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公开(公告)号：US06773931B2
公开(公告)日：2004-08-10
申请号：US10207525
申请日：2002-07-29
IPC分类号： H01L2100
CPC分类号： H01L22/20 , G05B19/41865 , G05B2219/37295 , G05B2219/45031 , H01L2223/54453 , Y02P90/20
摘要： A method and an apparatus for dynamic targeting for a process control system. A process step is performed upon a first workpiece in a batch based upon a process target setting. The process target setting comprises at least one parameter relating to a target characteristic of the first workpiece. Manufacturing data relating to processing of the first workpiece is acquired. The manufacturing data comprises at least one of a metrology data relating to the processed first workpiece and a tool state data relating to the tool state of a processing tool. Electrical data relating to the processed first workpiece is acquired at least partially during processing of a second workpiece in the batch. The process target setting is adjusted dynamically based upon a correlation of the electrical data with the manufacturing data.
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22.发明授权Method and apparatus for determining a sampling plan based on process and equipment fingerprinting 有权基于过程和设备指纹识别取样计划的方法和装置公开(公告)号：US06650955B1
公开(公告)日：2003-11-18
申请号：US10024675
申请日：2001-12-18
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , G05B2219/31459 , G05B2219/31485 , G05B2219/45031 , Y02P90/20 , Y02P90/86
摘要： A processing line includes a processing tool, a metrology tool, a processing monitor, and a sampling controller. The processing tool is configured to process workpieces. The metrology tool is configured to measure an output characteristic of selected workpieces in accordance with a sampling plan. The processing monitor is configured to monitor the processing of at least one workpiece in the processing tool to generate a fingerprint and determine a processing metric based on the fingerprint. The sampling controller is configured to receive the processing metric and determine the sampling plan for the metrology tool based on the processing metric. A method for processing workpieces includes processing a plurality of workpieces in a processing tool. A characteristic of selected workpieces is measured in accordance with a sampling plan. The processing of at least one workpiece in the processing tool is monitored to generate a fingerprint. A processing metric is determined based on the fingerprint. The sampling plan is determined based on the processing metric.
摘要翻译： 处理线包括处理工具，计量工具，处理监视器和采样控制器。 处理工具被配置为处理工件。 计量工具被配置为根据抽样计划来测量所选择的工件的输出特性。 处理监视器被配置为监视处理工具中的至少一个工件的处理以生成指纹并且基于指纹来确定处理度量。 采样控制器被配置为基于处理度量来接收处理度量并确定计量工具的采样计划。 一种用于处理工件的方法包括在处理工具中处理多个工件。 所选工件的特性根据抽样计划进行测量。 对处理工具中的至少一个工件进行处理以产生指纹。 基于指纹确定处理度量。 采样计划是根据处理度量确定的。
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23.发明授权Method and apparatus for initializing tool controllers based on tool event data 有权基于工具事件数据初始化刀具控制器的方法和装置公开(公告)号：US07103439B1
公开(公告)日：2006-09-05
申请号：US09824301
申请日：2001-04-02
申请人： Christopher A. Bode , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Christopher A. Bode , Alexander J. Pasadyn , Anthony J. Toprac , Joyce S. Oey Hewett , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
IPC分类号： G06F19/00
CPC分类号： G05B19/41865 , Y02P90/20 , Y02P90/86
摘要： A method for initializing process controllers based on tool event data includes providing a tool having a process controller adapted to employ a control model to control an operating recipe of the tool; receiving a tool event notification; and initializing the control model in response to receiving the tool event notification. A manufacturing system includes a tool and a process controller. The tool is adapted to process wafers in accordance with an operating recipe. The process controller is adapted to employ a control model to control the operating recipe in accordance with a control algorithm. The process controller is further adapted to receive a tool event notification and initialize the control model in response to receiving the tool event notification.
