公开(公告)号：US20130277553A1

公开(公告)日：2013-10-24

申请号：US13993838

申请日：2011-11-10

申请人： Yuko Otani ,  Yuta Urano ,  Toshifumi Honda

发明人： Yuko Otani ,  Yuta Urano ,  Toshifumi Honda

IPC分类号： H01J37/26

CPC分类号： H01J37/261 ,  G01N21/8806 ,  G01N21/9501

摘要： Disclosed are a method and an apparatus for observing defects by using an SEM, wherein, in order to observe defects on a wafer at high speed and high sensitivity, positional information of defects on a sample, which has been optically inspected and detected by other inspecting apparatus, and information of the conditions of the optical inspection having been performed by other inspecting apparatus are obtained, and optically detecting the defects on the sample placed on a table, on the basis of the thus obtained information, and on the basis of the detected positional information of the defect on the sample placed on the table, the positional information of the defect having been inspected and detected by other inspecting apparatus is corrected, then, the defects on the sample placed on the table are observed by the SEM using the thus corrected positional information of the defects.

摘要翻译： 公开了通过使用SEM观察缺陷的方法和装置，其中为了以高速和高灵敏度观察晶片上的缺陷，通过其他检查被光学检查和检测的样品上的缺陷的位置信息 获取了由其他检查装置执行的光学检查条件的信息，并根据所获得的信息，基于检测到的信息光学地检测放置在工作台上的样品上的缺陷 对放置在工作台上的样品上的缺陷的位置信息进行校正，由其他检查装置检查和检测的缺陷的位置信息被校正，然后通过SEM观察放置在工作台上的样品上的缺陷， 校正了缺陷的位置信息。

公开(公告)号：US20130155400A1

公开(公告)日：2013-06-20

申请号：US13700520

申请日：2011-05-20

申请人： Toshiyuki Nakao ,  Junguo Xu ,  Yuki Shimizu ,  Toshihiko Nakata ,  Toshifumi Honda ,  Yukihiro Shibata ,  Yuta Urano

发明人： Toshiyuki Nakao ,  Junguo Xu ,  Yuki Shimizu ,  Toshihiko Nakata ,  Toshifumi Honda ,  Yukihiro Shibata ,  Yuta Urano

IPC分类号： G01N21/95

CPC分类号： G01N21/95 ,  G01N21/9501 ,  G01Q60/22 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： A defect inspecting method is provided which comprises a pre-scan defect inspecting process including a pre-scan irradiating step for casting irradiation light onto the surface of a sample, a pre-scan detecting step for detecting the scattered lights, and a pre-scan defect information collecting step for obtaining information on preselected defects present on the sample surface on the basis of the scattered lights; a near-field defect inspecting process including a near-field irradiating step in which the distance between the sample surface and a near-field head is adjusted so that the sample surface is irradiated, a near-field detecting step for detecting near-field light response, and a near-field defect information collecting step for obtaining information on the preselected defects on the basis of the near-field light response; and a merging process for inspecting defects present on the sample surface by merging the pieces of information on the preselected defects.

摘要翻译： 提供一种缺陷检查方法，其包括预扫描缺陷检查处理，其包括用于将照射光投射到样品表面上的预扫描照射步骤，用于检测散射光的预扫描检测步骤，以及预扫描 缺陷信息收集步骤，用于基于散射光获得在样品表面上存在的预选缺陷的信息; 包括近场照射步骤的近场缺陷检查处理，其中调整样品表面和近场磁头之间的距离以照射样品表面;近场检测步骤，用于检测近场光 响应和近场缺陷信息收集步骤，用于基于近场光响应获得关于预选缺陷的信息; 以及通过合并关于预选缺陷的信息来检查存在于样品表面上的缺陷的合并过程。

公开(公告)号：US09588054B2

公开(公告)日：2017-03-07

申请号：US13882542

申请日：2011-10-14

申请人： Yuta Urano ,  Toshifumi Honda ,  Takahiro Jingu

发明人： Yuta Urano ,  Toshifumi Honda ,  Takahiro Jingu

IPC分类号： G01N21/86 ,  H01J3/14 ,  G01N21/88 ,  G01N21/95 ,  G01N21/956

CPC分类号： G01N21/8806 ,  G01N21/4795 ,  G01N21/8851 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8835

摘要： A defect inspection method includes an illumination light adjustment step of adjusting light emitted from a light source, an illumination intensity distribution control step of forming light flux obtained in the illumination light adjustment step into desired illumination intensity distribution, a sample scanning step of displacing a sample in a direction substantially perpendicular to a longitudinal direction of the illumination intensity distribution, a scattered light detection step of counting the number of photons of scattered light emitted from plural small areas in an area irradiated with illumination light to produce plural scattered light detection signals corresponding to the plural small areas, a defect judgment step of processing the plural scattered light detection signals to judge presence of a defect, a defect dimension judgment step of judging dimensions of the defect in each place in which the defect is judged to be present and a display step of displaying a position on sample surface and the dimensions of the defect in each place in which the defect is judged to be present.

