Nonvolatile memory devices having a three dimensional structure
    21.
    发明授权
    Nonvolatile memory devices having a three dimensional structure 有权
    具有三维结构的非易失性存储器件

    公开(公告)号:US08896123B2

    公开(公告)日:2014-11-25

    申请号:US13478482

    申请日:2012-05-23

    摘要: Provided is a nonvolatile memory device having a three dimensional structure. The nonvolatile memory device may include cell arrays having a plurality of conductive patterns having a line shape three dimensionally arranged on a semiconductor substrate, the cell arrays being separated from one another; semiconductor patterns extending from the semiconductor substrate to cross sidewalls of the conductive patterns; common source regions provided in the semiconductor substrate under a lower portion of the semiconductor patterns in a direction in which the conductive patterns extend; a first impurity region provided in the semiconductor substrate so that the first impurity region extends in a direction crossing the conductive patterns to electrically connect the common source regions; and a first contact hole exposing a portion of the first impurity region between the separated cell arrays.

    摘要翻译: 具有三维结构的非易失性存储装置。 非易失性存储器件可以包括具有三维布置在半导体衬底上的线形状的多个导电图案的单元阵列,单元阵列彼此分离; 从半导体衬底延伸到导电图案的横截面的半导体图案; 在所述半导体图案的下部设置在所述半导体衬底中的在所述导电图案延伸的方向上的公共源极区; 设置在所述半导体衬底中的第一杂质区域,使得所述第一杂质区域沿与所述导电图案交叉的方向延伸,以电连接所述公共源极区域; 以及在分离的电池阵列之间暴露第一杂质区域的一部分的第一接触孔。

    Nonvolatile memory devices having a three dimensional structure
    22.
    发明授权
    Nonvolatile memory devices having a three dimensional structure 有权
    具有三维结构的非易失性存储器件

    公开(公告)号:US08203211B2

    公开(公告)日:2012-06-19

    申请号:US12798525

    申请日:2010-04-06

    IPC分类号: H01L27/115 H01L23/522

    摘要: Provided is a nonvolatile memory device having a three dimensional structure. The nonvolatile memory device may include cell arrays having a plurality of conductive patterns having a line shape three dimensionally arranged on a semiconductor substrate, the cell arrays being separated from one another; semiconductor patterns extending from the semiconductor substrate to cross sidewalls of the conductive patterns; common source regions provided in the semiconductor substrate under a lower portion of the semiconductor patterns in a direction in which the conductive patterns extend; a first impurity region provided in the semiconductor substrate so that the first impurity region extends in a direction crossing the conductive patterns to electrically connect the common source regions; and a first contact hole exposing a portion of the first impurity region between the separated cell arrays.

    摘要翻译: 具有三维结构的非易失性存储装置。 非易失性存储器件可以包括具有三维布置在半导体衬底上的线形状的多个导电图案的单元阵列,单元阵列彼此分离; 从半导体衬底延伸到导电图案的横截面的半导体图案; 在所述半导体图案的下部设置在所述半导体衬底中的在所述导电图案延伸的方向上的公共源极区; 设置在所述半导体衬底中的第一杂质区域,使得所述第一杂质区域沿与所述导电图案交叉的方向延伸,以电连接所述公共源极区域; 以及在分离的电池阵列之间暴露第一杂质区域的一部分的第一接触孔。

    NONVOLATILE MEMORY DEVICES
    23.
    发明申请
    NONVOLATILE MEMORY DEVICES 有权
    非易失性存储器件

    公开(公告)号:US20120228712A1

    公开(公告)日:2012-09-13

    申请号:US13478482

    申请日:2012-05-23

    IPC分类号: H01L27/088

    摘要: Provided is a nonvolatile memory device having a three dimensional structure. The nonvolatile memory device may include cell arrays having a plurality of conductive patterns having a line shape three dimensionally arranged on a semiconductor substrate, the cell arrays being separated from one another; semiconductor patterns extending from the semiconductor substrate to cross sidewalls of the conductive patterns; common source regions provided in the semiconductor substrate under a lower portion of the semiconductor patterns in a direction in which the conductive patterns extend; a first impurity region provided in the semiconductor substrate so that the first impurity region extends in a direction crossing the conductive patterns to electrically connect the common source regions; and a first contact hole exposing a portion of the first impurity region between the separated cell arrays.

