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27 条记录 (耗时 0.029 秒)

    Antenna Device
    21.
    发明申请
    Antenna Device 有权
    天线装置

    公开(公告)号：US20130342405A1

    公开(公告)日：2013-12-26

    申请号：US13979371

    申请日：2012-01-12

    申请人： Mikio Ueno ,  Ryuichi Taira ,  Shin Matsumoto

    发明人： Mikio Ueno ,  Ryuichi Taira ,  Shin Matsumoto

    IPC分类号： H01Q1/32

    CPC分类号： H01Q1/32 ,  H01Q1/3275 ,  H01Q5/378 ,  H01Q11/08

    摘要： A low profile antenna device for use in a vehicle comprises a base unit, and an antenna unit. The antenna unit is supported on the base unit, and is provided with a first helical unit on the side near to the base unit, and a second helical unit on the side far from the base unit. The second helical unit is configured such that the surface area is larger per unit length than that of the first helical unit.

    摘要翻译： 用于车辆的低剖面天线装置包括基座单元和天线单元。 天线单元被支撑在基座单元上，并且在靠近基座单元的一侧设置有第一螺旋单元，并且在远离基座单元的一侧设置有第二螺旋单元。 第二螺旋单元构造成使得每单位长度的表面积比第一螺旋单元的面积大。

    Semiconductor device and method for manufacturing same
    22.
    发明授权
    Semiconductor device and method for manufacturing same 有权
    半导体装置及其制造方法

    公开(公告)号：US08361882B2

    公开(公告)日：2013-01-29

    申请号：US13139988

    申请日：2009-08-21

    申请人： Michiko Takei ,  Yasumori Fukushima ,  Kazuhide Tomiyasu ,  Shin Matsumoto ,  Kazuo Nakagawa ,  Yutaka Takafuji

    发明人： Michiko Takei ,  Yasumori Fukushima ,  Kazuhide Tomiyasu ,  Shin Matsumoto ,  Kazuo Nakagawa ,  Yutaka Takafuji

    IPC分类号： H01L21/30 ,  H01L29/06

    CPC分类号： H01L27/1266 ,  H01L27/1214 ,  H01L29/66772 ,  H01L29/78636

    摘要： Provided is a semiconductor device manufacturing method wherein the following steps are performed; a step of forming at least a part of an element on a base body layer, a step of forming a peeling layer, a step of forming a planarizing film; a step of forming a die by separating the base body layer at a separating region; a step of bonding the die to a substrate by bonding the die on the planarizing film; and a step of peeling and removing a part of the base body layer along the peeling layer. Prior to the step of forming the die, a step of forming a groove opened on the surface of the planarizing film such that at least a part of the separating region is included on the bottom surface of the groove, and forming the die such that the die has a polygonal outer shape wherein all the internal angles are obtuse by forming the groove is performed.

    摘要翻译： 提供一种其中执行以下步骤的半导体器件制造方法; 在基体层上形成元素的至少一部分的步骤，形成剥离层的步骤，形成平坦化膜的步骤; 通过在分离区域分离基体层而形成模具的步骤; 通过将该模具接合在平坦化膜上而将芯片接合到基板的步骤; 以及沿剥离层剥离和去除基体层的一部分的步骤。 在成形模具的步骤之前，形成在平坦化膜的表面上开口的槽，使得至少一部分分离区域包含在槽的底面上，并且形成模具，使得 模具具有多边形外形，其中通过形成凹槽来执行所有内角都是钝的。

    Method for producing semiconductor device and semiconductor device produced by same method
    23.
    发明授权
    Method for producing semiconductor device and semiconductor device produced by same method 有权
    通过相同方法制造半导体器件和半导体器件的方法

