structure and in another embodiment a bending portion of the flex circuit includes the first base layer and not the second layer of the multiple layered structure to provide a reduced thickness to facilitate bending, for example in a micro-actuation region of the load beam.

    Abstract translation: 公开了一种包括多层结构的柔性电路。 多层结构包括第一或顶层和第二或基层。 顶部迹线和接合焊盘制造在顶部或正面层上，层间迹线和接合焊盘制造在第一和第二层之间，以提供与头部组件上的电气部件的电互连。 在所示的实施例中，柔性电路包括包括第一或第二层或第二层或顶层的部分和包括第一层或第二层而不是第二层的一个或多个减薄厚度部分。 在一个实施例中，柔性电路的万向节部分包括第一层而不是多层结构的第二层，在另一个实施例中，柔性电路的弯曲部分包括第一基底层而不是第二层的多层结构 结构以提供减小的厚度以便于弯曲，例如在负载梁的微致动区域中。

    MULTI-LAYER PIEZOELECTRIC TRANSDUCER WITH INACTIVE LAYERS
    28.
    发明申请
    MULTI-LAYER PIEZOELECTRIC TRANSDUCER WITH INACTIVE LAYERS 有权
    具有不活动层的多层压电传感器

    公开(公告)号：US20140104722A1

    公开(公告)日：2014-04-17

    申请号：US13652907

    申请日：2012-10-16

    Applicant: SEAGATE TECHNOLOGY LLC

    Inventor： John S. Wright ,  Razman Zambri

    IPC: G11B21/02 ,  G11B21/24 ,  H01L41/083

    CPC classification number: H01L41/083 ,  G11B5/483 ,  G11B5/4873 ,  G11B5/5552 ,  H01L41/0946

    Abstract: Apparatus for positioning a control object, such as a microactuator used to position a read/write transducer adjacent a data storage medium. In accordance with some embodiments, a piezoelectric transducer (PZT) element is adapted to induce rotational displacement of the control object in a bending mode of operation. The PZT element has a plurality of piezoelectric material layers and a plurality of electrically conductive layers interposed between the piezoelectric material layers. The piezoelectric material layers include a first subset of active layers and at least one non-active layer.

    Abstract translation: 用于定位控制对象的装置，例如用于将读/写换能器定位在数据存储介质附近的微致动器。 根据一些实施例，压电换能器（PZT）元件适于在弯曲操作模式下引起控制对象的旋转位移。 PZT元件具有多个压电材料层和介于压电材料层之间的多个导电层。 压电材料层包括有源层的第一子集和至少一个非有源层。

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