摘要翻译： 用于基于工具事件数据初始化过程控制器的方法包括提供具有适于使用控制模型来控制工具的操作配方的过程控制器的工具; 接收工具事件通知; 并且响应于接收到工具事件通知来初始化控制模型。 制造系统包括工具和过程控制器。 该工具适于根据操作配方处理晶片。 过程控制器适于采用控制模型来根据控制算法来控制操作配方。 过程控制器还适于接收工具事件通知并响应于接收到工具事件通知而初始化控制模型。
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24.发明授权公开(公告)号：US06901340B1
公开(公告)日：2005-05-31
申请号：US09824348
申请日：2001-04-02
申请人： Alexander J. Pasadyn , Joyce S. Oey Hewett , Christopher A. Bode , Anthony J. Toprac , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
发明人： Alexander J. Pasadyn , Joyce S. Oey Hewett , Christopher A. Bode , Anthony J. Toprac , Anastasia Oshelski Peterson , Thomas J. Sonderman , Michael L. Miller
CPC分类号： G05B23/0275 , G05B2219/1112 , G05B2219/34477 , G05B2223/02 , H01L21/67276 , Y02P90/86
摘要： A method for distinguishing between sources of process variation includes processing a plurality of manufactured items in a process flow; storing a set of production environment data associated with each of the manufactured items; identifying manufactured items associated with a process drift; generating a plurality of characteristic threads based on the production environment data; comparing the characteristic threads for at least those manufactured items associated with the process drift; and determining at least one potential cause for the process drift based on the comparison of the characteristic threads. A manufacturing system for distinguishing between sources of process variation is also provided. The manufacturing system includes a plurality of tools for processing manufactured items in a process flow, a database server, and a drift monitor.
摘要翻译： 用于区分过程变化源的方法包括在处理流程中处理多个制造项目; 存储与每个所制造的项目相关联的一组生产环境数据; 识别与过程漂移相关联的制品; 基于生产环境数据生成多个特征线程; 比较至少那些与过程漂移有关的制造物品的特征线; 以及基于所述特征线程的比较来确定所述过程漂移的至少一个潜在原因。 还提供了用于区分过程变化源的制造系统。 制造系统包括用于处理流程中的制造物品的多个工具，数据库服务器和漂移监视器。
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25.发明授权Method and apparatus for determining control actions incorporating defectivity effects 有权用于确定包含缺陷效应的控制动作的方法和装置公开(公告)号：US06745086B1
公开(公告)日：2004-06-01
申请号：US10114785
申请日：2002-04-03
IPC分类号： G06F1300
CPC分类号： H01L22/20
摘要： A method includes processing workpieces in accordance with an operating recipe. Metrology data associated with at least one of the workpieces is received. A proposed control action is generated based on the metrology data. A defectivity metric is generated based on the proposed control action. The proposed control action is modified based on the defectivity metric. A manufacturing system includes a process tool, a metrology tool, and a process controller. The process tool is configured to process workpieces in accordance with an operating recipe. The metrology tool is configured to provide metrology data associated with at least one of the workpieces. The process controller is configured to generate a proposed control action based on the metrology data, generate a defectivity metric based on the proposed control action, and modify the proposed control action based on the defectivity metric.
摘要翻译： 一种方法包括根据操作配方处理工件。 接收与至少一个工件相关联的计量数据。 基于测量数据生成提出的控制动作。 基于所提出的控制动作产生缺陷度量。 所提出的控制动作根据缺陷度量进行修改。 制造系统包括处理工具，计量工具和过程控制器。 过程工具被配置为根据操作配方处理工件。 计量工具被配置为提供与至少一个工件相关联的度量数据。 过程控制器被配置为基于测量数据生成提出的控制动作，基于所提出的控制动作生成缺陷度量，并且基于缺陷度量度修改所提出的控制动作。
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26.发明授权Method and apparatus for determining output characteristics using tool state data 有权使用工具状态数据确定输出特性的方法和装置公开(公告)号：US06678570B1
公开(公告)日：2004-01-13
申请号：US09891898
申请日：2001-06-26
IPC分类号： G06F1900
CPC分类号： G05B19/41865 , Y02P90/20 , Y10T29/41
摘要： A method for determining output characteristics of a workpiece includes generating a tool state trace related to the processing of a workpiece in a tool; comparing the generated tool state trace to a library of reference tool state traces, each reference tool state trace having an output characteristic metric; selecting a reference tool state trace closest to the generated tool state trace; and determining an output characteristic of the workpiece based on the output characteristic metric associated with the selected reference tool state trace. A manufacturing system includes a tool and a tool state monitor. The tool is adapted to process a workpiece. The tool state monitor is adapted to generate a tool state trace related to the processing of a workpiece in the tool, compare the generated tool state trace to a library of reference tool state traces, each reference tool state trace having an output characteristic metric, select a reference tool state trace closest to the generated tool state trace, and determine an output characteristic of the workpiece based on the output characteristic metric associated with the selected reference tool state trace.