摘要翻译： 缺陷检查方法包括调整从光源发出的光的照明光调节步骤，将在所述照明光调节步骤中获得的光束形成为期望的照度分布的照度分布控制步骤，将样品置换的样本扫描步骤 在与照明强度分布的长度方向大致正交的方向上，对从照明光照射的区域的多个小区域发射的散射光的光数进行计数，生成与多个散射光检测信号对应的散射光检测信号的散射光检测步骤 多个小区域，处理多个散射光检测信号以判断缺陷的存在的缺陷判断步骤，判断存在缺陷的每个位置的缺陷的尺寸的缺陷维度判断步骤和显示 显示位置的步骤o n样品表面和缺陷的每个位置的缺陷的尺寸。

公开(公告)号：US09041921B2

公开(公告)日：2015-05-26

申请号：US13519138

申请日：2011-01-17

申请人： Toshiyuki Nakao ,  Shigenobu Maruyama ,  Yuta Urano ,  Toshifumi Honda

发明人： Toshiyuki Nakao ,  Shigenobu Maruyama ,  Yuta Urano ,  Toshifumi Honda

IPC分类号： G01N21/00 ,  G01N21/95 ,  G01N21/47

CPC分类号： G01N21/9501 ,  G01N21/47

摘要： A defect inspection device has: an illumination optical system which irradiates a predetermined region of an inspection target with illumination light; a detection optical system which has a detector provided with a plurality of pixels by which scattered light from the predetermined region of the inspection target due to illumination light from the illumination optical system can be detected; and a signal processing portion which is provided with a correction portion which corrects pixel displacement caused by change in a direction perpendicular to a surface of the inspection target with respect to a detection signal based on the scattered light detected by the detector of the detection optical system, and a defect determination portion which determines a defect on the surface of the inspection target based on the detection signal corrected by the correction portion.

摘要翻译： 缺陷检查装置具有：利用照明光照射检查对象物的规定区域的照明光学系统; 检测光学系统，其具有检测器，该检测器设置有多个像素，通过该检测器能够检测来自照明光学系统的照明光来自检查对象物的预定区域的散射光; 以及信号处理部，其具有校正部，该校正部基于由检测光学系统的检测器检测到的散射光，相对于检测信号校正与垂直于检查对象的表面的方向的变化引起的像素位移 以及缺陷确定部分，其基于由校正部分校正的检测信号来确定检查对象的表面上的缺陷。

公开(公告)号：US20140009755A1

公开(公告)日：2014-01-09

申请号：US13701834

申请日：2011-07-01

申请人： Yukihiro Shibata ,  Toshiyuki Nakao ,  Yuta Urano ,  Toshifumi Honda

发明人： Yukihiro Shibata ,  Toshiyuki Nakao ,  Yuta Urano ,  Toshifumi Honda

IPC分类号： G01N21/956

CPC分类号： G01N21/956 ,  G01N21/8806 ,  G01N21/9501

摘要： In order to enable inspections to be conducted at a sampling rate higher than the pulse oscillation frequency of a pulsed laser beam emitted from a laser light source, without damaging samples, a defect inspection method is disclosed, wherein: a single pulse of a pulsed laser beam emitted from the laser light source is split into a plurality of pulses; a sample is irradiated with this pulse-split pulsed laser beam; scattered light produced by the sample due to the irradiation is focused and detected; and defects on the sample are detected by using information obtained by focusing and detecting the scattered light from the sample. Said defect inspection method is configured such that the splitting a single pulse of the pulsed laser beam into a plurality of pulses is controlled in such a manner that the peak values of the split pulses are substantially uniform.

