摘要:
A semiconductor integrated circuit device includes: a plurality of data holding circuits; and a plurality of wells. The plurality of data holding circuits is provided in a substrate of a first conductive type. Each of the plurality of data holding circuits includes a first well of the first conductive type and a second well of a second conductive type different from the first conductive type. The plurality of wells is arranged in two directions for the each of the plurality of data holding circuits.
摘要:
Disclosed is a semiconductor device including a mode control circuit that, when a standby control signal is in an activated state, based on a timer output signal from a timer circuit, generates a MODE control output signal that changes a logic state of a functional circuit part at every prescribed time interval, and an output control circuit that receives an output signal of the functional circuit part and controls output of the output signal; based on a delay output signal generated by delaying a MODE control output signal by a delay circuit. While the functional circuit part is changing the logic state by the MODE control output signal, the output control circuit does not transfer the functional circuit part output signal to output, but holds and outputs a functional circuit part output signal immediately before the functional circuit part changes the logic state by the MODE control output signal.
摘要:
Provided is a destructive readout semiconductor memory device capable of avoiding concentration of a writeback current, in which a switch circuit (24) is provided between each bit line (21) and each sense amplifier (26). In writeback, the switch circuits are turned on at staggered time points. In readout, the switch circuits are turned on to read memory cell data to the sense amplifiers while the sense amplifiers are turned off, and the switch circuits are then turned off once. After that, the sense amplifiers are turned on to amplify the read data. The switch circuits are subsequently divided into groups and turned on again to write back the data amplified by the sense amplifiers to the memory cells. The switch circuits are divided into groups to be turned on at staggered time points during the writeback, to thereby avoid concentration of the writeback current in one time period.
摘要:
The semiconductor integrated circuit device includes a voltage control circuit that generates a control voltage for deactivating a field effect transistor by a gate voltage. The voltage control circuit controls a voltage so as to substantially minimize the leakage current which flows when the field effect transistor is inactive with respect to a device temperature.
摘要:
The invention provides a gas insulated switchgear, and a method for detecting arc damage in a part used in a gas insulated switchgear, which detect directly when an electric contact or a peripheral part reaches an initially set wear limit. An insulating nozzle of a circuit breaker contains a marking substance that releases a gaseous substance inside a circuit breaker gas container as a result of wear by an arc. For ensuring heat resistance and insulation properties, the insulating nozzle is ordinarily formed of a fluororesin, but in the present invention, it is formed of the ordinarily used fluororesin having uniformly mixed therein, as the marking substance, a chlorine-containing resin which has excellent heat resistance and insulation properties such as polyvinylidene chloride.
摘要:
A semiconductor device has an SOI (Silicon On Insulator) structure and comprising a P-channel FET and an N-channel FET which are formed on an insulating film. The semiconductor device includes: at least two of first, second, third and fourth PN-junction elements. The first PN-junction element is formed from a P-type semiconductor layer and an N-type semiconductor layer having the same impurity concentrations as those of source/drain regions of the P-channel FET and the N-channel FET, respectively. The second PN-junction element is formed from a P-type semiconductor layer and an N-type semiconductor layer having the same impurity concentrations as those of the source/drain region and a channel region in the P-channel FET, respectively. The third PN-junction element is formed from a P-type semiconductor layer and an N-type semiconductor layer having the same impurity concentrations as those of a channel region and the source/drain region in the N-channel FET, respectively. The fourth PN-junction element is formed from a P-type semiconductor layer and an N-type semiconductor layer having the same impurity concentrations as those of the channel regions of the N-channel FET and the P-channel FET, respectively. At least two PN-junction elements are connected in series in a forward bias between two different terminals to form an electrostatic protection device.
摘要:
A semiconductor integrated circuit includes a word line extending along a first direction, a first and a second N-well regions, a P-well region disposed between the first and the second N-well regions, a memory cell having a first, second, third, and fourth PMOS transistors, and a first and second NMOS transistors, the first and the second PMOS transistors disposed in the first N-well region along a second direction which is different from the first direction, the first and the second NMOS transistors disposed in the P-well region, and the third and the fourth PMOS transistors disposed in the second N-well region along the second direction.
摘要:
A semiconductor integrated circuit device includes a power supply line connected to a power supply terminal, a ground line connected to a ground terminal and a plurality of capacitors connected in parallel between the power supply line and the ground line. The plurality of capacitors include a first capacitor arranged at a first distance from one of the terminals and a second capacitor arranged at a second distance which is larger than the first distance from the one of the terminals, and the first capacitor has a larger area than the second capacitor.
摘要:
A semiconductor device according to an embodiment of the invention includes: a plurality of field effect transistors; and a plurality of logic circuits composed of the field effect transistors, the field effect transistors each including: first and second drain regions formed away from each other; at least one source region formed between the first and second drain regions; and a plurality of gate electrodes formed between the first drain region and the source region and between the second drain region and the source region.
摘要:
A method of manufacturing a semiconductor device includes performing a first etching process on a gate electrode layer to form a gate electrode of a first transistor group including a transistor pair, and performing a second etching process different from the first etching on the gate electrode layer to form a gate electrode of a second transistor group. Forming in this way enables characteristics of the transistor pair to be the same.