公开(公告)号：US20200251368A1

公开(公告)日：2020-08-06

申请号：US16778466

申请日：2020-01-31

Applicant: TOKYO ELECTRON LIMITED

Inventor： Ryotaro TAKAHASHI ,  Takehiro SHINDO

IPC: H01L21/68 ,  H01L21/687

Abstract: There is provided a semiconductor manufacturing apparatus including: a stage including a shaft provided to a surface opposite a mounting surface on which a substrate is mounted, and configured to be rotated by a driving force of a motor using the shaft as a rotation axis; a storage part storing a correction information on a rotational angle of the stage for each number of rotations in a plurality of rotations of the stage, the plurality of rotations corresponding to a cycle; and a rotation control part configured to control the motor based on the correction information and control the rotation of the stage.

公开(公告)号：US20200094399A1

公开(公告)日：2020-03-26

申请号：US16578791

申请日：2019-09-23

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takehiro SHINDO ,  Toshiaki KODAMA

IPC: B25J9/04 ,  B25J9/00 ,  B25J18/04 ,  H01L21/677 ,  H01L21/67 ,  B25J9/12

Abstract: There is provided a transport apparatus including: an articulated arm including: a first arm in which a drive motor is installed; a second arm configured to be driven by the first arm; a transmission portion configured to convert a rotation of the drive motor into a rotation of the second arm via a joint; a first detector configured to detect a first sensor value corresponding to a rotation angle of an input shaft of the transmission portion; and a second detector configured to detect a second sensor value corresponding to a rotation angle of the second arm; and a controller configured to control the articulated arm, wherein the controller is further configured to control the second arm to a target rotation angle based on the first sensor value and the second sensor value.

公开(公告)号：US20240222186A1

公开(公告)日：2024-07-04

申请号：US18609164

申请日：2024-03-19

Applicant: Tokyo Electron Limited

Inventor： Takehiro SHINDO

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677 ,  H02N15/00

CPC classification number: H01L21/68764 ,  H01L21/67167 ,  H01L21/67748 ,  H01L21/68707 ,  H02N15/00

Abstract: An apparatus for transferring a substrate to a substrate processing chamber includes: a substrate transfer chamber including a floor surface portion having a traveling surface-side magnet provided therein and a sidewall portion having an opening for transferring the substrate therethrough; a substrate transfer module including a substrate holder and a floating body-side magnet acting a repulsive force with the traveling surface-side magnet, and configured to be movable on a traveling surface formed in a region provided with the traveling surface-side magnet by magnetic floating using the repulsive force; the substrate processing chamber connected to the substrate transfer chamber via a gate valve constituting a non-traveling region in which the substrate transfer module is not movable by the magnetic floating; and a transfer assist mechanism for assisting the transfer of the substrate by the substrate transfer module between the substrate transfer chamber and the substrate processing chamber via the non-traveling region.

公开(公告)号：US20240120225A1

公开(公告)日：2024-04-11

申请号：US18273446

申请日：2022-01-12

Applicant: Tokyo Electron Limited

Inventor： Takehiro SHINDO ,  Akinori SHIMAMURA ,  Hiromitsu SAKAUE ,  Dongwei LI

IPC: H01L21/677 ,  H01L21/67

CPC classification number: H01L21/67709 ,  H01L21/67017

Abstract: Provided is an apparatus that transfers a substrate inside a substrate transfer chamber by a substrate transfer module using magnetic levitation. The apparatus includes: a substrate transfer chamber having a floor portion provided with a first magnet and connected, through an opening portion, to a substrate processing chamber in which the substrate is processed; and a substrate transfer module including a substrate holder configured to hold the substrate, and a second magnet configured such that a repulsive force acts between the first magnet and the second magnet. The substrate transfer module is movable inside the substrate transfer chamber by the magnetic levitation based on the repulsive force. The substrate transfer module performs loading/unloading of the substrate by directly entering into the substrate transfer chamber via the opening portion, or delivers the substrate to and from a substrate transfer mechanism fixedly provided inside the substrate transfer chamber.

公开(公告)号：US20240112936A1

公开(公告)日：2024-04-04

申请号：US18472157

申请日：2023-09-21

Applicant: Tokyo Electron Limited

Inventor： Mitsuyori SUWA ,  Takehiro SHINDO ,  Akio TATEISHI

IPC: H01L21/677

CPC classification number: H01L21/67709 ,  H01L21/67712 ,  H01L21/67742 ,  H01L21/67745

Abstract: A substrate transfer module includes: a transfer space in which a transport body including a magnet moves in a lateral direction while being levitated from a floor by magnetic force to transfer a substrate; a hole forming member having a through-hole formed in a vertical direction; a partition member that forms the floor by overlapping a hole edge portion of the through-hole in the vertical direction to block the through-hole, and defines the transfer space having an atmosphere that is separated from a non-transfer space including a portion under the floor outside the transfer space; and a plurality of electromagnets provided in the non-transfer space at positions overlapping the through-hole to move the transport body in the lateral direction, wherein each of the electromagnets is individually fed with power from a power feeder provided in the non-transfer space via a power feed line.

