公开(公告)号：US07709085B2

公开(公告)日：2010-05-04

申请号：US10581928

申请日：2004-12-07

申请人： Koichi Shibayama ,  Koji Yonezawa ,  Kazuyoshi Shiomi ,  Motohiro Yagi ,  Hidenobu Deguchi ,  Nobuhiro Goto

发明人： Koichi Shibayama ,  Koji Yonezawa ,  Kazuyoshi Shiomi ,  Motohiro Yagi ,  Hidenobu Deguchi ,  Nobuhiro Goto

IPC分类号： B32B15/16 ,  C08L63/00 ,  C08K3/24 ,  B32B27/20 ,  B32B27/38

CPC分类号： H01L23/295 ,  C08G59/625 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K2201/0245 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/31525 ,  H01L2924/00

摘要： A thermosetting resin composition capable of providing a molding, such as a resin sheet, that excels in not only dielectric characteristics but also dimensional stability at high temperature and even after exposure to high temperature thermal history, exhibits little dimensional change by the thermal history, namely, exhibiting low linear expansion coefficient. There are further provided a resin sheet and resin sheet for insulated substrate produced from the thermosetting resin composition. In particular, there is provided a thermosetting resin composition comprising an epoxy resin of 100 to 2000 epoxy equivalent, an epoxy resin hardening agent consisting of a phenolated compound, and a layered silicate, and are further provided a resin sheet comprised of the thermosetting resin composition and a resin sheet for insulated substrate comprised of the resin sheet.

摘要翻译： 能够提供诸如树脂片的成型体的热固性树脂组合物，不仅具有介电特性，而且在高温下甚至在暴露于高温热历史之后都具有优异的尺寸稳定性，其热历史几乎没有尺寸变化，即 ，显示出低的线性膨胀系数。 此外，还提供了由热固性树脂组合物制成的用于绝缘基板的树脂片和树脂片。 特别地，提供一种热固性树脂组合物，其包含环氧树脂为100至2000环氧当量的环氧树脂，由酚化合物和层状硅酸盐组成的环氧树脂硬化剂，并且还提供由热固性树脂组合物 以及由树脂片构成的绝缘基板用树脂片。

公开(公告)号：US20070191555A1

公开(公告)日：2007-08-16

申请号：US10811952

申请日：2004-03-30

申请人： Hatsuo Ishida ,  Koichi Shibayama ,  Hiroshi Abe

发明人： Hatsuo Ishida ,  Koichi Shibayama ,  Hiroshi Abe

IPC分类号： C08L63/02 ,  C08L63/04

CPC分类号： C08G59/027 ,  C08G59/4014 ,  H05K1/0346

摘要： The invention provides a thermosetting resin composition comprising a bifunctional dihydrobenzoxazine compound and an epoxy compound, and provides a thermosetting resin molding obtained by thermally curing the thermosetting resin composition. The molding has excellent electric properties of low dielectric constant and low dielectric loss tangent. The resin composition comprises an epoxy compound and a bifunctional dihydrobenzoxazine compound of the following general formula (1), wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20): wherein R represents a linear alkylene group having at least 2 carbon atoms, or a branched alkylene group derived from it by substituting the hydrogen atom therein with an alkyl group, and the hydrogen atom of the benzene ring may be substituted with an alkyl group or an alkoxy group.

摘要翻译： 本发明提供一种包含双官能二氢苯并恶嗪化合物和环氧化合物的热固性树脂组合物，并提供通过热固化热固性树脂组合物获得的热固性树脂模制品。 该模制品具有优异的低介电常数和低介电损耗角正切的电性能。 树脂组合物包含下述通式（1）的环氧化合物和双官能二氢苯并恶嗪化合物，其中环氧化合物与双官能二氢苯并恶嗪化合物的当量比为1 /（0.1〜20）：其中R表示直链亚烷基 具有至少2个碳原子，或者由烷基衍生自其中的氢原子衍生的支链亚烷基，苯环的氢原子可以被烷基或烷氧基取代。

公开(公告)号：US06924334B1

公开(公告)日：2005-08-02

申请号：US10129988

申请日：2000-11-10

申请人： Juichi Fukatani ,  Koichi Shibayama ,  Koji Taniguchi ,  Hideyuki Takahashi ,  Akihiko Bando ,  Koichiro Iwasa ,  Naoki Ueda

发明人： Juichi Fukatani ,  Koichi Shibayama ,  Koji Taniguchi ,  Hideyuki Takahashi ,  Akihiko Bando ,  Koichiro Iwasa ,  Naoki Ueda

