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    DETECTION DEVICE AND DETECTION METHOD
    1.
    发明公开
    DETECTION DEVICE AND DETECTION METHOD 审中-公开

    公开(公告)号：US20240077298A1

    公开(公告)日：2024-03-07

    申请号：US18457021

    申请日：2023-08-28

    Applicant: TOKYO ELECTRON LIMITED

    Inventor： Wataru MATSUMOTO

    IPC: G01B7/16

    CPC classification number: G01B7/16

    Abstract: A detection device according to one embodiment of the present disclosure includes an elastic member, a measuring part and a detection part. The elastic member is disposed between a first member and a second member at a bonding portion where the first member and the second member are bonded and the elastic member is configured to be elastically deformable. The measuring part is configured to measure electrical characteristics at multiple locations of the elastic member. The detecting part is configured to detect deformation of the elastic member based on the electrical characteristics measured at the multiple locations by the measuring part.

    SUBSTRATE CONVEYANCE METHOD AND SUBSTRATE CONVEYANCE DEVICE
    3.
    发明申请
    SUBSTRATE CONVEYANCE METHOD AND SUBSTRATE CONVEYANCE DEVICE 有权

    公开(公告)号：US20250006533A1

    公开(公告)日：2025-01-02

    申请号：US18697729

    申请日：2021-10-13

    Applicant: TOKYO ELECTRON LIMITED

    Inventor： Wataru MATSUMOTO ,  Takehiro SHINDO ,  Tatsuru OKAMURA ,  Nanako SHINODA ,  Junpei SASAKI

    IPC: H01L21/677 ,  H01L21/67 ,  H01L21/68

    Abstract: This substrate conveyance method is disclosed for a conveyance device. A conveyance chamber includes a conveyance mechanism having forks, on upper and lower sides, and support a substrate. A buffer chamber is connected to the conveyance chamber, and includes: a mounting unit that mounts a substrate; and, pins that support the substrate. In the method, the conveyance mechanism, with a second substrate supported by the lower fork, is inserted into the buffer chamber in which a first substrate is mounted on the mounting unit, and the first substrate is lifted by the upper fork. In the method, the pins are raised while the first substrate is lifted by the upper fork, and the second substrate supported by the lower fork is lifted by the pins. In the method, the conveyance mechanism is removed from the buffer chamber while the second substrate is lifted by the pins.

    TRANSFER DEVICE AND EXPANSION AMOUNT CALCULATION METHOD
    4.
    发明公开
    TRANSFER DEVICE AND EXPANSION AMOUNT CALCULATION METHOD 审中-公开

    公开(公告)号：US20240228190A1

    公开(公告)日：2024-07-11

    申请号：US18289525

    申请日：2021-08-11

    Applicant: TOKYO ELECTRON LIMITED

    Inventor： Toshiaki KODAMA ,  Wataru MATSUMOTO

    IPC: B65G47/90 ,  H01L21/677 ,  H01L21/687

    CPC classification number: B65G47/905 ,  H01L21/677 ,  H01L21/68707

    Abstract: In the present invention, an articulated arm is configured so that a plurality of arms are connected by rotatable joints, and by rotating the joints, the articulated arm can be extended and contracted. A detection unit detects the angle of rotation of the joints of the articulated arm, for different postures the number of which is at least the number of arms of the articulated arm. A calculation unit calculates the expansion amount of each of the plurality of arms on the basis of the angle of rotation of the joints at each of the postures detected by the detection unit.

    SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD
    8.
    发明公开
    SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD 审中-公开

    公开(公告)号：US20230143372A1

    公开(公告)日：2023-05-11

    申请号：US17976280

    申请日：2022-10-28

    Applicant: TOKYO ELECTRON LIMITED

    Inventor： Wataru MATSUMOTO

    IPC: H05B1/02 ,  H01L21/67 ,  H01L21/677 ,  B08B7/00

    CPC classification number: H05B1/0233 ,  H01L21/67265 ,  H01L21/67709 ,  B08B7/0071 ,  B08B7/005

    Abstract: An apparatus for transferring a substrate to a substrate processing chamber is provided. The apparatus comprises: a substrate transfer chamber having a floor provided with a first magnet and a sidewall connected to the substrate processing chamber and having an opening through which a substrate is loaded into and unloaded from the substrate processing chamber; a substrate transfer module including a substrate holder configured to hold the substrate and a second magnet having a repulsive force against the first magnet, and configured to move in the substrate transfer chamber by magnetic levitation using the repulsive force; and a heating device configured to heat the substrate transfer module to release contaminants adhered to a surface of the substrate transfer module.

    SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD
    9.
    发明申请
    SUBSTRATE TRANSFER APPARATUS AND SUBSTRATE TRANSFER METHOD 有权

    公开(公告)号：US20230117258A1

    公开(公告)日：2023-04-20

    申请号：US17962411

    申请日：2022-10-07

    Applicant: Tokyo Electron Limited

    Inventor： Wataru MATSUMOTO

    IPC: H01L21/683 ,  H01L21/677

    Abstract: A substrate transfer method for transferring a substrate using a first transfer body and at least one second transfer body comprises transferring the substrate using the first transfer body to a predetermined first substrate reference position in a module, receiving the substrate at the first substrate reference position using the second transfer body, and transferring the substrate to a detection device by moving the second transfer body to a predetermined first transfer body reference position and detecting positional misalignment in plan view between a position of the substrate and a predetermined second substrate reference position in the detection device. Each of the first transfer body and the second transfer body floats from a bottom portion of a substrate transfer area by a magnetic force and moves in a horizontal direction while supporting the substrate.

    SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER SYSTEM
    10.
    发明申请
    SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER SYSTEM 有权

    公开(公告)号：US20230019299A1

    公开(公告)日：2023-01-19

    申请号：US17810653

    申请日：2022-07-05

    Applicant: Tokyo Electron Limited

    Inventor： Wataru MATSUMOTO

    IPC: H01L21/67 ,  H01L21/687 ,  B65G47/90

    Abstract: A method includes: receiving a substrate on a first stage by a holder of a substrate transfer mechanism; causing the substrate to pass through a first measurement part, and measuring a first true deviation amount between the holder and the substrate at a first position; causing, when transferring the substrate toward a second stage, the substrate to pass through a second measurement part, and measuring a second true deviation amount between the holder and the substrate at a second position; reflecting a difference between the first and second true deviation amounts to a physical model to correct the physical model; calculating a position correction amount of the holder on the second stage from a thermal displacement amount of the holder at the second position; and controlling the substrate transfer mechanism based on the position correction amount to perform a position correction of the holder.

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