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公开(公告)号：US10199145B2
公开(公告)日：2019-02-05
申请号：US14237702
申请日：2012-11-12
发明人： Tetsuya Shoji , Akira Manabe , Noritaka Miyamoto , Motoki Hiraoka , Shinya Omura , Daisuke Ichigozaki , Shinya Nagashima
摘要： Provided is a rare-earth magnet containing no heavy rare-earth metals such as Dy or Tb in a grain boundary phase, has a modifying alloy for increasing coercivity (in particular, coercivity under a high-temperature atmosphere) infiltrated thereinto at lower temperature than in the conventional rare-earth magnets, has high coercivity, and has relatively high magnetizability, and a production method therefor. The rare-earth magnet RM includes a RE-Fe—B-based main phase MP with a nanocrystalline structure (where RE is at least one of Nd or Pr) and a grain boundary phase BP around the main phase, the grain boundary phase containing a RE-X alloy (where X is a metallic element other than heavy rare-earth elements). Crystal grains of the main phase MP are oriented along the anisotropy axis, and each crystal grain of the main phase, when viewed from a direction perpendicular to the anisotropy axis, has a plane that is quadrilateral in shape or has a close shape thereto.
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公开(公告)号：US09752246B2
公开(公告)日：2017-09-05
申请号：US15033967
申请日：2014-11-12
发明人： Motoki Hiraoka , Hiroshi Yanagimoto , Yuki Sato
CPC分类号： C25D5/06 , C25D3/00 , C25D17/00 , C25D17/002 , C25D17/005 , C25D17/14
摘要： Provided is film formation apparatus of a metal film and a film formation method therefor capable of forming a homogeneous metal film of a uniform thickness stably, while being less affected by the surface state of the anode. A film formation apparatus 1A includes: an anode 11; a solid electrolyte membrane 13 disposed between the anode 11 and a base B serving as a cathode; and a power supply unit 14 to apply voltage between the anode 11 and the base B, the film formation apparatus being configured so that, when the solid electrolyte membrane 13 is brought into contact with a surface of the base B, and voltage is applied between the anode 11 and the base B, metal is deposited on the surface of the base B from metal ions included inside of the solid electrolyte membrane 13, so that the metal film F made of the metal is formed. The film formation apparatus 1A includes a mounting base 21 on which the base B is to be placed, and the mounting base 21 has a suction unit 22 to suck the solid electrolyte membrane 13 from a side of the base B so that the solid electrolyte membrane 13 is brought into intimate contact with the surface of the base B during formation of the metal film F.
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公开(公告)号：US09677185B2
公开(公告)日：2017-06-13
申请号：US14779735
申请日：2014-02-04
发明人： Yuki Sato , Motoki Hiraoka , Hiroshi Yanagimoto
摘要： A film formation system for continuously forming metal films with desired thickness on the surfaces of substrates, and increase the film forming speed while suppressing abnormality of the metal films. A film formation system includes an anode; a solid electrolyte membrane between the anode and a substrate serving as a cathode such that a metal ion solution is disposed on the anode side thereof; and a power supply portion for applying a voltage across the anode and the substrate. A voltage is applied across the anode and the substrate o deposit metal out of the metal ions contained in the solid electrolyte membrane onto the substrate surface, thereby forming a metal film made of the metal ions. The anode has a base material, which is insoluble in the metal ion solution, and a metal plating film made of the same metal as the metal film, formed over the base material.
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公开(公告)号：US11735345B2
公开(公告)日：2023-08-22
申请号：US17804466
申请日：2022-05-27
发明人： Keiu Kanada , Reimi Sakaguchi , Masaaki Ito , Takuya Nomura , Daisuke Ichigozaki , Motoki Hiraoka , Mitsutoshi Akita
CPC分类号： H01F13/003 , H01F7/021
摘要： The method for manufacturing the Halbach magnet array includes the steps of: (a) magnetizing at least two first magnetic material pieces in a direction parallel to a first direction, and (b) magnetizing at least one second magnetic material piece in a direction parallel to a second direction perpendicular to the first direction, in this order. In the step (a), the first magnetic material pieces and the second magnetic material piece are alternately arranged in the second direction with the first magnetic material pieces being each adhered to the adjacent second magnetic material piece, and the magnetization is performed under a condition in which a residual magnetization ratio r1 of the first magnetic material pieces is higher than a residual magnetization ratio r2 of the second magnetic material piece.
