公开(公告)号：US20240178164A1

公开(公告)日：2024-05-30

申请号：US17994446

申请日：2022-11-28

Applicant: Texas Instruments Incorporated

Inventor： Masamitsu Matsuura ,  Kengo Aoya ,  Daiki Komatsu ,  Ko Shibata

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/48

CPC classification number: H01L24/05 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/02 ,  H01L24/04 ,  H01L24/13 ,  H01L24/94 ,  H01L27/144

Abstract: An electronic device includes a semiconductor substrate having a first conductive routing structure on a first side of the semiconductor substrate, and a low aspect ratio via opening extending from the first side to an opposite second side. The electronic device includes a transparent cover over a portion of the first side and covering the patterned first conductive routing structure, as well as an insulator layer including a photo-imageable material on the second side and along a sidewall of the via opening, and a second conductive routing structure on an outer side of the insulator layer and extending through the via opening and directly contacting a portion of the first conductive routing structure.

公开(公告)号：US20230253281A1

公开(公告)日：2023-08-10

申请号：US17667843

申请日：2022-02-09

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Daiki Komatsu ,  Makoto Shibuya

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495

CPC classification number: H01L23/315 ,  H01L21/4821 ,  H01L21/565 ,  H01L23/49558 ,  H01L24/48

Abstract: An integrated circuit package includes a semiconductor die having a first surface and a second surface. The first surface is attached to a top surface of a die attach pad, and the second surface has a sensing area thereon. A mold compound covers or encapsulates at least a portion of the die attach pad and the semiconductor die. A channel is formed in a top portion of the mold compound. The channel extends from a first side of the mold compound to a second side of the mold compound. A cavity is formed between the channel and the sensing area so that the sensing area is exposed to the environment.

公开(公告)号：US11217513B2

公开(公告)日：2022-01-04

申请号：US16825676

申请日：2020-03-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Daiki Komatsu ,  Makoto Shibuya

IPC: H01L21/56 ,  H01L23/495 ,  H01L23/00 ,  H01L21/78 ,  H01L21/66 ,  H01L23/31

Abstract: An integrated circuit (IC) package includes an encapsulation package that contains an integrated circuit die attached to a lead frame. A set of contacts is formed on the package that each have an exposed contact sidewall surface and an exposed contact lower surface. A protective layer of solder wettable material covers each contact sidewall surface.

公开(公告)号：US20210111136A1

公开(公告)日：2021-04-15

申请号：US16739578

申请日：2020-01-10

Applicant: Texas Instruments Incorporated

Inventor： Masamitsu Matsuura ,  Daiki Komatsu

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/528

Abstract: A wafer chip-scale package (WCSP) includes a substrate including a semiconductor surface layer including circuitry configured for at least one function having at least a top metal interconnect layer thereon that includes at least one bond pad coupled to a node in the circuitry. A redistribution layer (RDL) including a bump pad is coupled by a trace to metal filled plugs through a passivation layer to the bond pad. A solder ball is on the bump pad, and a dielectric ring is on the bump pad that has an inner area that is in physical contact with the solder ball.

公开(公告)号：US20200286816A1

公开(公告)日：2020-09-10

申请号：US16825676

申请日：2020-03-20

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Daiki Komatsu ,  Makoto Shibuya

IPC: H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L21/78 ,  H01L21/66

Abstract: An integrated circuit (IC) package includes an encapsulation package that contains an integrated circuit die attached to a lead frame. A set of contacts is formed on the package that each have an exposed contact sidewall surface and an exposed contact lower surface. A protective layer of solder wettable material covers each contact sidewall surface.

公开(公告)号：US20200043778A1

公开(公告)日：2020-02-06

申请号：US16051590

申请日：2018-08-01

Applicant: Texas Instruments Incorporated

Inventor： Daiki Komatsu ,  Makoto Shibuya

IPC: H01L21/768 ,  H01L23/00 ,  H01L23/522 ,  H01L23/532 ,  H01L23/538

Abstract: Disclosed examples provide methods that include forming a conductive structure at least partially above a conductive feature of a wafer, attaching a solder ball structure to a side of the conductive structure, and thereafter forming a repassivation layer on a side of the wafer proximate the side of the conductive structure. Further examples provide microelectronic devices and integrated circuits that include a conductive structure coupled with a conductive feature of a metallization structure, a solder ball structure connected to the conductive structure, and a printed repassivation layer disposed on the side of the metallization structure proximate a side of the conductive structure.

公开(公告)号：US20190206768A1

公开(公告)日：2019-07-04

申请号：US15858962

申请日：2017-12-29

Applicant: Texas Instruments Incorporated

Inventor： Makoto Shibuya ,  Daiki Komatsu

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49541 ,  H01L21/4803 ,  H01L21/4842 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49586 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/14

Abstract: Leadframes, integrated circuit packaging with wettable flanks, and methods of manufacturing the same are disclosed. An example packaged device having a leadframe includes a die pad and a lead spaced apart from the die pad. The lead has a proximal end adjacent the die pad and a distal end extending away from the die pad. The lead has a thickness at the distal end that is less than a full thickness of the leadframe between a first outer surface on a die attach side of the leadframe and a second outer surface on a mounting side of the leadframe.