EXPOSURE APPARATUS AND METHOD FOR PHOTOLITHOGRAPHY PROCESS
    1.
    发明申请
    EXPOSURE APPARATUS AND METHOD FOR PHOTOLITHOGRAPHY PROCESS 有权
    曝光装置和光刻方法

    公开(公告)号:US20090103068A1

    公开(公告)日:2009-04-23

    申请号:US11875471

    申请日:2007-10-19

    IPC分类号: G03B27/34 G06F19/00

    摘要: Provided is an exposure apparatus including a variable focusing device. The variable focusing device may include a transparent membrane that may be deformed in the presence of an electric field. The deformation of the transparent membrane may allow the focus length of a radiation beam to be modified. In an embodiment, the variable focusing device may be modulated such that a radiation beam having a first focus length is provided for a first position on an exposure target and a radiation beam having a second focus length is provided for a second position on the exposure target. A method and computer-readable medium are also provided.

    摘要翻译: 提供一种包括可变聚焦装置的曝光装置。 可变聚焦装置可以包括可能在存在电场的情况下变形的透明膜。 透明膜的变形可以允许改变辐射束的聚焦长度。 在一个实施例中,可调制可变聚焦装置,使得具有第一聚焦长度的辐射束用于曝光目标上的第一位置,并且为曝光目标上的第二位置提供具有第二焦距的辐射束 。 还提供了一种方法和计算机可读介质。

    PHOTOLITHOGRAPHY PROCESS FOR SEMICONDUCTOR DEVICE
    2.
    发明申请
    PHOTOLITHOGRAPHY PROCESS FOR SEMICONDUCTOR DEVICE 审中-公开
    半导体器件的光刻工艺

    公开(公告)号:US20120082940A1

    公开(公告)日:2012-04-05

    申请号:US13325199

    申请日:2011-12-14

    摘要: Provided is a non-transitory computer readable medium including instructions to generate a level sensor map and create a compensation map from the level sensor map. The level sensor map includes a first determination of a first height above a reference plane of a feature disposed on a semiconductor substrate, and a second determination of a second height above the reference plane of a second feature disposed on a semiconductor substrate. The first and second feature are in a single exposure field. The compensation map includes a determination of at least one parameter to be used during exposure of a single field during an exposure process for the semiconductor substrate.

    摘要翻译: 提供了一种非暂时的计算机可读介质,其包括用于生成水平传感器图并从水平传感器图创建补偿图的指令。 电平传感器图包括首先确定位于半导体衬底上的特征的参考平面之上的第一高度,以及第二确定位于半导体衬底上的第二特征的参考平面之上的第二高度。 第一个和第二个功能是在一个单一的曝光领域。 补偿图包括在半导体衬底的曝光处理期间对单场曝光期间要使用的至少一个参数的确定。

    Double patterning method using metallic compound mask layer
    3.
    发明授权
    Double patterning method using metallic compound mask layer 有权
    使用金属化合物掩模层的双重图案化方法

    公开(公告)号:US08313889B2

    公开(公告)日:2012-11-20

    申请号:US12752281

    申请日:2010-04-01

    IPC分类号: G03F7/26

    摘要: A hard mask layer and a developable bottom anti-reflective coating (dBARC) layer are formed over a dielectric layer of a substrate. A first photosensitive layer is formed above the dBARC layer, exposed, and developed to form a first pattern. The dBARC layer is developed. The first pattern is etched into the hard mask layer to form a first pattern of openings in the hard mask layer. Following removal of the first photosensitive layer, a second photosensitive layer is formed within the first pattern of openings. The second photosensitive layer is exposed and developed to form a second pattern. The dBARC layer is developed. The second pattern is etched into the hard mask layer to form a second pattern of openings in the hard mask layer. Following the removal of the second photosensitive layer and the dBARC layer, the first and the second patterns are etched into the dielectric layer.

    摘要翻译: 在衬底的介电层上形成硬掩模层和可显影底部抗反射涂层(dBARC)层。 第一感光层形成在dBARC层上方,暴露并显影以形成第一图案。 开发了dBARC层。 将第一图案蚀刻到硬掩模层中以在硬掩模层中形成开口的第一图案。 在移除第一感光层之后,在第一开口图案内形成第二感光层。 第二感光层被曝光和显影以形成第二图案。 开发了dBARC层。 将第二图案蚀刻到硬掩模层中以在硬掩模层中形成开口的第二图案。 在去除第二感光层和dBARC层之后,将第一和第二图案蚀刻到电介质层中。

    Immersion lithography watermark reduction
    4.
    发明授权
    Immersion lithography watermark reduction 有权
    浸没光刻水印缩减

    公开(公告)号:US08383322B2

    公开(公告)日:2013-02-26

    申请号:US11427017

    申请日:2006-06-28

    IPC分类号: G03F7/26

    CPC分类号: G03F7/2041 G03F7/70341

    摘要: A method of performing immersion lithography on a semiconductor substrate includes providing a layer of resist onto a surface of the semiconductor substrate and exposing the resist layer using an immersion lithography exposure system. The immersion lithography exposure system utilizes a fluid during exposure and may be capable of removing some, but not all, of the fluid after exposure. After exposure, a treatment process is used to neutralize the effect of undesired elements that diffused into the resist layer during the immersion exposure. After treatment, a post-exposure bake and a development step are used.

