摘要:
A semiconductor integrated circuit includes a word line extending along a first direction, a first and a second N-well regions, a P-well region disposed between the first and the second N-well regions, a memory cell having a first, second, third, and fourth PMOS transistors, and a first and second NMOS transistors, the first and the second PMOS transistors disposed in the first N-well region along a second direction which is different from the first direction, the first and the second NMOS transistors disposed in the P-well region, and the third and the fourth PMOS transistors disposed in the second N-well region along the second direction.
摘要:
There is provided a method of fabricating a semiconductor device, including the steps of forming a silicon oxide film on a semiconductor substrate for defining device isolation regions therewith, forming a gate oxide film over the product resulting from the previous step, forming an electrically conductive film over the product resulting from the previous step, forming a first insulating film over the electrically conductive film, etching the first insulating film and the electrically conductive film to thereby form a first wiring layer comprising a plurality of sections, forming a second insulating film around a sidewall of the sections of the first wiring layer, forming a first interlayer insulating film over the product resulting from the previous step, simultaneously forming a first contact hole reaching the semiconductor substrate and a second contact hole reaching the first wiring layer, forming a second wiring layer over the product resulting from the previous step, forming a second interlayer insulating film over the product resulting from the previous step, simultaneously forming a third contact hole reaching the semiconductor substrate and a fourth contact hole reaching the second wiring layer, forming a contact plug in each of the third and fourth contact holes, and forming a third wiring layer on the second interlayer insulating film so as to make contact with the contact plug. The above-mentioned method reduces the number of masks to be used for fabricating a semiconductor device, ensuring the enhancement of productivity, and presents the greater designability of forming a contact hole above a gate.
摘要:
In a resistance element formed by a connection layer including a flexing portion, the connection layer is constructed by a high resistance section including the flexing portion and a low resistance section. Boundaries between the high resistance section and the low resistance section are approximately in parallel with a bisector of the connection layer at the flexing portion.
摘要:
A semiconductor memory device capable of high-speed operation, low-voltage operation, and low power-consumption. First and second driver transistors are laid out in such a way that the channel regions of first and second driver transistors extend in a direction oblique to first and second word lines. First and second transfer transistors are laid out in such a way that the channel regions of the first and second transfer transistors extend in a direction perpendicular to the first and second word lines. The channel regions of the first and second transfer transistors and the contact resistance of the first and second bit contacts are substantially constant independent of an allowable overlay error, respectively, thereby keeping the capability of the first and second transfer transistors and the bit contact resistance the same independent of the allowable overlay error.
摘要:
Beverage brewing apparatus suitable for use in a vending machine has a frame supporting a vertically movable open bottom cylinder and a piston slidably disposed within the cylinder. A brewing cavity is disposed beneath the cylinder to enable reciprocation horizontally between a brewing position and a rest position. The horizontal movement of the cavity is controlled through a cable running around a pulley rotatably supported on the frame. The pulley is provided with a mechanism for adjusting the position thereof to determine the brewing position and rest position of the cavity to ensure secure engagement between the cylinder and brewing cavity.
摘要:
In addition to a memory macro region and functional circuit regions on a substrate, a semiconductor integrated circuit device includes a dummy pattern region 40 arranged between the functional circuit regions and between the memory macro region 10 and the functional circuit regions and including a dummy pattern. The dummy pattern has a pattern identical to that of diffusion layers and gate electrodes of a memory cell pattern in a memory cell array region. An area ratio of dummy diffusion layer(s) and dummy gate electrode(s) in the dummy pattern region is equal to or greater than that of the diffusion layers and the gate electrode(s) in the memory cell array region.
摘要:
A semiconductor device according to an embodiment of the present invention includes: a first region having patterns formed based on grid points as intersections of grid lines; and a second region including a plurality of layout cells an outer edge of which is defined by the grid points, the layout cells having patterns formed based on a wiring rule with patterns connected to patterns of the first region among the patterns being formed based on the grid points at a boundary with the first region.
摘要:
A manufacturing method of semiconductor device includes: forming a nitride film above a silicon substrate including a first region and a second region which respectively correspond to an outside of a memory cell region and the memory cell region; forming trenches reaching from the nitride film to the silicon substrate; retreating the nitride film such that widths of the trenches at the nitride film become wider; forming a buried oxide film to be buried in the trenches after the retreating; polishing the buried oxide film with the nitride film being used as a stopper; removing the nitride film after the polishing; implanting impurity after the removing; forming gate electrodes after the implanting; and implanting impurity after the forming the gate electrodes.
摘要:
To provide a semiconductor device and a process for manufacturing the same which is capable of suppressing short channel effect and preventing a current from leaking between a contact and a silicon substrate. The semiconductor device of the present invention comprises a silicon substrate on which a source/drain area (3 in FIG. 1), a silicon oxide layer (4 in FIG. 1) and a silicon nitride layer (5 in FIG. 1) are successively formed in this order, and a trench which extend through said layers to split the source/drain area. A columnar gate electrode (9 in FIG. 1) is formed within the trench in such a manner that it is spaced from the inner wall of the trench and a lightly doped drain (LDD) area (10 in FIG. 1) is formed at an area of the bottom of the trench in which no gate electrode is disposed. In such a structure, the short channel effect which occurs in association with reduction in the gate length is suppressed.
摘要:
A semiconductor device comprising, on a semiconductor substrate, an element-isolating region, an active region, and a gate electrode with a bent portion having a bent-angle &thgr; on the active region. The boundary between the element-isolating region and the active region intersects the gate electrode so that the line segments of the boundary at which said intersection takes place, are approximately parallel to the bisector of the bent-angle &thgr; of the bent portion of the gate electrode. In this semiconductor device, the variation in width of gate electrode is small and accordingly the variation in properties is small, even when the relative position of gate electrode and active region of MOSFET has shifted slightly.