摘要:
A positive photosensitive resin composition containing 100 parts by weight of a polyimide precursor (A) having a constituent unit represented by the formula (1), 15 to 25 parts by weight of a crosslinking agent (B) represented by the formula (2), and 2 to 5 parts by weight of a photosensitizer (C) generating acid upon irradiation of an actinic ray: wherein m is an integer of 1 or greater, and R is an aromatic group or an aliphatic group having a valency of 1 or higher. The positive photosensitive resin composition can be developed by using an aqueous solution of alkali metal carbonate, is capable of forming micropatterns, and has excellent thermal resistance and the like. A method for forming a positive pattern, and uses thereof are also provided.
摘要:
The invention is a polyimide, random copolymer having repeating units of the formula (1): wherein R1 and R2 each represent a divalent group selected from and R1 and R2 may be the same or different; and x=0.60 to 0.80, y+z=0.40 to 0.20, and x+y+z=1.00, and a linear expansion coefficient at 100 to 200° C. is in the range of from 10 to 20 ppm/K. This is a useful polyimide that can be a polyimide circuit substrate material capable of keeping flat, neither shrinking nor expanding in its laminate.
摘要翻译:本发明是具有式(1)的重复单元的聚酰亚胺无规共聚物:其中R1和R2各自表示选自二价基团,R 1和R 2可以相同或不同; x = 0.60〜0.80,y + z = 0.40〜0.20,x + y + z = 1.00,100〜200℃的线膨胀系数在10〜20ppm / K的范围内。 这是一种有用的聚酰亚胺,其可以是能够保持扁平的聚酰亚胺电路基板材料,既不收缩也不在其层压板中膨胀。
摘要:
The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).
摘要:
A positive photosensitive resin composition containing 100 parts by weight of a polyimide precursor (A) having a constituent unit represented by the formula (1), 15 to 25 parts by weight of a crosslinking agent (B) represented by the formula (2), and 2 to 5 parts by weight of a photosensitizer (C) generating acid upon irradiation of an actinic ray: wherein m is an integer of 1 or greater, and R is an aromatic group or an aliphatic group having a valency of 1 or higher. The positive photosensitive resin composition can be developed by using an aqueous solution of alkali metal carbonate, is capable of forming micropatterns, and has excellent thermal resistance and the like. A method for forming a positive pattern, and uses thereof are also provided.
摘要:
A polyamic acid solution includes a polyamic acid, a solvent (C) in which the polyamic acid (PAA1) is dissolved, and a substance (M) that can release at least one metal selected from groups 1 and 2 of the periodic table as a metal ion, or a substance (m) that contains the substance (M). A polyimide composite is produced from the polyamic acid solution. The polyimide composite can provide a greatly improved glass transition temperature without impairing the intrinsic physical properties of the polyimide.
摘要:
Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimide which is obtained by imidizing the polyamic acid and which has good properties intrinsic to polyimides, or that is, thermal resistance, mechanical properties, slidability, low water absorption, electric properties and radiation resistance intrinsic thereto. By varying the composition ratio of the starting diamine isomers, various polyimides having controlled thermal resistance, melt flowability, optical properties, chemical resistance and electric properties and capable of forming films of various forms can be obtained.
摘要:
Provided is a low-cost polyimide, containing cyclohexane diamine as a diamine unit, that has a low thermal expansion coefficient. Said block polyimide contains blocks having the repeating structural unit shown in formula (1A) and blocks having the repeating structural unit shown in formula (1B). This block polyimide is preferably obtained by imidizing a block polyamide acid imide that contains blocks having the repeating structural unit shown in formula (2A) and blocks having the repeating structural unit shown in formula (2B).
摘要:
Provided is a low-cost polyimide, containing cyclohexane diamine as a diamine unit, that has a low thermal expansion coefficient. Said block polyimide contains blocks having the repeating structural unit shown in formula (1A) and blocks having the repeating structural unit shown in formula (1B). This block polyimide is preferably obtained by imidizing a block polyamide acid imide that contains blocks having the repeating structural unit shown in formula (2A) and blocks having the repeating structural unit shown in formula (2B).
摘要:
A polyamic acid solution according to the present invention includes a polyamic acid, a solvent (C) in which the polyamic acid (PAA1) is dissolved, and a substance (M) that can release at least one metal selected from groups 1 and 2 of the periodic table as a metal ion, or a substance (m) that contains the substance (M). A polyimide composite according to the present invention is produced from the polyamic acid solution.The present invention provides a polyimide composite having a greatly improved glass transition temperature without impairing the intrinsic physical properties of the polyimide.
摘要:
The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).