    摘要翻译: 在半导体衬底上进行浸渍光刻的方法包括在半导体衬底的表面上提供抗蚀剂层并使用浸没光刻曝光系统曝光抗蚀剂层。 浸没式光刻曝光系统在曝光期间利用流体,并且可以在曝光后能够去除一些但不是全部的流体。 曝光后,使用处理工艺来中和在浸没曝光期间扩散到抗蚀剂层中的不期望的元素的影响。 处理后,使用曝光后烘烤和显影步骤。

    Immersion lithography edge bead removal
    5.
    发明授权
    Immersion lithography edge bead removal 有权
    浸没光刻边缘珠去除

    公开(公告)号:US07691559B2

    公开(公告)日:2010-04-06

    申请号:US11337986

    申请日:2006-01-24

    IPC分类号: G03F7/00 G03F7/004

    摘要: A method of performing immersion lithography on a semiconductor wafer is provided. The method includes providing a layer of resist onto a surface of the semiconductor wafer. Next, an edge-bead removal process spins the wafer at a speed greater than 1000 revolutions per minute and dispenses solvent through a nozzle while the wafer is spinning. Then, the resist layer is exposed using an immersion lithography exposure system.

    摘要翻译: 提供了在半导体晶片上进行浸渍光刻的方法。 该方法包括在半导体晶片的表面上提供一层抗蚀剂。 接下来,边缘珠去除过程以大于1000转/分钟的速度旋转晶片,并且在晶片旋转时通过喷嘴分配溶剂。 然后,使用浸没式光刻曝光系统曝光抗蚀剂层。

    Pipe clamp
    6.
    外观设计

    公开(公告)号:USD681440S1

    公开(公告)日:2013-05-07

    申请号:US29393073

    申请日:2011-05-31

    申请人: Vincent Yu

    设计人: Vincent Yu

    Immersion lithography edge bead removal
    9.
    发明申请
    Immersion lithography edge bead removal 有权
    浸没光刻边缘珠去除

    公开(公告)号:US20070003879A1

    公开(公告)日:2007-01-04

    申请号:US11337986

    申请日:2006-01-24

    IPC分类号: G03F7/26

    摘要: A method of performing immersion lithography on a semiconductor wafer is provided. The method includes providing a layer of resist onto a surface of the semiconductor wafer. Next, an edge-bead removal process spins the wafer at a speed greater than 1000 revolutions per minute and dispenses solvent through a nozzle while the wafer is spinning. Then, the resist layer is exposed using an immersion lithography exposure system.

    摘要翻译: 提供了在半导体晶片上进行浸渍光刻的方法。 该方法包括在半导体晶片的表面上提供一层抗蚀剂。 接下来,边缘珠去除过程以大于1000转/分钟的速度旋转晶片,并且在晶片旋转时通过喷嘴分配溶剂。 然后,使用浸没式光刻曝光系统曝光抗蚀剂层。

    Methods, apparatus and system for handover of UE
    10.
    发明授权
    Methods, apparatus and system for handover of UE 有权
    UE切换的方法,装置和系统

    公开(公告)号:US09179388B2

    公开(公告)日:2015-11-03

    申请号:US13979835

    申请日:2011-01-25

    申请人: Vincent Yu Field Liu

    发明人: Vincent Yu Field Liu

    IPC分类号: H04W36/30 H04W36/32

    CPC分类号: H04W36/32

    摘要: The present invention discloses a method for handover of User Equipment (UE) a service connection being made via the UE, comprises: if fast cells are set up as base stations starts up, handover from a normal cell to a first fast cell with a radio bearer set up therein when the UE moving speed exceeds a threshold, set up a same radio bearer at a current fast cell as the radio bearer set up at the first fast cell when the UE is leaving the first fast cell for the current fast cell adjacent to the first fast cell, release the radio bearer at the first fast cell after the UE leaves the first fast cell, and re-registering into an adjacent normal cell when the service connection is terminated, or handover to the adjacent normal cell from the current fast cell when the measured moving speed of the UE is below the threshold.

    摘要翻译: 本发明公开了一种用户设备(UE)通过UE进行业务连接切换的方法,包括:如果快速小区作为基站启动建立,则从正常小区切换到具有无线电的第一快速小区 当UE移动速度超过阈值时,在UE移动速度超过阈值时建立承载,在当前快速小区离开第一个快速小区时,在当前快速小区建立与第一个快速小区建立的无线承载相同的无线承载 到第一快速小区,在UE离开第一快速小区之后,在第一快速小区释放无线承载,并且当业务连接终止时重新登记到相邻的正常小区,或从当前的切换到相邻的正常小区 当UE的测量移动速度低于阈值时,快速小区。