Intergrated circuit having a precharging circuit
    22.
    发明申请
    Intergrated circuit having a precharging circuit 有权
    具有预充电电路的集成电路

    公开(公告)号:US20070285976A1

    公开(公告)日:2007-12-13

    申请号:US11450605

    申请日:2006-06-09

    IPC分类号: G11C11/00

    摘要: A memory includes a phase change element having a first side and a second side and a first line coupled to the first side of the element. The memory includes an access device coupled to the second side of the element and a second line coupled to the access device for controlling the access device. The memory includes a circuit for precharging the first line to a first voltage and for applying a voltage pulse to the second line such that a current pulse is generated through the access device to the element to program the element to a selected one of more than two states. The voltage pulse has an amplitude based on the selected state.

    摘要翻译: 存储器包括具有第一侧和第二侧以及耦合到元件的第一侧的第一线的相变元件。 存储器包括耦合到元件的第二侧的访问设备和耦合到访问设备的用于控制访问设备的第二行。 存储器包括用于将第一线路预充电到第一电压并且用于将电压脉冲施加到第二线路的电路,使得通过该接入装置向该元件生成电流脉冲以将该元件编程为多于两个中的所选择的一个 状态。 电压脉冲具有基于选择状态的幅度。

    Resistive memory devices with improved resistive changing elements
    23.
    发明授权
    Resistive memory devices with improved resistive changing elements 有权
    具有改进的电阻变化元件的电阻式存储器件

    公开(公告)号:US08742387B2

    公开(公告)日:2014-06-03

    申请号:US12145608

    申请日:2008-06-25

    IPC分类号: H01L47/00 H01L45/00

    摘要: An integrated circuit includes a memory cell with a resistance changing memory element. The resistance changing memory element includes a first electrode, a second electrode, and a resistivity changing material disposed between the first and second electrodes, where the resistivity changing material is configured to change resistive states in response to application of a voltage or current to the first and second electrodes. In addition, at least one of the first electrode and the second electrode comprises an insulator material including a self-assembled electrically conductive element formed within the insulator material. The self-assembled electrically conductive element formed within the insulator material remains stable throughout the operation of switching the resistivity changing material to different resistive states.

    摘要翻译: 集成电路包括具有电阻变化存储元件的存储单元。 电阻变化存储元件包括第一电极,第二电极和设置在第一和第二电极之间的电阻率变化材料,其中电阻率变化材料被配置为响应于施加电压或电流而改变电阻状态 和第二电极。 此外,第一电极和第二电极中的至少一个包括绝缘体材料,其包括形成在绝缘体材料内的自组装导电元件。 形成在绝缘体材料内的自组装导电元件在将电阻率变化材料切换到不同电阻状态的整个操作期间保持稳定。

    Data exchange in resistance changing memory for improved endurance
    25.
    发明授权
    Data exchange in resistance changing memory for improved endurance 有权
    电阻变化记忆中的数据交换,以提高耐力

    公开(公告)号:US08250293B2

    公开(公告)日:2012-08-21

    申请号:US12687951

    申请日:2010-01-15

    IPC分类号: G06F12/10 G06F12/16

    摘要: According to one embodiment of the present invention, a method of operating an integrated circuit including a plurality of resistance changing memory cells grouped into physical memory units is provided. The method includes: Monitoring writing access numbers assigned to the physical memory units, each writing access number reflecting the number of writing accesses to the physical memory unit to which the writing access number is assigned; if the value of a writing access number assigned to a first physical memory unit exceeds a writing access threshold value, a data exchange process is carried out during which the data content stored within the first physical memory unit is exchanged with the data content of a second physical memory unit having a writing access number of a lower value.