公开(公告)号：US20230166924A1

公开(公告)日：2023-06-01

申请号：US18055899

申请日：2022-11-16

Applicant: Tokyo Electron Limited

Inventor： Takehiro SHINDO

IPC: B65G47/90

CPC classification number: B65G47/90

Abstract: A substrate transfer device includes a tile-shaped section that includes a coil and a Hall element and that is provided in a transfer chamber, a transfer section that includes a permanent magnet and that is configured to move over the tile-shaped section to transfer a substrate, a temperature sensor configured to detect a temperature in the tile-shaped section, and a controller configured to estimate a position of the transfer section based on a temperature of the Hall element and a detection value of the Hall element. The temperature of the Hall element is determined based on the temperature detected by the temperature sensor.

公开(公告)号：US20230095452A1

公开(公告)日：2023-03-30

申请号：US17820039

申请日：2022-08-16

Applicant: Tokyo Electron Limited

Inventor： Tomoyuki OSHIMA ,  Takehiro SHINDO

IPC: H01L21/67 ,  H01L21/677 ,  C23C14/56

Abstract: A substrate processing system includes a load-lock module including load-lock module stages, a process module including process module stages, a vacuum transfer module that connects the load-lock module to the process module, a first transfer device that transfers substrates from the load-lock module stages to the process module stages, the first transfer device being provided in the vacuum transfer module, a second transfer device that transfers the substrates to the load-lock module stages, and a processor. The processor is configured to perform teaching a position at which the first transfer device receives the substrates from the load-lock module, teaching a position at which the first transfer device delivers the substrates to the process module, measuring shift amounts between the process module stages and the substrates mounted thereon, and correcting positions at which the second transfer device delivers the substrates to the load-lock module stages based on the measured shift amounts.

公开(公告)号：US20220340377A1

公开(公告)日：2022-10-27

申请号：US17721768

申请日：2022-04-15

Applicant: Tokyo Electron Limited

Inventor： Takehiro SHINDO ,  Wataru MATSUMOTO

IPC: B65G47/90 ,  B65G69/20

Abstract: A substrate transfer device that transfers a substrate, includes: a transfer arm including a substrate support and an arm; a cooler configured to distribute and supply a cooling fluid from a fluid supply source to each of cooling target regions of the arm; a measuring part configured to measure a temperature of each of the cooling target regions; and a controller. The controller is configured to: calculate a thermal index for each of the cooling target regions based on the amount of change of the temperature of the cooling target region measured by the measuring part from a reference temperature and a degree of influence of the temperature of the cooling target region affecting a movement accuracy of the substrate support; and determine a distribution ratio of the cooling fluid from the fluid supply source by the cooler based on the thermal index.

公开(公告)号：US20220336260A1

公开(公告)日：2022-10-20

申请号：US17659019

申请日：2022-04-13

Applicant: Tokyo Electron Limited

Inventor： Takehiro SHINDO

IPC: H01L21/687 ,  H01F7/02 ,  B65G54/02 ,  B65G43/08 ,  G05D1/02

Abstract: A substrate transfer device is provided with: a movement tile provided in a substrate transfer region and including first magnets for changing a state of a magnetic field and a movement surface; a substrate transfer module including a second magnet that receives a magnetic force and configured to move along the movement surface while being floated from the movement surface by the magnetic force; a transfer controller for controlling the magnetic field formed by the first magnets to move the substrate transfer module along a preset route; a detector for detecting an index value corresponding to a magnitude of a deviation, from the preset route, of an actual movement path of the substrate transfer module moving along the movement surface; and a correction parameter calculation part for calculating a correction parameter for correcting the magnetic force acting on the second magnet based on the index value.

公开(公告)号：US20220068683A1

公开(公告)日：2022-03-03

申请号：US17410241

申请日：2021-08-24

Applicant: Tokyo Electron Limited

Inventor： Wataru MATSUMOTO ,  Takehiro SHINDO

IPC: H01L21/677

Abstract: A method of controlling a substrate transfer system including a transfer mechanism having a holder, and a measurement part that detects an outer periphery of the substrate to measure a center position of the substrate, thereby transferring the substrate to a target position, includes: correcting the target position based on an amount of positional deviation between a reference position of the holder and the center position of the substrate, a first amount of thermal displacement of the reference position of the holder by thermal expansion of the transfer mechanism at a measurement position where the outer periphery of the substrate is detected, and a second amount of thermal displacement of the reference position of the holder by the thermal expansion of the transfer mechanism at the target position; and controlling the transfer mechanism such that the reference position of the holder becomes the corrected target position.