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公开(公告)号：US10920331B2
公开(公告)日：2021-02-16
申请号：US14910416
申请日：2014-08-04
发明人： Yuki Sato , Hiroshi Yanagimoto , Motoki Hiraoka
摘要： A film deposition device (1A) of a metal film (F) includes a positive electrode (11), a solid electrolyte membrane (13), and a power supply part (14) that applies a voltage between the positive electrode (11) and a base material (B) to be a negative electrode. The solid electrolyte membrane (13) allows a water content to be 15% by mass or more and is capable of containing a metal ion. The power supply part (14) applies a voltage between the positive electrode and the base material in a state where the solid electrolyte membrane is disposed on a surface of the positive electrode such that metal made of metal ions contained inside the solid electrolyte membrane (13) is precipitated on a surface of the base material (B).
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公开(公告)号：US09840786B2
公开(公告)日：2017-12-12
申请号：US14910365
申请日：2014-08-04
发明人： Yuki Sato , Hiroshi Yanagimoto , Motoki Hiraoka
摘要： A film deposition device (1A) of a metal film includes: a solid electrolyte membrane (13) that allows metal ions to be contained; a positive electrode (11) made of a porous body; a power supply part (14) that applies a voltage between the positive electrode and a base material; and a contact pressurization part (20) that comes into contact with the positive electrode (11) and uniformly pressurizes a film deposition region of a surface of the base material by the solid electrolyte membrane (13) via the positive electrode (11). The positive electrode (11) made of the porous body is capable of transmitting a solution containing the metal ions such that the metal ions are supplied to the solid electrolyte membrane. The power supply part (14) applies a voltage between the positive electrode and the base material so that the metal film made of the metal is deposited.
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公开(公告)号：US09752249B2
公开(公告)日：2017-09-05
申请号：US15062293
申请日：2016-03-07
发明人： Motoki Hiraoka , Hiroshi Yanagimoto , Yuki Sato
摘要： A film forming apparatus includes: an anode; a solid electrolyte membrane that is arranged between the anode and an substrate that serves as a cathode, and that contains metal ions; a power supply that applies a voltage between the anode and the substrate in a state in which the solid electrolyte membrane is in contact with the substrate from above; and an oscillating portion configured to oscillate at least the anode in the state in which the solid electrolyte membrane is in contact with the substrate.
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公开(公告)号：US11309777B2
公开(公告)日：2022-04-19
申请号：US17192263
申请日：2021-03-04
发明人： Keiu Kanada , Daisuke Ichigozaki , Kazuaki Haga , Motoki Hiraoka , Daichi Maruyama , Hisamitsu Toshida , Kyoko Nakamura , Akira Yamashita
摘要： A rotating electrical machine capable of obtaining a higher torque while limiting the amount of permanent magnets used. A magnetic pole of a rotor includes an auxiliary magnet embedded in a rotor core and at least one main magnet arranged on an outer circumferential side than the auxiliary magnet of the rotor. In each magnetic pole, the distance from an end of the main magnet, the end facing the auxiliary magnet, to the auxiliary magnet facing the main magnet is shorter than the length of the main magnet in the radial direction. In a cross-section orthogonal to the rotation axis of the rotating electrical machine, the main magnets of each magnetic pole are arranged so as to be asymmetrical about a virtual line passing the rotation axis and axisymmetrically dividing the auxiliary magnet.
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公开(公告)号：US10760172B2
公开(公告)日：2020-09-01
申请号：US16395544
申请日：2019-04-26
发明人： Yuki Sato , Motoki Hiraoka , Hirofumi Iisaka
摘要： In a film forming method, in a state where a metal solution is sealed in a first accommodation chamber of a housing with a solid electrolyte membrane and a fluid is sealed in a second accommodation chamber of a placing table with a thin film, a substrate is placed on the placing table and the placing table and the housing are moved relative to each other to cause the substrate to be interposed between the solid electrolyte membrane and the thin film, the solid electrolyte membrane and the thin film are pressed against the substrate interposed therebetween to cause the solid electrolyte membrane and the thin film to conform to a surface and a rear surface of the substrate, thereby forming a metal film.
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公开(公告)号：US10301735B2
公开(公告)日：2019-05-28
申请号：US15118327
申请日：2015-02-09
IPC分类号： C25D5/18 , C25D3/00 , C25D5/02 , C25D5/06 , C25D17/14 , C25D3/12 , C25D5/12 , C25D17/00 , C25D17/12
摘要： A method of forming a metal coating includes: disposing a solid electrolyte membrane (13) between an anode (11) and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side portion of the solid electrolyte membrane (13); and causing, in a state where the solid electrolyte membrane (13) is in contact with the substrate (B), a current to flow from the anode (11) to the cathode so as to form a metal coating formed of the metal on the surface of the substrate (B). The metal coating is formed by repeating a current-flowing period (T) in which a current flows from the anode (11) to the cathode and a non-current-flowing period (N) in which a current does not flow between the anode (11) and the cathode.
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