    公开(公告)号：US08207046B2

    公开(公告)日：2012-06-26

    申请号：US12682221

    申请日：2008-10-21

    申请人： Michiko Takei ,  Shin Matsumoto ,  Yasumori Fukushima ,  Yutaka Takafuji

    发明人： Michiko Takei ,  Shin Matsumoto ,  Yasumori Fukushima ,  Yutaka Takafuji

    IPC分类号： H01L21/02

    CPC分类号： H01L27/1266 ,  H01L21/76254 ,  H01L27/1214 ,  H01L29/66772

    摘要： To prevent bubbles from occurring along a transfer interface, the present method includes the steps of: forming a peeled layer 10 in a transferred member 6 by implanting a peeled-layer forming substance into the transferred member 6; forming a planar surface in the transferred member 6 by planarizing a surface of the transferred member 6; forming a composite including the transferred member 6 and a glass substrate 2 by directly combining the transferred member 6 via the planar surface with a surface of the glass substrate 2; and peeling a part of the transferred member 6 from the composite along the peeled layer 10 serving as an interface by heat-treating the composite.

    摘要翻译： 为了防止沿着转移界面发生气泡，本方法包括以下步骤：通过将剥离层形成物质注入到被转印元件6中，在转印元件6中形成剥离层10; 通过使转印部件6的表面平坦化，在被转印部件6中形成平面; 通过经由平面表面直接将转印部件6与玻璃基板2的表面直接组合，形成包括转印部件6和玻璃基板2的复合体; 以及通过热处理复合材料，沿着作为界面的剥离层10将复合材料的一部分从复合材料剥离。

    Stabilizer apparatus
    26.
    发明申请
    Stabilizer apparatus 审中-公开
    稳定装置

    公开(公告)号：US20060049601A1

    公开(公告)日：2006-03-09

    申请号：US11202055

    申请日：2005-08-12

    申请人： Shin Matsumoto

    发明人： Shin Matsumoto

    IPC分类号： B60G21/055

    CPC分类号： B60G17/0162 ,  B60G21/0555 ,  B60G2202/135 ,  B60G2202/42 ,  B60G2202/442 ,  B60G2204/419 ,  B60G2204/4191 ,  B60G2204/8302 ,  B60G2400/051 ,  B60G2400/104 ,  B60G2400/204 ,  B60G2400/41 ,  B60G2800/012 ,  B60G2800/24

    摘要： A stabilizer apparatus for a vehicle including: a pair of stabilizer bars which are rotatably supported by respective two support portions disposed on a body of the vehicle to be away from each other and which are disposed such that proximal ends of the pair of stabilizer bars are opposed to each other; and an actuator which includes: (a) a housing having a generally cylindrical shape; (b) a motor disposed inside the housing near to one of opposite end portions thereof; and (c) a decelerator which is disposed inside the housing near to the other of the opposite end portions thereof so as to be connected to the motor and which has an output portion, the housing being unrotatably connected to the proximal end of one of the pair of stabilizer bars while the output portion of the decelerator is connected to the proximal end of the other of the pair of stabilizer bars, thereby enabling the pair of stabilizer bars to be connected to each other by the actuator to be rotatably driven relative to each other, the motor and the decelerator being disposed to be spaced apart from each other with a predetermined spacing distance therebetween.

    摘要翻译： 一种用于车辆的稳定装置，包括：一对稳定杆，其由设置在车辆本体上的相应的两个支撑部分可旋转地支撑以彼此远离并且被设置成使得所述一对稳定杆的近端为 相互对立 以及致动器，其包括：（a）具有大致圆柱形形状的壳体; （b）设置在所述壳体内靠近其相对端部之一的电机; 以及（c）减速器，其设置在所述壳体的靠近所述壳体的另一端的另一端部，以便连接到所述电动机并具有输出部，所述壳体不可旋转地连接到所述壳体 一对稳定杆，而减速器的输出部分连接到一对稳定杆中的另一个的近端，从而使得一对稳定杆可以通过致动器彼此相对于每个稳定杆相对于每个 另一方面，马达和减速器被设置成彼此隔开一定间隔。