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公开(公告)号：US09982359B2
公开(公告)日：2018-05-29
申请号：US14955791
申请日：2015-12-01
发明人： Yuki Sato , Motoki Hiraoka , Hiroshi Yanagimoto
CPC分类号： C25F3/14 , C25D5/022 , C25D17/002 , C25F7/00
摘要： A surface treatment method includes: roughening a surface region of a substrate corresponding to a through hole provided to a masking plate by supplying a solvent to a solid electrolyte film from a second surface of a masking plate through the through hole, in a state where: a first surface of the solid electrolyte film is arranged directly on the surface of the substrate; and a first surface of the masking plate is arranged directly on a second surface of the solid electrolyte film, wherein the supplied solvent penetrates the solid electrolyte film, and dissolves the surface of the substrate.
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公开(公告)号：US09926640B2
公开(公告)日：2018-03-27
申请号：US14713549
申请日：2015-05-15
发明人： Fusayoshi Miura , Atsushi Murase , Naoki Hasegawa , Motoki Hiraoka , Yuki Sato
CPC分类号： C25D17/002 , C25D3/12 , C25D7/0607
摘要： An electroplating cell includes: an anode chamber in which an anode chamber solution is stored; and a separator that separates the anode chamber and a cathode. The electroplating cell undergoes a modification treatment of introducing a carboxylic acid group or a derivative thereof into a base material of the separator. The separator selectively allows permeation of metal ions contained in the anode chamber solution.
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公开(公告)号：US09909226B2
公开(公告)日：2018-03-06
申请号：US14912234
申请日：2014-08-20
发明人： Motoki Hiraoka , Hiroshi Yanagimoto , Yuki Sato
CPC分类号： C25D5/04 , C25D3/00 , C25D5/08 , C25D5/22 , C25D17/00 , C25D17/002 , C25D17/007 , C25D17/12 , C25D17/14 , C25D21/04
摘要： A solid electrolyte membrane (13) is arranged on a surface of an anode (11) between the anode (11) and a substrate (B) that serves as a cathode. The solid electrolyte membrane (13) is brought into contact with the substrate (B). At the same time, a metal film (F) is formed on the surface of the substrate (B) by causing metal to precipitate onto the surface of the substrate (B) from metal ions through application of voltage between the anode (11) and the substrate (B) in a first contact state where the solid electrolyte membrane (13) contacts the substrate (B). The metal ions are contained inside the solid electrolyte membrane (13).
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公开(公告)号：US09797055B2
公开(公告)日：2017-10-24
申请号：US14976572
申请日：2015-12-21
发明人： Yuki Sato , Motoki Hiraoka , Hiroshi Yanagimoto
IPC分类号： C25D5/06 , C25D17/14 , C25D3/02 , C25D3/00 , C25D17/00 , C25D17/10 , C25D17/12 , C25D3/12 , C25D3/38 , C25D5/08
CPC分类号： C25D3/02 , C25D3/00 , C25D3/12 , C25D3/38 , C25D5/06 , C25D5/08 , C25D17/00 , C25D17/10 , C25D17/12 , C25D17/14
摘要： Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A film formation device 1A is provided with an anode 11, a solid electrolyte film 13 disposed between the anode 11 and the base material B, and a power supply unit 16 that applies a voltage between the anode 11 and the base material B. The anode 11 is a non-porous anode comprising the same metal as the metal of the metal coating. Between the anode 11 and the solid electrolyte film 13, a porous material 14 is disposed in contact with the anode 11 and the solid electrolyte film 13. The porous material 14 includes a plurality of pores providing communication between the anode 11 and the solid electrolyte film 13 and being supplied with a metal solution L.
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公开(公告)号：US09708723B2
公开(公告)日：2017-07-18
申请号：US14613629
申请日：2015-02-04
发明人： Fusayoshi Miura , Atsushi Murase , Naoki Hasegawa , Motoki Hiraoka , Yuki Sato
CPC分类号： C25D17/002 , C25D3/12 , C25D5/06 , C25D21/14 , Y10T428/12875
摘要： An electroplating cell includes: (i) an anode chamber in which an anode chamber solution is stored; and (ii) a separator that includes a base material and an organic plating additive contained in the base material, separates the anode chamber and a cathode from each other, and selectively allows permeation of metal ions contained in the anode chamber solution.
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公开(公告)号：US20160186353A1
公开(公告)日：2016-06-30
申请号：US14976572
申请日：2015-12-21
发明人： Yuki Sato , Motoki Hiraoka , Hiroshi Yanagimoto
CPC分类号： C25D3/02 , C25D3/00 , C25D3/12 , C25D3/38 , C25D5/06 , C25D5/08 , C25D17/00 , C25D17/10 , C25D17/12 , C25D17/14
摘要： Provided is a metal coating film formation device capable of forming a film using a simple device configuration and in a short time, and capable of performing the formation of a film of metal coating continuously for a long period. A film formation device 1A is provided with an anode 11, a solid electrolyte film 13 disposed between the anode 11 and the base material B, and a power supply unit 16 that applies a voltage between the anode 11 and the base material B. The anode 11 is a non-porous anode comprising the same metal as the metal of the metal coating. Between the anode 11 and the solid electrolyte film 13, a porous material 14 is disposed in contact with the anode 11 and the solid electrolyte film 13. The porous material 14 includes a plurality of pores providing communication between the anode 11 and the solid electrolyte film 13 and being supplied with a metal solution L.
摘要翻译： 提供一种金属涂膜形成装置，其能够使用简单的装置构造并且在短时间内形成膜，并且能够长时间连续地形成金属涂层膜。 成膜装置1A设置有阳极11，设置在阳极11和基材B之间的固体电解质膜13，以及在阳极11和基材B之间施加电压的电源单元16.阳极 11是包含与金属涂层的金属相同的金属的无孔阳极。 在阳极11和固体电解质膜13之间，多孔材料14与阳极11和固体电解质膜13接触。多孔材料14包括提供阳极11和固体电解质膜之间连通的多个孔 并且被供给金属溶液L.
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