公开(公告)号：US11869789B2

公开(公告)日：2024-01-09

申请号：US17533672

申请日：2021-11-23

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Suguru Enokida ,  Taro Yamamoto

IPC: H01L21/677 ,  G03F7/16

CPC classification number: H01L21/67712 ,  G03F7/168 ,  H01L21/67766

Abstract: A substrate processing apparatus includes a carrier block, a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block, a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks, a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks, a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block, and a bypass transfer mechanism provided for each of the first and second processing blocks.

公开(公告)号：US11664254B2

公开(公告)日：2023-05-30

申请号：US17530581

申请日：2021-11-19

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Watanabe ,  Masashi Tsuchiyama ,  Suguru Enokida ,  Taro Yamamoto

IPC: H01L21/677 ,  H01L21/67 ,  G03F7/16 ,  H01L21/683

CPC classification number: H01L21/67712 ,  G03F7/16 ,  H01L21/6719 ,  H01L21/67715 ,  H01L21/6838

Abstract: A substrate processing apparatus includes a carrier block on which a carrier configured to store a substrate is placed, first processing block including a plurality of first processing modules, and a first transport mechanism shared by the plurality of first processing modules to transport the substrate, second processing block overlapping the first processing block, including a plurality of second processing modules, and a second transport mechanism shared by the plurality of second processing modules to transport the substrate, and configured to transport the substrate to the carrier block. The substrate processing apparatus includes a lifting and transferring mechanism including a shaft extending in a horizontal direction and a support part configured to face and support the substrate, and a rotation mechanism configured to rotate the support part around the shaft such that an orientation of the support part is changed between a first orientation and the second position.

公开(公告)号：US10649334B2

公开(公告)日：2020-05-12

申请号：US16100609

申请日：2018-08-10

Applicant: Tokyo Electron Limited

Inventor： Koki Yoshimura ,  Shogo Takahasi ,  Yasushi Takiguchi ,  Taro Yamamoto

IPC: G03F7/16 ,  H01L21/67 ,  G03F7/30 ,  H01L21/683

Abstract: Disclosed is a liquid processing apparatus for performing a liquid processing by supplying a processing liquid from a nozzle to a substrate. The apparatus includes: a cup body provided to surround a substrate holding unit; a nozzle arm provided with a nozzle and supported by a support unit; a moving mechanism configured to move the nozzle arm via the support unit between a stand-by position and a processing position; an elevating mechanism configured to move up and down the support unit; a cover member including a top plate portion provided above a driving region and configured to partition the driving region from a region where the substrate is held within the cup body; an opening formed in a portion corresponding to a moving path of the support unit in the top plate portion; and an exhaust mechanism configured to evacuate the driving region.

公开(公告)号：US09470979B2

公开(公告)日：2016-10-18

申请号：US15051780

申请日：2016-02-24

Applicant: Tokyo Electron Limited

Inventor： Yasushi Takiguchi ,  Taro Yamamoto ,  Yoshinori Ikeda ,  Koki Yoshimura ,  Yoshiki Okamoto ,  Masahiro Fukuda

IPC: G03B27/32 ,  G03C5/26 ,  G03F7/16

CPC classification number: G03F7/16 ,  G03F7/3021 ,  G03F7/3092 ,  H01L21/67017

Abstract: The present invention is a developing treatment apparatus for performing development by supplying a developing solution to a substrate having a front surface coated with a positive resist or a negative resist and then subjected to exposure wherein a movable cup is raised to introduce one of scattering developing solutions for the positive and negative resists into an inner peripheral flow path of a cup and the movable cup is lowered to introduce the other of scattering developing solutions for the positive and negative resists into an outer peripheral flow path of the cup, and the developing solution introduced into the inner peripheral flow path and the developing solution introduced into the outer peripheral flow path are separately drained.

Abstract translation: 本发明是一种显影处理装置，用于通过向具有正性抗蚀剂或负性抗蚀剂的前表面的基材供给显影液进行显影，然后进行曝光，其中可移动杯被升高以引入散射显影溶液之一 用于正面和负面的抗蚀剂进入杯子的内周流动路径，并且可移动杯子被降低以将用于正面和负面抗蚀剂的另一个散射显影溶液引入到杯子的外周流动路径中，并且显影溶液引入 进入内周流路，引入外周流路的显影液分别排出。

公开(公告)号：US09120120B2

公开(公告)日：2015-09-01

申请号：US14460020

申请日：2014-08-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro Yamamoto ,  Naoto Yoshitaka ,  Shuichi Nishikido ,  Yoichi Tokunaga

IPC: B08B3/00 ,  B05D3/10 ,  G03F7/16 ,  H01L21/67 ,  B05D3/06 ,  B05D5/06

CPC classification number: B05D3/105 ,  B05D3/065 ,  B05D5/06 ,  G03F7/168 ,  H01L21/67046 ,  H01L21/67051

Abstract: A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.

Abstract translation: 清洁装置包括：第一基板保持部，其构造成保持基板的背面的第一区域，使得顶表面保持朝上; 第二基板保持部构造成保持基板的背面的第二区域，第二区域不与第一区域重叠，并旋转基板; 顶表面清洁喷嘴，其构造成将顶表面清洁流体供应到所述基板的顶表面; 斜面清洁喷嘴，其构造成将倾斜清洁流体供应到所述基板的斜面部分; 清洗液供给部，其构造成将后表面清洗液供给到由所述第一或第二基板保持部保持的基板的背面; 以及清洁部件，其构造成清洁由所述第一或第二基板保持部保持的所述基板的背面。

公开(公告)号：US20130293856A1

公开(公告)日：2013-11-07

申请号：US13937833

申请日：2013-07-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hideharu KYOUDA ,  Taro Yamamoto

IPC: H01L21/67

CPC classification number: H01L21/67017 ,  G03F7/11 ,  G03F7/168 ,  G03F7/2041 ,  G03F7/70341 ,  H01L21/67051 ,  H01L21/6715

Abstract: Disclosed is a technique for preventing a water-repellent protective film formed on a resist film from peeling off during immersion exposure. A resist film is formed on the front surface of a substrate and then the peripheral edge portion of the resist film is removed. Before forming a water-repellent protective film onto the resist film, an adhesion-improving fluid, preferably hexamethyldisilazane gas, for improving the adhesion of the water-repellent protective film, is supplied to the region from which the resist film is removed.

Abstract translation: 公开了一种防止在浸渍曝光期间形成在抗蚀剂膜上的防水保护膜被剥离的技术。 在基板的前表面上形成抗蚀剂膜，然后除去抗蚀剂膜的周边部分。 在抗蚀剂膜上形成防水保护膜之前，为了提高防水性保护膜的粘附性，提供了粘附改善液，优选六甲基二硅氮烷气体，其中除去抗蚀剂膜的区域。