IPC分类号： C08K3/34 ,  C08K7/00 ,  C08L23/00 ,  C08L23/26 ,  H01B3/44

CPC分类号： H01B3/441 ,  C08K7/00 ,  C08L2201/02 ,  C08L23/02

摘要： It is an object of the present invention to provide a polyolefin resin composition excellent in flame retardancy, in particular capable of manifesting excellent flame retardancy owing to a shape retaining effect upon combustion, and excellent also in mechanical strength and thermal characteristics, a thermoplastic resin for cable jacketing or sheathing which comprises the above resin composition, and an insulated cable.The present invention relates to a polyolefin resin composition comprising 100 parts by weight of a polyolefin resin and 0.1 to 100 parts by weight of a layered silicate, wherein a combustion residue thereof obtained by combusting said polyolefin resin composition by heating for 30 minutes under heating condition of 50 kW/m2 shows a yield point stress of not less than 4.9×103 Pa when compressed at a rate of 0.1 cm/s.

摘要翻译： 本发明的目的是提供一种阻燃性优异的聚烯烃树脂组合物，特别是由于燃烧时的形状保持作用而具有优异的阻燃性，而且机械强度和热特性优异的热塑性树脂， 包含上述树脂组合物的电缆护套或护套，以及绝缘电缆。 本发明涉及一种聚烯烃树脂组合物，其包含100重量份的聚烯烃树脂和0.1至100重量份的层状硅酸盐，其中通过在加热条件下加热所述聚烯烃树脂组合物30分钟而获得的燃烧残余物 50kW / m 2的压力表示以0.1cm / s的速度压缩时的屈服点应力不小于4.9×10 3 Pa。

公开(公告)号：US20050107497A1

公开(公告)日：2005-05-19

申请号：US10503490

申请日：2003-02-04

申请人： Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

发明人： Kazunori Akaho ,  Koji Yonezawa ,  Motohiro Yagi ,  Akihiko Fujiwara ,  Koichi Shibayama ,  Hidenobu Deguchi

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  C08L63/00

CPC分类号： C08K3/346 ,  H05K1/0373 ,  H05K1/0393 ,  H05K3/4626 ,  H05K3/4635 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/269

摘要： A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed board, prepreg and adhesive sheet are provided which exhibit improved mechanical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. A resin composition containing 100 parts by weight of a thermosetting resin and 0.1-65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient (α2) of up to 17×10−3 [° C.−1] over the temperature range from a temperature 10° C. higher than a glass transition temperature of the resin composition to a temperature 50° C. higher than the glass transition temperature of the resin composition.

摘要翻译： 提供树脂组合物，基材，片，层压板，含树脂铜箔，覆铜层压板，TAB带，印刷板，预浸料和粘合片，其具有改进的机械性能，尺寸稳定性，耐热性和阻燃性， 特别是高温物理性能。 含有100重量份热固性树脂和0.1-65重量份无机化合物的树脂组合物，该树脂组合物的平均线性膨胀系数（α2）高达17×10 -3 [ 在比树脂组合物的玻璃化转变温度高10℃的温度到比树脂的玻璃化转变温度高50℃的温度的温度范围内， 组成。

公开(公告)号：US20050020704A1

公开(公告)日：2005-01-27

申请号：US10918552

申请日：2004-08-16

申请人： Koichiro Iwasa ,  Hiroki Erami ,  Naoki Ueda ,  Koichi Shibayama ,  Juichi Fukatani

发明人： Koichiro Iwasa ,  Hiroki Erami ,  Naoki Ueda ,  Koichi Shibayama ,  Juichi Fukatani

IPC分类号： C04B20/00 ,  C04B26/04 ,  C08J9/00 ,  C08J9/04 ,  C08K3/00

CPC分类号： C04B20/0024 ,  C04B26/045 ,  C08J9/0066 ,  C08J9/04 ,  C04B14/20 ,  C04B14/106

摘要： A thermoplastic foam is provided which contains a thermoplastic resin and a layered silicate and in which foam cells and the layered silicate are evenly and finely dispersed. A volume-expansible gas or heat decomposable blowing agent is incorporated into interlayer spaces of a layered silicate in a composite material containing 100 parts by weight of a thermoplastic resin and 0.1-50 parts by weight of the layered silicate, and the gas or blowing agent is allowed to expand in volume or thermally decompose to form foam cells 6, so that a thermoplastic foam is obtained in which the layered silicate has an average interlayer spacing of over 60 Å when determined by an X-ray diffractometry.

摘要翻译： 提供了一种热塑性泡沫，其包含热塑性树脂和层状硅酸盐，其中泡沫体和层状硅酸盐均匀且细分散。 在100重量份热塑性树脂和0.1-50重量份层状硅酸盐的复合材料中，将体积膨胀气体或热分解发泡剂并入层状硅酸盐的层间空间中，气体或发泡剂 允许体积膨胀或热分解以形成泡沫体6，从而获得热塑性泡沫，其中当通过X射线衍射法测定时，层状硅酸盐具有超过60的平均层间距。