摘要翻译： 一种用于确定工件的输出特性的方法包括产生与工具中的工件的加工相关的工具状态迹线; 将生成的刀具状态跟踪与参考刀具状态轨迹库进行比较，每个参考刀具状态轨迹具有输出特征量度; 选择最接近生成的刀具状态轨迹的参考刀具状态轨迹; 以及基于与所选择的参考工具状态轨迹相关联的输出特性度量来确定工件的输出特性。 制造系统包括工具和工具状态监视器。 该工具适用于加工工件。 刀具状态监视器适于生成与刀具中的工件的处理相关的刀具状态跟踪，将生成的刀具状态跟踪与参考刀具状态轨迹库进行比较，每个刀具状态轨迹具有输出特性量度，选择 最接近生成的刀具状态轨迹的参考刀具状态轨迹，并且基于与所选择的参考刀具状态轨迹相关联的输出特性量度来确定工件的输出特性。
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27.发明授权Methods for dynamically controlling etch endpoint time, and system for accomplishing same 有权动态控制蚀刻终点时间的方法，以及完成相同的系统公开(公告)号：US06660539B1
公开(公告)日：2003-12-09
申请号：US10040299
申请日：2001-11-07
IPC分类号： H01L2166
CPC分类号： H01L22/20 , H01L21/31116 , H01L21/31138
摘要： A method comprising performing an etch process recipe comprised of an endpoint etch process and a timed over-etch process on each of a first plurality of substrates to form at least one opening in each layer of insulating material, determining a duration of the endpoint etch process performed on the first plurality of substrates, determining a duration of the timed over-etch process of the etch process recipe to be performed on a second plurality of substrates based upon the determined duration of the endpoint etch process performed on the first plurality of substrates, and performing the etch process recipe comprised of the endpoint etch process and the timed over-etch process of the determined duration on the second plurality of semiconducting substrates. A system comprised of an etch tool for forming at least one opening in a layer of insulating material formed above each of a first plurality of semiconducting substrates by performing an etch recipe comprised of an endpoint etch process and a timed over-etch process on each of the substrates, and a controller that determines a duration of the endpoint etch process performed on the first plurality of substrates and determines a duration of the timed over-etch process of the etch recipe to be performed on a second plurality of semiconducting substrates based upon the determined duration of the endpoint etch process performed on the first plurality of substrates.
