摘要:
An SRAM cell 1 includes inverters 10, 20, N-type FETs 32, 34, 36, 38, word lines 42, 44, bit lines 46, 48, and voltage applying circuits 50, 60. The voltage applying circuits 50, 60 apply a voltage Vdd to the word lines 42, 44 at the time of a read operation of the SRAM cell 1. The voltage applying circuits 50, 60 apply a voltage (Vdd+α) to the word lines 42, 44 at the time of a write operation of the SRAM cell 1. Here, α>0. Namely, the SRAM cell 1 is configured in such a manner that a voltage applied to word lines 42, 44 at the time of the write operation is higher than at the time of the read operation.
摘要翻译:SRAM单元1包括反相器10,20,N型FET32,34,36,38,字线42,44,位线46,48和电压施加电路50,60。 电压施加电路50,60在SRAM单元1的读取操作时对字线42,44施加电压V dd。 电压施加电路50,60在SRAM单元1的写入操作时对字线42,44施加电压(V SUB +Δ+α)。 这里,alpha> 0。 也就是说,SRAM单元1被配置成使得在写入操作时施加到字线42,44的电压高于读取操作时的电压。
摘要:
In a method for manufacturing a BiMOS device, first and second semiconductor layers are formed on a semiconductor substrate, first and second field insulating layers are formed by using a LOCOS process on said first and second semiconductor layers, respectively. The first field insulating layer partitions a bipolar transistor area and a MOS transistor area, and the second field insulating layer is formed on a base-emitter junction region of the first semiconductor layer. Then, impurities are introduced via the second field insulating layer into the first semiconductor layer to form a base region therein. Then, an emitter opening is perforated in the second field insulating layer, and a polycrystalline silicon layer is formed on the second field insulating layer. Then, impurities of a first conductivity type are introduced into the polycrystalline silicon layer, and a heating operation is performed upon the polycrystalline silicon layer to form an emitter region. Then, the polycrystalline silicon layer is patterned to form an emitter electrode. Then, a gate insulating layer is formed on the second semiconductor layer, and a gate electrode is formed on the gate insulating layer. Finally, a base graft region is formed type in the first semiconductor layer and source/drain regions are formed in the second semiconductor layer.
摘要:
In a method for manufacturing a BiMOS device, first and second semiconductor layers are formed on a semiconductor substrate, first and second field insulating layers are formed by using a LOCOS process on said first and second semiconductor layers, respectively. The first field insulating layer partitions a bipolar transistor area and a MOS transistor area, and the second field insulating layer is formed on a base-emitter junction region of the first semiconductor layer. Then, impurities are introduced via the second field insulating layer into the first semiconductor layer to form a base region therein. Then, an emitter opening is perforated in the second field insulating layer, and a polycrystalline silicon layer is formed on the second field insulating layer. Then, impurities of a first conductivity type are introduced into the polycrystalline silicon layer, and a heating operation is performed upon the polycrystalline silicon layer to form an emitter region. Then, the polycrystalline silicon layer is patterned to form an emitter electrode. Then, a gate insulating layer is formed on the second semiconductor layer, and a gate electrode is formed on the gate insulating layer. Finally, a base graft region is formed type in the first semiconductor layer and source/drain regions are formed in the second semiconductor layer.
摘要:
A semiconductor device with an LDD structure type MOS transistor is fabricated by forming a gate electrode on a semiconductor layer of a first conductivity type and a source/drain region in the semiconductor layer, the source/drain region having a high impurity concentration region and a low impurity concentration region of a second conductivity type. A pocket of the first conductivity type is formed in contact with the low impurity concentration region only on a drain region side and immediately under the low concentration region of the second conductivity type. The pocket formed only on the drain side can suppress the short channel effect and also the hot carrier generation without lowering the current capacity on the source side where no pocket is present.
摘要:
In a method for manufacturing a "BiCMOS" semiconductor integrated circuit, a gate oxide film 110 and a polysilicon film are grown on a semiconductor substrate, and after phosphorus is doped, the polysilicon film is patterned to form gate electrodes 112a and 112b and an emitter electrode 112c. A heat treatment is performed to form an emitter diffused region 113. Phosphorus and boron are selectively implanted with a low impurity concentration, respectively, to form a LDD N.sup.- region 114 and a LDD P.sup.- region 115. Thereafter, a side wall 116 is formed, and boron is implanted into areas B and C so as to form P.sup.+ source/drain regions 117 and a graft base region 18, respectively. Phosphorus is implanted to form N.sup.+ source/drain regions 119.
摘要:
In order to provide a multi-valued DRAM with an access time comparable to ordinary binary DRAMs, a potential difference generated by a memory cell between a pair of bit-lines is delivered to N-1 sets of sense amplifiers. Each delivered potential difference is shifted by a predetermined value for each sense amplifier for classifying the potential difference into N levels. A refreshing potential for the memory cell is obtained from outputs of the sense amplifiers activated with sense amplifier activating signals having potentials predetermined for each sense amplifier.
摘要:
A semiconductor memory provided with improved sense amplifier-bit line arrangement which is suitable for a high-speed and high-sensitivity read operation. The memory comprises a main bit line pair, a main sense amplifier, a plurality of sub-bit line pairs and a plurality of sub-sense amplifiers in each column. Each of the sub-sense amplifiers includes a pair of output nodes coupled to the main bit line pair and a pair of input nodes coupled to one of the sub-bit line pairs. A pair of switch elements are inserted between the main bit line pair and each one of the sub-bit line pairs for selectively feeding an output of the main sense amplifier back to one of the sub-bit line pair selected.
摘要:
A signal generating circuit which generates an output signal in a dynamic manner without being influenced by noise is disclosed. The signal generating circuit comprises a first transistor connected between a power voltage source and an output node, and second and third transistors connected in series between the output node and a ground voltage line. A first signal which assumes an active level in a first period and an inactive a second period subsequent to the first period, is applied to a gate of the second transistor, and a second signal which assumes an active level for a first time duration in the second period and an inactive level in a remaining second time duration in the second period and the first period, is applied to a gate of the first transistor. A third signal which assumes an active level in the first period and an inactive level in the second time duration, is applied to a gate of the second transistor.
摘要:
A cassette tape player is combined with a radio receiver and has a plurality of player control buttons used for selecting the operation mode of the tape playing mechanism and, a radio control button used for operating the radio signal receiving device, and a stop button used for stopping either the tape playing mechanism or the radio signal receiving device, wherein one of the player control buttons or radio control button can be switched and the operating condition either one of the tape playing mechanism or the radio signal receiving device can to be released by manipulating the stop button.