摘要翻译： 为了使得能够以高于从激光光源发射的脉冲激光束的脉冲振荡频率的采样率进行检查，而不损害样品，公开了一种缺陷检查方法，其中：脉冲激光的单个脉冲 从激光光源发射的光束被分成多个脉冲; 用脉冲分割脉冲激光束照射样品; 聚焦和检测由于照射产生的样品产生的散射光; 通过使用通过聚焦和检测来自样品的散射光获得的信息来检测样品上的缺陷。 所述缺陷检查方法被配置为使得将脉冲激光束的单个脉冲分裂成多个脉冲以使得分离脉冲的峰值基本上均匀的方式被控制。

公开(公告)号：US20130003052A1

公开(公告)日：2013-01-03

申请号：US13519138

申请日：2011-01-17

申请人： Toshiyuki Nakao ,  Shigenobu Maruyama ,  Yuta Urano ,  Toshifumi Honda

发明人： Toshiyuki Nakao ,  Shigenobu Maruyama ,  Yuta Urano ,  Toshifumi Honda

IPC分类号： G01N21/956

CPC分类号： G01N21/9501 ,  G01N21/47

摘要： A defect inspection device has: an illumination optical system which irradiates a predetermined region of an inspection target with illumination light; a detection optical system which has a detector provided with a plurality of pixels by which scattered light from the predetermined region of the inspection target due to illumination light from the illumination optical system can be detected; and a signal processing portion which is provided with a correction portion which corrects pixel displacement caused by change in a direction perpendicular to a surface of the inspection target with respect to a detection signal based on the scattered light detected by the detector of the detection optical system, and a defect determination portion which determines a defect on the surface of the inspection target based on the detection signal corrected by the correction portion.

摘要翻译： 缺陷检查装置具有：利用照明光照射检查对象物的规定区域的照明光学系统; 检测光学系统，其具有检测器，该检测器设置有多个像素，通过该检测器能够检测来自照明光学系统的照明光来自检查对象物的预定区域的散射光; 以及信号处理部，其具有校正部，该校正部基于由检测光学系统的检测器检测到的散射光，相对于检测信号校正与垂直于检查对象的表面的方向的变化引起的像素位移 以及缺陷确定部分，其基于由校正部分校正的检测信号来确定检查对象的表面上的缺陷。

公开(公告)号：US20120194807A1

公开(公告)日：2012-08-02

申请号：US13387120

申请日：2010-07-28

申请人： Shigenobu Maruyama ,  Toshifumi Honda ,  Toshiyuki Nakao ,  Yuta Urano

发明人： Shigenobu Maruyama ,  Toshifumi Honda ,  Toshiyuki Nakao ,  Yuta Urano

IPC分类号： G01N21/95

CPC分类号： G01N21/9501 ,  G01N21/47

摘要： In order to maximize the effect of signal addition during inspection of foreign substances in wafers, a device structure including line sensors arranged in plural directions is effective. Low-angle detection optical systems that detect light beams in plural azimuth directions, the light beams being scattered in low angle directions among those scattered from a linear area on a sample illuminated by illuminating means, each include a combination of a first imaging lens group (330) and a diffraction grating (340) and a combination of a second imaging lens group (333) and an image detector (350) having a plurality of light receiving surfaces. A signal processing unit processes signals from the image detectors of the low-angle detection optical systems by adding the signals from the light receiving surfaces corresponding between the image detectors.

摘要翻译： 为了最大限度地发挥在晶片中异物检查期间信号增加的效果，包括沿多个方向布置的线传感器的装置结构是有效的。 检测在多个方位方向上的光束的低角度检测光学系统，所述光束在从照明装置照射的样品上的线性区域散射的那些中以低角度方向散射，各自包括第一成像透镜组（ 330）和衍射光栅（340）以及具有多个光接收表面的第二成像透镜组（333）和图像检测器（350）的组合。 信号处理单元通过将来自相应于图像检测器之间的光接收表面的信号相加来处理来自低角度检测光学系统的图像检测器的信号。