摘要翻译： 一种方法，包括在第一多个基板中的每一个上执行包括端点蚀刻工艺和定时过蚀刻工艺的蚀刻工艺配方，以在每层绝缘材料中形成至少一个开口，确定端点蚀刻工艺的持续时间 在所述第一多个基板上执行，基于在所述第一多个基板上执行的所述端点蚀刻工艺的所确定的持续时间，确定将在第二多个基板上执行的所述蚀刻工艺配方的定时过蚀刻工艺的持续时间， 以及执行包括端点蚀刻工艺和在第二多个半导体衬底上确定的持续时间的定时过蚀刻工艺的蚀刻工艺配方。 一种系统，包括用于在绝缘材料层中形成至少一个开口的蚀刻工具，所述绝缘材料层通过执行由端点蚀刻工艺和定时过蚀刻工艺组成的蚀刻配方，所述蚀刻配方由第一多个半导体衬底 基板和控制器，其确定在第一多个基板上执行的端点蚀刻工艺的持续时间，并且基于第二多个半导体基板确定要对第二多个半导体基板执行的蚀刻配方的定时过蚀刻工艺的持续时间 确定在第一多个基板上执行的端点蚀刻工艺的持续时间。
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公开(公告)号：US06444481B1
公开(公告)日：2002-09-03
申请号：US09897626
申请日：2001-07-02
IPC分类号： H01L2100
CPC分类号： H01L22/26 , H01L21/2885 , H01L21/76877 , H01L2924/0002 , H01L2924/00
摘要： A method for controlling a plating process includes plating a process layer on a wafer in accordance with a recipe; measuring a thickness of the process layer; and determining at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness. A processing line includes a plating tool, a metrology tool, and a process controller. The plating tool is adapted to form a process layer on a wafer in accordance with a recipe. The metrology tool is adapted to measure a thickness of the process layer. The process controller is adapted to determine at least one plating parameter of the recipe for subsequently formed process layers based on the measured thickness.
摘要翻译： 一种控制电镀工艺的方法包括根据配方在晶片上镀覆工艺层; 测量处理层的厚度; 以及基于测量的厚度，确定随后形成的处理层的配方的至少一个电镀参数。 处理线包括电镀工具，计量工具和过程控制器。 电镀工具适于根据配方在晶片上形成工艺层。 测量工具适用于测量工艺层的厚度。 过程控制器适于基于测量的厚度来确定随后形成的处理层的配方的至少一个电镀参数。
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公开(公告)号：US06912433B1
公开(公告)日：2005-06-28
申请号：US10323554
申请日：2002-12-18
IPC分类号： G05B19/418 , G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32182 , G05B2219/45031 , G05B2219/50065 , Y02P90/22
摘要： A method and apparatus are provided for determining a next tool state based on fault detection information. The method comprises receiving operational data associated with processing of a workpiece by a processing tool, determining at least a portion of noise associated with the processing of the workpiece based on analyzing the operational data and estimating a next state of the processing tool based on at least the determined portion of the noise.
摘要翻译： 提供了一种基于故障检测信息来确定下一个工具状态的方法和装置。 该方法包括：通过处理工具接收与工件的处理有关的操作数据，基于分析操作数据确定与工件的处理相关联的噪声的至少一部分，并基于至少基于估计处理工具的下一个状态 确定的噪声部分。
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30.发明授权Method and apparatus for modifying design constraints based on observed performance 失效基于观察性能修改设计约束的方法和装置公开(公告)号：US06907369B1
公开(公告)日：2005-06-14
申请号：US10425227
申请日：2003-05-02
IPC分类号： G05B19/418 , G06F17/50 , G06F19/00
CPC分类号： G05B19/41875 , G05B2219/32018 , G05B2219/32101 , G05B2219/45026 , G06F17/5068 , Y02P90/22
摘要： A method for modifying design constraints based on observed performance includes measuring a characteristic of a plurality of devices manufactured in a process flow. A design constraint associated with the characteristic is defined. A performance metric relating the performance of the devices as a function of the measured characteristic and the design constraint is generated. The design constraint is modified based on the performance metric. A manufacturing system includes a metrology tool and a design rule monitor. The metrology tool is configured to measure a characteristic of a plurality of devices manufactured in a process flow. The design rule monitor is configured to receive a design constraint associated with the characteristic, generate a performance metric relating the performance of the devices as a function of the measured characteristic and the design constraint, and modify the design constraint based on the performance metric.
摘要翻译： 基于观察到的性能来修改设计约束的方法包括测量在处理流程中制造的多个设备的特性。 定义与特性相关的设计约束。 产生与测量特性和设计约束相关的设备性能的性能指标。 基于性能指标修改设计约束。 制造系统包括计量工具和设计规则监视器。 计量工具被配置为测量在处理流程中制造的多个装置的特性。 设计规则监视器被配置为接收与特性相关联的设计约束，根据测量的特性和设计约束生成与设备的性能相关的性能度量，并且基于性能度量来修改设计约束。
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