PHOTOLITHOGRAPHY PROCESS FOR SEMICONDUCTOR DEVICE
    21.
    发明申请
    PHOTOLITHOGRAPHY PROCESS FOR SEMICONDUCTOR DEVICE 审中-公开
    半导体器件的光刻工艺

    公开(公告)号:US20120082940A1

    公开(公告)日:2012-04-05

    申请号:US13325199

    申请日:2011-12-14

    摘要: Provided is a non-transitory computer readable medium including instructions to generate a level sensor map and create a compensation map from the level sensor map. The level sensor map includes a first determination of a first height above a reference plane of a feature disposed on a semiconductor substrate, and a second determination of a second height above the reference plane of a second feature disposed on a semiconductor substrate. The first and second feature are in a single exposure field. The compensation map includes a determination of at least one parameter to be used during exposure of a single field during an exposure process for the semiconductor substrate.

    摘要翻译: 提供了一种非暂时的计算机可读介质,其包括用于生成水平传感器图并从水平传感器图创建补偿图的指令。 电平传感器图包括首先确定位于半导体衬底上的特征的参考平面之上的第一高度,以及第二确定位于半导体衬底上的第二特征的参考平面之上的第二高度。 第一个和第二个功能是在一个单一的曝光领域。 补偿图包括在半导体衬底的曝光处理期间对单场曝光期间要使用的至少一个参数的确定。

    Coolant tank
    22.
    外观设计

    公开(公告)号:USD783770S1

    公开(公告)日:2017-04-11

    申请号:US29542382

    申请日:2015-10-14

    申请人: Vincent Yu

    设计人: Vincent Yu

    Double patterning method using metallic compound mask layer
    25.
    发明授权
    Double patterning method using metallic compound mask layer 有权
    使用金属化合物掩模层的双重图案化方法

    公开(公告)号:US08313889B2

    公开(公告)日:2012-11-20

    申请号:US12752281

    申请日:2010-04-01

    IPC分类号: G03F7/26

    摘要: A hard mask layer and a developable bottom anti-reflective coating (dBARC) layer are formed over a dielectric layer of a substrate. A first photosensitive layer is formed above the dBARC layer, exposed, and developed to form a first pattern. The dBARC layer is developed. The first pattern is etched into the hard mask layer to form a first pattern of openings in the hard mask layer. Following removal of the first photosensitive layer, a second photosensitive layer is formed within the first pattern of openings. The second photosensitive layer is exposed and developed to form a second pattern. The dBARC layer is developed. The second pattern is etched into the hard mask layer to form a second pattern of openings in the hard mask layer. Following the removal of the second photosensitive layer and the dBARC layer, the first and the second patterns are etched into the dielectric layer.

    摘要翻译: 在衬底的介电层上形成硬掩模层和可显影底部抗反射涂层(dBARC)层。 第一感光层形成在dBARC层上方,暴露并显影以形成第一图案。 开发了dBARC层。 将第一图案蚀刻到硬掩模层中以在硬掩模层中形成开口的第一图案。 在移除第一感光层之后,在第一开口图案内形成第二感光层。 第二感光层被曝光和显影以形成第二图案。 开发了dBARC层。 将第二图案蚀刻到硬掩模层中以在硬掩模层中形成开口的第二图案。 在去除第二感光层和dBARC层之后,将第一和第二图案蚀刻到电介质层中。

    Immersion lithography defect reduction
    27.
    发明申请
    Immersion lithography defect reduction 审中-公开
    浸没光刻缺陷减少

    公开(公告)号:US20070002296A1

    公开(公告)日:2007-01-04

    申请号:US11384624

    申请日:2006-03-20

    IPC分类号: G03B27/42

    CPC分类号: G03F7/70341

    摘要: A method of performing immersion lithography on a semiconductor substrate includes providing a layer of resist onto a surface of the semiconductor substrate and exposing the resist layer using an immersion lithography exposure system. The immersion lithography exposure system utilizes a fluid during exposure and may be capable of removing some, but not all, of the fluid after exposure. After exposure, a treatment process is used to remove the remaining portion of fluid from the resist layer. After treatment, a post-exposure bake and a development step are used.

    摘要翻译: 在半导体衬底上进行浸渍光刻的方法包括在半导体衬底的表面上提供抗蚀剂层并使用浸没光刻曝光系统曝光抗蚀剂层。 浸没式光刻曝光系统在曝光期间利用流体,并且可以在曝光后能够去除一些但不是全部的流体。 曝光后,使用处理工艺从抗蚀剂层中除去剩余部分的流体。 处理后,使用曝光后烘烤和显影步骤。