    摘要翻译: 具有三维结构的非易失性存储装置。 非易失性存储器件可以包括具有三维布置在半导体衬底上的线形状的多个导电图案的单元阵列,单元阵列彼此分离; 从半导体衬底延伸到导电图案的横截面的半导体图案; 在所述半导体图案的下部设置在所述半导体衬底中的在所述导电图案延伸的方向上的公共源极区; 设置在所述半导体衬底中的第一杂质区域,使得所述第一杂质区域沿与所述导电图案交叉的方向延伸,以电连接所述公共源极区域; 以及在分离的电池阵列之间暴露第一杂质区域的一部分的第一接触孔。

    Nonvolatile memory devices
    26.
    发明申请
    Nonvolatile memory devices 有权
    非易失性存储器件

    公开(公告)号:US20100258947A1

    公开(公告)日:2010-10-14

    申请号:US12798525

    申请日:2010-04-06

    IPC分类号: H01L27/115 H01L23/522

    摘要: Provided is a nonvolatile memory device having a three dimensional structure. The nonvolatile memory device may include cell arrays having a plurality of conductive patterns having a line shape three dimensionally arranged on a semiconductor substrate, the cell arrays being separated from one another; semiconductor patterns extending from the semiconductor substrate to cross sidewalls of the conductive patterns; common source regions provided in the semiconductor substrate under a lower portion of the semiconductor patterns in a direction in which the conductive patterns extend; a first impurity region provided in the semiconductor substrate so that the first impurity region extends in a direction crossing the conductive patterns to electrically connect the common source regions; and a first contact hole exposing a portion of the first impurity region between the separated cell arrays.

    摘要翻译: 具有三维结构的非易失性存储装置。 非易失性存储器件可以包括具有三维布置在半导体衬底上的线形状的多个导电图案的单元阵列,单元阵列彼此分离; 从半导体衬底延伸到导电图案的横截面的半导体图案; 在所述半导体图案的下部设置在所述半导体衬底中的在所述导电图案延伸的方向上的公共源极区; 设置在所述半导体衬底中的第一杂质区域,使得所述第一杂质区域沿与所述导电图案交叉的方向延伸以电连接所述公共源极区域; 以及在分离的电池阵列之间暴露第一杂质区域的一部分的第一接触孔。

    NONVOLATILE MEMORY DEVICES HAVING A THREE DIMENSIONAL STRUCTURE
    28.
    发明申请
    NONVOLATILE MEMORY DEVICES HAVING A THREE DIMENSIONAL STRUCTURE 有权
    具有三维结构的非易失性存储器件

    公开(公告)号:US20150076587A1

    公开(公告)日:2015-03-19

    申请号:US14548557

    申请日:2014-11-20

    IPC分类号: H01L27/115

    摘要: Provided is a nonvolatile memory device having a three dimensional structure. The nonvolatile memory device may include cell arrays having a plurality of conductive patterns having a line shape three dimensionally arranged on a semiconductor substrate, the cell arrays being separated from one another; semiconductor patterns extending from the semiconductor substrate to cross sidewalls of the conductive patterns; common source regions provided in the semiconductor substrate under a lower portion of the semiconductor patterns in a direction in which the conductive patterns extend; a first impurity region provided in the semiconductor substrate so that the first impurity region extends in a direction crossing the conductive patterns to electrically connect the common source regions; and a first contact hole exposing a portion of the first impurity region between the separated cell arrays.

    摘要翻译: 具有三维结构的非易失性存储装置。 非易失性存储器件可以包括具有三维布置在半导体衬底上的线形状的多个导电图案的单元阵列,单元阵列彼此分离; 从半导体衬底延伸到导电图案的横截面的半导体图案; 在所述半导体图案的下部设置在所述半导体衬底中的在所述导电图案延伸的方向上的公共源极区; 设置在所述半导体衬底中的第一杂质区域,使得所述第一杂质区域沿与所述导电图案交叉的方向延伸,以电连接所述公共源极区域; 以及在分离的电池阵列之间暴露第一杂质区域的一部分的第一接触孔。