公开(公告)号：US08748795B2

公开(公告)日：2014-06-10

申请号：US12329274

申请日：2008-12-05

申请人： Yuta Urano ,  Hiroyuki Nakano ,  Shunji Maeda ,  Sachio Uto

发明人： Yuta Urano ,  Hiroyuki Nakano ,  Shunji Maeda ,  Sachio Uto

IPC分类号： G01N21/00

CPC分类号： G01N21/9501 ,  G01N21/47 ,  G01N21/4788 ,  G01N21/94 ,  G01N21/956

摘要： When using a CCD sensor as a photo-detector in a device for inspecting foreign matters and defects, it has a problem of causing electric noise while converting the signal charge, produced inside by photoelectric conversion, into voltage and reading it. Therefore, the weak detected signal obtained by detecting reflected and scattered light from small foreign matters and defects is buried in the electric noise, which has been an obstacle in detecting small foreign matters and defects. In order to solve the above problem, according to the present invention, an electron multiplying CCD sensor is used as a photo-detector. The electron multiplying CCD sensor is capable of enlarging signals brought about by inputted light relatively to the electric noise by multiplying the electrons produced through photoelectric conversion and reading them. Accordingly, compared to a conventional CCD sensor, it can detect weaker light and, therefore, smaller foreign matters and defects.

摘要翻译： 当在用于检查异物和缺陷的装置中使用CCD传感器作为光检测器时，存在在将由光电转换产生的信号电荷转换成电压并读取的同时将电噪声引起的问题。 因此，通过检测来自小异物和缺陷的反射和散射光获得的弱检测信号被埋在电噪声中，这是检测小异物和缺陷的障碍。 为了解决上述问题，根据本发明，使用电子倍增CCD传感器作为光检测器。 电子倍增CCD传感器能够通过将通过光电转换产生的电子与其进行读取而相对于电噪声放大由输入的光产生的信号。 因此，与常规CCD传感器相比，它可以检测较弱的光，因此可以检测较小的异物和缺陷。

公开(公告)号：US08144337B2

公开(公告)日：2012-03-27

申请号：US12470505

申请日：2009-05-22

申请人： Akira Hamamatsu ,  Yoshimasa Oshima ,  Shunji Maeda ,  Hisae Shibuya ,  Yuta Urano ,  Toshiyuki Nakao ,  Shigenobu Maruyama

发明人： Akira Hamamatsu ,  Yoshimasa Oshima ,  Shunji Maeda ,  Hisae Shibuya ,  Yuta Urano ,  Toshiyuki Nakao ,  Shigenobu Maruyama

IPC分类号： G01B11/30

CPC分类号： G01B11/303 ,  G01N21/47 ,  G01N21/94 ,  G01N21/9501

摘要： To inspect a substrate such as a semiconductor substrate for surface roughness at high precision.The surface roughness of the substrate is measured in each frequency band of the surface roughness by applying a light to the substrate surface and detecting a scattered light or reflected light at a plurality of azimuth or elevation angles.

摘要翻译： 以高精度检查用于表面粗糙度的半导体基板等基板。 通过向基板表面施加光并以多个方位角或仰角检测散射光或反射光，测量表面粗糙度的每个频带中的基板的表面粗糙度。

公开(公告)号：US07777876B2

公开(公告)日：2010-08-17

申请号：US12167570

申请日：2008-07-03

申请人： Izuo Horai ,  Hirokazu Koyabu ,  Yuta Urano ,  Takahiro Jingu

发明人： Izuo Horai ,  Hirokazu Koyabu ,  Yuta Urano ,  Takahiro Jingu

IPC分类号： G01N21/00

CPC分类号： G01N21/9501 ,  G01N21/65 ,  G01N21/9505 ,  G01N2021/4711 ,  G01N2021/473 ,  G01N2021/8861 ,  G01N2021/8864

摘要： An inspection method and an inspection device, or apparatus each capable of conducting composition analysis of a defect detected by elastic or stokes scattered light, an inspection surface or defect on the surface of the inspection surface, or a defect on the surface of the inspection object and its internal composition. A surface inspection method for optically detecting elastic or stokes scattering or inelastic or anti-stokes scattered light from inside the surface of the inspection object, for detecting existence of defects of the inspection object and features of the defects, for detecting positions of the detected defects on the surface of the inspection object, classifying and analyzing the detected defects in accordance with their features on the basis of the positions of the defects and the features of the defects or the classification result of the defects.

摘要翻译： 检查方法和检查装置或装置，其能够对由检查表面的弹性或sto kes散射光，检查面或缺陷检测到的缺陷或检​​查对象的表面上的缺陷进行组成分析 及其内在组成。 一种表面检查方法，用于光学检测来自检查对象的表面内的弹性或斯托克斯散射或非弹性或反射散射光，用于检测检查对象的缺陷的存在和缺陷的特征，用于检测检测到的缺陷的位置 在检查对象的表面上，根据缺陷的位置和缺陷的特征或缺陷的分类结果，根据其特征对检测到的缺陷进行分类和分析。