Semiconductor package including workpiece and method for fabricating the semiconductor package

    公开(公告)号:US11380644B2

    公开(公告)日:2022-07-05

    申请号:US16917155

    申请日:2020-06-30

    Abstract: Provided are a semiconductor package and a method for fabricating the semiconductor package. The method includes followings steps: a first workpiece is provided, where the first workpiece includes a first substrate and multiple first rewiring structures arranged on the first substrate at intervals, and each first rewiring structure includes at least two first rewiring layers; an encapsulation layer is formed on the first rewiring structures, where the encapsulation layer is provided with multiple first through holes, and the first through holes exposes one first rewiring layer; at least two second rewiring layers are disposed on a side of the encapsulation layer facing away from the first rewiring layer; multiple semiconductor elements are provided, where the semiconductor elements are arranged on a side of the first rewiring structures facing away from the encapsulation layer, where the first rewiring layers are electrically connected to pins of the semiconductor elements.

    Display component and display device

    公开(公告)号:US11081506B2

    公开(公告)日:2021-08-03

    申请号:US16532953

    申请日:2019-08-06

    Abstract: A display component and a display device are provided. The display component includes a display panel including a first substrate, a thin-film transistor array layer, a second substrate and a coil-containing film layer. The coil-containing film layer at least includes a first metal layer, a first insulation layer, a second metal layer, and a second insulation layer. The first metal layer includes at least one first coil and the second metal layer includes at least one signal line, where the one first coil of the first metal layer is electrically connected to one or two signal lines of the second metal layer. An orthographic projection of the first coil on the first substrate is at least partially in the display region. The display component further includes a coil drive circuit, where the coil drive circuit is electrically connected to each of the first coil and the signal line, respectively.

    Transflective and non-rectangular display panel and display device

    公开(公告)号:US10795063B2

    公开(公告)日:2020-10-06

    申请号:US16174312

    申请日:2018-10-30

    Abstract: A transflective and non-rectangular display panel and a display device are provided. The non-rectangular display panel includes a display region, a non-display region surrounding the display region, multiple pixels including multiple sub pixels, and a light shielding layer. There is a first boundary between the display region and the non-display region, and a region surrounded by the first boundary and the display region is non-rectangular. Each of the multiple pixels includes at least three of the multiple sub pixels. An open region of each of the multiple sub pixels has a transmissive region and a reflective region. The multiple pixels include normal pixels in the display region and abnormal pixels passed through by the first boundary. In each of the abnormal pixels, each of the transmissive region and the reflective region is partially blocked by the light shielding layer and partially emits light therefrom.

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