公开(公告)号：US20200350197A1

公开(公告)日：2020-11-05

申请号：US16934394

申请日：2020-07-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Chih-Wei Lin ,  Hui-Min Huang ,  Ai-Tee Ang ,  Yu-Peng Tsai ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/683 ,  H01L25/10 ,  H01L23/498 ,  H01L23/31 ,  H01L25/00 ,  H01L23/00 ,  H01L21/56

Abstract: A method comprises forming a plurality of interconnect structures including a dielectric layer, a metal line and a redistribution line over a carrier, attaching a semiconductor die on a first side of the plurality of interconnect structures, forming an underfill layer between the semiconductor die and the plurality of interconnect structures, mounting a top package on the first side the plurality of interconnect structures, wherein the top package comprises a plurality of conductive bumps, forming an encapsulation layer over the first side of the plurality of interconnect structures, wherein the top package is embedded in the encapsulation layer, detaching the carrier from the plurality of interconnect structures and mounting a plurality of bumps on a second side of the plurality of interconnect structures.

公开(公告)号：US20190221544A1

公开(公告)日：2019-07-18

申请号：US16360411

申请日：2019-03-21

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Meng-Tse Chen ,  Yu-Chih Liu ,  Hui-Min Huang ,  Wei-Hung Lin ,  Jing Ruei Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L25/065 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L25/00

CPC classification number: H01L25/0652 ,  H01L21/561 ,  H01L21/563 ,  H01L23/00 ,  H01L23/293 ,  H01L23/3121 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/15311

Abstract: The present disclosure, in some embodiments, relates to a method of forming a package. The method includes coupling a first package component to a second package component using a first set of conductive elements. A first polymer-comprising material is formed over the second package component and surrounding the first set of conductive elements. The first polymer-comprising material is cured to solidify the first polymer-comprising material. A part of the first polymer-comprising material is removed to expose an upper surface of the second package component. The second package component is coupled to a third package component using a second set of conductive elements that are formed onto the upper surface of the second package component.