公开(公告)号：US06572780B2

公开(公告)日：2003-06-03

申请号：US09872629

申请日：2001-05-31

申请人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

发明人： Mark Thomas McCormack ,  James Roman ,  Lei Zhang ,  Solomon I. Beilin

IPC分类号： H01B1300

CPC分类号： B32B37/26 ,  B32B2457/08 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68381 ,  H05K3/025 ,  H05K3/205 ,  Y10S438/957 ,  Y10S438/968 ,  Y10S438/976 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T156/1082 ,  Y10T156/1158

摘要： Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.