Abstract:
An exposure apparatus for exposing a substrate to exposure light via a pattern of a mask. The apparatus includes a stage configured to hold one of the substrate and the mask, and to move, a projection optical system configured to project the pattern onto the substrate, a defining member facing the stage and configured to define a space, between the stage and the projection optical system, through which the exposure light passes and which is to be filled with fluid, a first stream mechanism having a first supply port in the defining member and configured to stream the fluid through the space from the first supply port, an exhaust mechanism having an exhaust port in the defining member and configured to exhaust fluid in the space from the exhaust port, and a second stream mechanism having a second supply port different from the first supply port. The second supply port is arranged to surround the space at a lower portion of the defining member, and configured to stream fluid from the second supply port against the stage to seal the space.
Abstract:
A substrate processing system has a first processing device which processes a substrate with a first process in a first gas atmosphere within a process chamber and a transfer device that transfers a substrate in a second gas atmosphere within a clean booth, the transfer device transferring a substrate which has been processed with a second process by a second processing device or a substrate which is to be processed by that second processing device. A load-lock chamber has a substrate transfer path between the first processing device and the transfer device and there is a gas supply device which supplies the first gas from the process chamber to the load-lock chamber when the substrate is transferred between the load-lock chamber and a first processing device, and supplies the second gas from the clean booth to the load-lock chamber when the substrate is transferred between the load-lock chamber and the transfer device.
Abstract:
An exposure apparatus includes an illumination optical system which illuminates a pattern formed on a mask with light from a light source, a movable mask stage for holding the mask, a projection optical system which guides light from a pattern of the mask to a wafer, a movable wafer stage for holding the wafer, a shielding member which forms an optical path space including an optical path of exposure light and a space surrounding the optical path space at, of a space through which the exposure light passes, at least one portion between the illumination optical system and the mask stage, between the mask stage and the projection optical system, or between the protection optical system and the wafer stage, a first gas supply device for supplying an inert gas to the optical path space, a chamber surrounding the wafer stage, the projection optical system and the shielding member, and a reduction device for reducing a change in total light quantity of the exposure light reaching the wafer that is caused by movement of at least one of the mask stage and the wafer stage.
Abstract:
This invention shortens a time required to purge, with inert gas, gas in a space (optical path space) through which exposure light passes, such as a space between a projection optical system and a substrate. The exposure apparatus includes a wafer stage (102), a projection optical system (101), and an air supply portion (112) which supplies inert gas at a nonuniform flow velocity to an optical path space (113) through which exposure light passes between the wafer stage (102) and the projection optical system (101). A downward flow of inert gas is formed.
Abstract:
An exposure apparatus for exposing a photosensitive substrate to a pattern on a mask within an exposure view angle to transfer the pattern onto the photosensitive substrate using X-ray as exposure radiation, wherein exposure light on the mask is limited by a light blocking plate for blocking the exposure radiation, thus accomplishing efficient manufacturing of the semiconductor devices.
Abstract:
An electron beam exposure apparatus for projecting an image formed by electron beams onto a wafer via a reduction electron optical system, irradiates collimated electron beams toward an aperture board having an arcuated aperture sandwiched between two arcs having, as the center, the axis of the reduction electron optical system, and exposes the wafer with electron beams having an arcuated sectional shape that have been transmitted through the aperture.
Abstract:
An exposure apparatus for transferring a pattern of a mask onto a substrate, includes a regulating an member for regulating exposure beam from a light source, and an alignment optical system for projecting an alignment beam to an alignment mark of the mask, to perform alignment between the mask and the substrate. The regulating member is arranged to pass the alignment light therethrough. The distance E from the regulating member to the mask satisfies the relationE.gtoreq.(f+m)/2(tan.theta.+tan.gamma.,)where, as viewed from a direction of formation of an edge of the regulating member, .theta. is the angle defined between an optical axis of the alignment beam and an optical axis of the exposure beam, f is the beam width of a portion of the alignment beam passing through the regulating member, .gamma. is the maximum of a divergence angle, in an exposure region, of the exposure beam, and m is the width of the alignment mark.
Abstract:
An energy beam drawing apparatus includes a member, positioned between an energy beam source and a substrate, on which a deposit is deposited and a removing unit which removes the deposit. The removing unit includes a catalyst for generating, from a gas, an active species for decomposing the deposit by irradiation with the energy beam, a supplying mechanism for supplying the gas to a position where the active species is generated, and a moving mechanism for moving, when executing processing of removing the deposit, the catalyst to a first position which is irradiated with the energy beam, and moving, when executing drawing processing on the substrate, the catalyst to a second position which is not irradiated with the energy beam.
Abstract:
An exposure apparatus which projects exposure light from a pattern of an illuminated original onto a substrate, comprises a projection system including an optical element and configured to project the exposure light onto the substrate, an enclosure configured to enclose the projection system, and a cleaning mechanism configured to clean the optical element by irradiating the optical element with ultraviolet light under an environment in which oxygen is present within the enclosure, the cleaning mechanism including a light source configured to generate ultraviolet light, a tubular member including an exit window and configured to partially enclose an optical path between the light source and the optical element, and a regulating device configured to regulate an environment of a space inside the tubular member so that a partial pressure of oxygen becomes lower in the space inside the tubular member than in a space which is outside the tubular member.
Abstract:
An exposure apparatus for exposing a substrate to exposure light via a pattern of a mask. The apparatus includes a stage configured to hold one of the substrate and the mask, and to move, a projection optical system configured to project the pattern onto the substrate, a defining member facing the stage and configured to define a space, between the stage and the projection optical system, through which the exposure light passes and which is to be filled with fluid, a first stream mechanism having a first supply port in the defining member and configured to stream the fluid through the space from the first supply port, an exhaust mechanism having an exhaust port in the defining member and configured to exhaust fluid in the space from the exhaust port, and a second stream mechanism having a second supply port different from the first supply port. The second supply port is arranged to surround the space at a lower portion of the defining member, and configured to stream fluid from the second supply port against the stage to seal the space.