POWER GRID, IC AND METHOD FOR PLACING POWER GRID

    公开(公告)号:US20200279812A1

    公开(公告)日:2020-09-03

    申请号:US16875060

    申请日:2020-05-15

    Abstract: A power grid of an integrated circuit (IC) is provided. The power grid includes a plurality of first power lines formed in a first metal layer, a plurality of second power lines formed in the first metal layer, a plurality of third power lines formed in a second metal layer and a plurality of fourth power lines formed in the second metal layer. The second power lines are parallel to the first power lines, and the first and second power lines are interlaced in the first metal layer. The third power lines are perpendicular to the first power lines. The fourth power lines are parallel to the third power lines, and the third and fourth power lines are interlaced in the second metal layer. A first power pitch between two adjacent third power lines is greater than a second power pitch between two adjacent fourth power lines.

    LEAKAGE ANALYSIS ON SEMICONDUCTOR DEVICE
    22.
    发明申请

    公开(公告)号:US20200226229A1

    公开(公告)日:2020-07-16

    申请号:US16586658

    申请日:2019-09-27

    Abstract: A method is utilized to calculate a boundary leakage in a semiconductor device. A boundary is detected between a first cell and a second cell, which the first cell and the second cell are abutted to each other around the boundary. Attributes associated with cell edges of the first cell and the second cell are identified. A cell abutment case is identified based on the attributes associated with the cell edges of the first cell and the second cell. An expected boundary leakage between the first cell and the second cell is calculated based on leakage current values associated with the cell abutment case and leakage probabilities associated with the cell abutment case.

    CELL PLACEMENT SITE OPTIMIZATION
    24.
    发明申请

    公开(公告)号:US20180357351A1

    公开(公告)日:2018-12-13

    申请号:US15882288

    申请日:2018-01-29

    CPC classification number: G06F17/5072 G06F2217/02

    Abstract: The present disclosure describes an example method for cell placement in an integrated circuit (IC) layout design. The method includes partitioning a layout area into one or more contiguous units, where each unit includes a plurality of placement sites. The method also includes mapping a first set of pin locations and a second set of pin locations to each of the one or more contiguous units. The method further includes placing a cell in the one or more contiguous units, where the cell is retrieved from a cell library that includes a plurality of pin locations for the cell. The placement of the cell is based on an allocation of one or more pins associated with the cell to at least one of a pin track from the first plurality of pin locations, a pin track from second plurality of pin locations, or a combination thereof.

    POWER GRID, IC AND PLACEMENT METHOD FOR POWER GRID

    公开(公告)号:US20180166386A1

    公开(公告)日:2018-06-14

    申请号:US15651165

    申请日:2017-07-17

    Abstract: A power grid of an integrated circuit (IC) is provided. The power grid includes a plurality of first power lines formed in a first metal layer, a plurality of second power lines formed in the first metal layer and parallel to the first power lines, a plurality of third power lines formed in a second metal layer, and a plurality of fourth power lines formed in the second metal layer and parallel to the third power lines. The first and second power lines are interlaced in the first metal layer. The third and fourth power lines are interlaced in the second metal layer. Distances from the individual first power line to the two adjacent second power lines are the same, and distances from the individual third power line to the two adjacent fourth power lines are different.

    LEAKAGE ANALYSIS ON SEMICONDUCTOR DEVICE

    公开(公告)号:US20210264093A1

    公开(公告)日:2021-08-26

    申请号:US17315023

    申请日:2021-05-07

    Abstract: A system includes a library, a processor and an output interface. The library contains at least one leakage lookup table related to leakage current values for different cell abutment cases of abutted cells in a semiconductor device. The cell abutment cases are associated with terminal types of cell edges of the abutted cells. The processor is configured to perform an analysis to detect boundaries between the abutted cells, identify attributes associated with the terminal types of the cell edges, identify the cell abutment cases based on the attributes, and calculate maximal boundary leakages between the abutted cells based on leakage current values associated with the cell abutment cases and leakage probabilities associated with the cell abutment cases. The output interface is for outputting boundary leakages corresponding to the maximal boundary leakages in the semiconductor device. A method is also disclosed herein.

    BLOCK-LEVEL DESIGN METHOD FOR HETEROGENEOUS PG-STRUCTURE CELLS

    公开(公告)号:US20180210993A1

    公开(公告)日:2018-07-26

    申请号:US15723308

    申请日:2017-10-03

    Abstract: A partitioning method for partitioning a group of power-ground (PG) cells is disclosed. The method includes forming a first partition by selecting at least one in-boundary PG cell from the group of PG cells, adding at least one out-boundary PG cell from the group of PG cells into the first partition, forming a second partition by selecting the remaining in-boundary PG cells and the remaining out-boundary PG cells in the group of PG cells, calculating the total area of the in-boundary PG cells in the first partition, calculating the total area of the out-boundary PG cells in the first partition, calculating the total area of the in-boundary PG cells in the second partition, calculating the total area of the out-boundary PG cells in the second partition, and calculating the difference between the total areas of in-boundary PG cells in the first partition and the out-boundary PG cells in the first partition.

    CIRCUIT TESTING AND MANUFACTURE USING MULTIPLE TIMING LIBRARIES

    公开(公告)号:US20180173832A1

    公开(公告)日:2018-06-21

    申请号:US15703781

    申请日:2017-09-13

    CPC classification number: G06F17/5031 G06F17/5036 G06F17/5068 G06F2217/84

    Abstract: A method includes generating a first timing library for a first set of circuit elements for a first set of input parameters. Generating the first timing library includes determining device characteristics for each of the circuit elements in the first set of circuit elements and storing the determined device characteristics in a database. A second timing library is generated for a second set of circuit elements for a second set of input parameters. The second timing library is generated by using one or more of the determined device characteristics previously stored in the database. A circuit is formed on a substrate. The circuit includes at least one of the first set of circuit elements or the second set of circuit elements.

    SYSTEM AND METHOD FOR MULTI-PATTERNING
    30.
    发明申请

    公开(公告)号:US20170169154A1

    公开(公告)日:2017-06-15

    申请号:US14967061

    申请日:2015-12-11

    CPC classification number: G06F17/5068 G06F17/5081 G06F17/509

    Abstract: A method is disclosed that includes the operation below. Vertices in a conflict graph are sorted into a first clique and a second clique, in which the conflict graph corresponds to a layout of a circuit. A first vertex of the vertices is merged with a second vertex of the vertices, to generate a reduced graph, in which the first clique excludes the second vertex, and the second clique excludes the first vertex. A first color pattern of a plurality of color patterns is assigned to a first pattern, corresponding to the first vertex, and a second pattern, corresponding to the second vertex, in the layout according to the reduced graph.

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