    摘要翻译: 根据本发明的一个实施例,提供了一种操作集成电路的方法,该集成电路包括分组成物理存储器单元的多个电阻变化存储器单元。 该方法包括:监视分配给物理存储器单元的写入访问号码,每个写入访问号码反映写入访问次数到写入访问号码的物理存储单元; 如果分配给第一物理存储器单元的写访问号码的值超过写访问阈值,则执行数据交换处理,在该数据交换处理期间,存储在第一物理存储单元内的数据内容与第二物理存储单元的数据内容交换 物理存储单元具有较低值的写入访问号。

    Pillar phase change memory cell
    27.
    发明授权
    Pillar phase change memory cell 有权
    支柱相变存储单元

    公开(公告)号:US08017930B2

    公开(公告)日:2011-09-13

    申请号:US11643438

    申请日:2006-12-21

    IPC分类号: H01L47/00

    摘要: A memory cell includes a first electrode, a storage location, and a second electrode. The storage location includes a phase change material and contacts the first electrode. The storage location has a first cross-sectional width. The second electrode contacts the storage location and has a second cross-sectional width greater than the first cross-sectional width. The first electrode, the storage location, and the second electrode form a pillar phase change memory cell.

    摘要翻译: 存储单元包括第一电极,存储位置和第二电极。 存储位置包括相变材料并与第一电极接触。 存储位置具有第一横截面宽度。 第二电极接触存储位置并且具有大于第一横截面宽度的第二横截面宽度。 第一电极,存储位置和第二电极形成柱状相变存储单元。

    Phase change memory with tapered heater
    28.
    发明授权
    Phase change memory with tapered heater 有权
    带锥形加热器的相变存储器

    公开(公告)号:US07906368B2

    公开(公告)日:2011-03-15

    申请号:US11771501

    申请日:2007-06-29

    IPC分类号: H01L21/06

    摘要: An embodiment of the present invention includes a method of forming a nonvolatile phase change memory (PCM) cell. This method includes forming at least one bottom electrode; forming at least one phase change material layer on at least a portion of an upper surface of the bottom electrode; forming at least one heater layer on at least a portion of an upper surface of the phase change material layer; and shaping the heater layer into a tapered shape, such that an upper surface of the heater layer has a cross-sectional width that is longer than a cross-sectional width of a bottom surface of the heater layer contacting the phase change material layer.

    摘要翻译: 本发明的实施例包括形成非易失性相变存储器(PCM)单元的方法。 该方法包括形成至少一个底部电极; 在所述底部电极的上表面的至少一部分上形成至少一个相变材料层; 在所述相变材料层的上表面的至少一部分上形成至少一个加热层; 并且将加热器层成形为锥形,使得加热器层的上表面的横截面宽度大于与相变材料层接触的加热器层的底表面的横截面宽度。

    Method for Fabricating an Integrated Circuit Including Resistivity Changing Material Having a Planarized Surface
    30.
    发明申请
    Method for Fabricating an Integrated Circuit Including Resistivity Changing Material Having a Planarized Surface 有权
    包括具有平坦化表面的电阻率变化材料的集成电路的制造方法

    公开(公告)号:US20100323493A1

    公开(公告)日:2010-12-23

    申请号:US12856007

    申请日:2010-08-13

    IPC分类号: H01L21/02

    摘要: An integrated circuit is fabricated by providing a preprocessed wafer including a first electrode, depositing a dielectric material over the preprocessed wafer, etching an opening in the dielectric material to expose a portion of the first electrode and depositing a first resistivity changing material over exposed portions of the etched dielectric material and the first electrode. The first resistivity changing material is planarized to expose the etched dielectric material. A second resistivity changing material is deposited over the etched dielectric material and the first resistivity changing material, and an electrode material is deposited over the second resistivity changing material.

    摘要翻译: 通过提供包括第一电极的预处理晶片,在预处理的晶片上沉积电介质材料,蚀刻介电材料中的开口以暴露第一电极的一部分并在第一电极的暴露部分上沉积第一电阻率变化材料来制造集成电路 蚀刻的电介质材料和第一电极。 第一电阻率变化材料被平坦化以暴露蚀刻的电介质材料。 第二电阻率变化材料沉积在蚀刻的电介质材料和第一电阻率变化材料上,并且电极材料沉积在第二电阻率变化材料上。