公开(公告)号：US20080012149A1

公开(公告)日：2008-01-17

申请号：US11487304

申请日：2006-07-17

Applicant: Te-Wei Chen

Inventor： Te-Wei Chen

IPC: H01L23/48

CPC classification number: H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05001 ,  H01L2224/05073 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4807 ,  H01L2224/4845 ,  H01L2224/48463 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor chip structure includes a top metal layer and an inter-layer dielectric under the top metal layer. The top metal layer includes a bonding pad area and a non-bonding pad area. The inter-layer dielectric includes at least one first via disposed under the bonding pad area, and a plurality of conventional second vias disposed under the non-bonding pad area. The size of the first via is much larger than the size of the second via to improve bonding pad reliability. The cross section of the first via is a rectangular, a square, or a polygonal. The top metal layer has a predefined thickness to improve a yield of a wire bonding.

Abstract translation: 半导体芯片结构包括在顶部金属层下方的顶部金属层和层间电介质。 顶部金属层包括焊盘区域和非接合焊盘区域。 层间电介质包括设置在焊盘区域下方的至少一个第一通孔和设置在非接合焊盘区域下方的多个传统的第二通孔。 第一通孔的尺寸比第二通孔的尺寸大得多，以提高焊盘的可靠性。 第一通孔的横截面是矩形，正方形或多边形。 顶部金属层具有预定的厚度以提高引线接合的产量。

公开(公告)号：US20070007670A1

公开(公告)日：2007-01-11

申请号：US11299833

申请日：2005-12-13

Applicant: Te-Wei Chen

Inventor： Te-Wei Chen

IPC: H01L23/48

CPC classification number: H01L21/485 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A bond pad structure includes a plurality of normal bond pads, a conductive structure and a plurality of backup bond pads. The conductive structure has a plurality of blocks, and at least one of the backup bond pads is disposed on individual blocks. The blocks are isolated from each other by a dielectric material. The normal bond pads on the blocks correspond to the backup bond pads, and each normal bond pad is electrically connected with the corresponding backup bond pad.

Abstract translation: 接合焊盘结构包括多个正常接合焊盘，导电结构和多个备用焊盘。 导电结构具有多个块，至少一个备用接合焊盘设置在各个块上。 这些块通过电介质材料彼此隔离。 块上的正常接合焊盘对应于备用焊盘，并且每个正常接合焊盘与相应的备用焊盘电连接。

公开(公告)号：US06742157B2

公开(公告)日：2004-05-25

申请号：US09826884

申请日：2001-04-06

Applicant: Jia-Horng Shieh ,  Te-Wei Chen

Inventor： Jia-Horng Shieh ,  Te-Wei Chen

IPC: H03M1300

CPC classification number: G11B20/10527 ,  G11B20/18 ,  G11B20/1803 ,  H03M13/09 ,  H03M13/098

Abstract: The present invention provides a decoding system and method for an optical disk storage device to receive and decode the data of the disk. The present invention does not need to increase the clock frequency and the bus width of the decoding system, it can effectively decrease the access times to the data buffer and the system response time by changing the structure of the conventional decoding system, in this way the present invention increases the parallel processing capability and the decoding speed of the system, thus, it can enhance the entire device to become a high speed optical storage device.

Abstract translation: 本发明提供了一种光盘存储装置的解码系统和方法，用于接收和解码盘的数据。 本发明不需要增加解码系统的时钟频率和总线宽度，可以通过改变常规解码系统的结构，有效地减少对数据缓冲器的访问时间和系统响应时间，这样 本发明增加了系统的并行处理能力和解码速度，从而可以将整个装置提高成为高速光存储装置。