公开(公告)号：US08375852B2

公开(公告)日：2013-02-19

申请号：US13267453

申请日：2011-10-06

Applicant: Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

Inventor： Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

IPC: B05C17/04

CPC classification number: B41F15/0818 ,  B41P2215/10 ,  B41P2215/50 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/3484

Abstract: A screen printer capable of concurrently, efficiently subjecting a plurality of different types of substrates, to a printing operation. The screen printer makes up an electronic component mounting line and prints electronic component bonding paste on a substrate. A substrate conveyance section that conveys a substrate forwardly or backwardly in a direction of conveyance of a substrate is disposed at an intermediate position between a first screen printing section and a second screen printing section arranged symmetrically with respect to a center line CL. It thereby becomes possible to adopt a variety of substrate conveyance forms, as required, such as return conveyance for returning the substrate from a downstream machine to an upstream side of the screen printer and bypass conveyance for letting the substrate sent from an upstream side pass through the screen printer, to thus be conveyed to a downstream machine.

Abstract translation: 一种能够同时有效地对多种不同类型的基板进行打印操作的丝网印刷机。 丝网印刷机构成电子部件安装线，并将电子部件粘合膏印刷在基板上。 在基板的输送方向上向前或向后输送基板的基板输送部配置在相对于中心线CL对称配置的第一丝网印刷部和第二丝网印刷部之间的中间位置。 从而可以根据需要采用各种基板输送形式，例如用于将基板从下游机器返回到丝网印刷机的上游侧的返回传送器和用于使从上游侧发送的基板通过的旁路输送 丝网印刷机，从而被输送到下游机器。

公开(公告)号：US08327761B2

公开(公告)日：2012-12-11

申请号：US13267372

申请日：2011-10-06

Applicant: Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

Inventor： Seiichi Miyahara ,  Kazuhide Nagao ,  Wataru Hidese ,  Yoshiaki Awata

IPC: B05C17/06

CPC classification number: B41F15/0818 ,  B41P2215/10 ,  B41P2215/50 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/3484

Abstract: A screen printer capable of concurrently, efficiently subjecting a plurality of different types of substrates, to a printing operation. The screen printer makes up an electronic component mounting line and prints electronic component bonding paste on a substrate. A substrate conveyance section that conveys a substrate forwardly or backwardly in a direction of conveyance of a substrate is disposed at an intermediate position between a first screen printing section and a second screen printing section arranged symmetrically with respect to a center line CL. It thereby becomes possible to adopt a variety of substrate conveyance forms, as required, such as return conveyance for returning the substrate from a downstream machine to an upstream side of the screen printer and bypass conveyance for letting the substrate sent from an upstream side pass through the screen printer, to thus be conveyed to a downstream machine.

Abstract translation: 一种能够同时有效地对多种不同类型的基板进行打印操作的丝网印刷机。 丝网印刷机构成电子部件安装线，并将电子部件粘合膏印刷在基板上。 在基板的输送方向上向前或向后输送基板的基板输送部配置在相对于中心线CL对称配置的第一丝网印刷部和第二丝网印刷部之间的中间位置。 从而可以根据需要采用各种基板输送形式，例如用于将基板从下游机器返回到丝网印刷机的上游侧的返回传送器和用于使从上游侧发送的基板通过的旁路输送 丝网印刷机，从而被输送到下游机器。

公开(公告)号：US07137195B2

公开(公告)日：2006-11-21

申请号：US10763495

申请日：2004-01-23

Applicant: Hiroshi Haji ,  Wataru Hidese

Inventor： Hiroshi Haji ,  Wataru Hidese

IPC: H05K3/30

CPC classification number: H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261 ,  Y10T29/53478

Abstract: Provided is an electronic parts mount apparatus for taking out semiconductor chips from a semiconductor wafer held on a wafer hold section by a transfer head comprising a plurality of suction nozzles and transporting and mounting the semiconductor chips to and on a board has a parts recognition camera disposed in a manner that it can advance to and retreat from the wafer hold section for picking up an image of the semiconductor wafer. Also provided is a method including a parts mounting step for mounting a plurality of semiconductor chips on the board by the transfer head and an image picking up step for picking up a plurality of semiconductor chips to be next taken out by the parts recognition camera which are performed concurrently.

Abstract translation: 提供一种电子部件安装装置，用于通过包括多个吸嘴的转印头从保持在晶片保持部分上的半导体晶片取出半导体芯片，并将半导体芯片传送和安装到板上并具有一个部件识别相机 以使其可以前进到用于拾取半导体晶片的图像的晶片保持部分退回。 还提供了一种方法，包括用于通过传送头将多个半导体芯片安装在板上的部件安装步骤和用于拾取要由部件识别相机取出的多个半导体芯片的图像拾取步骤 同时执行。

公开(公告)号：US20050108873A1

公开(公告)日：2005-05-26

申请号：US10998470

申请日：2004-11-29

Applicant: Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

Inventor： Wataru Hidese ,  Toshiaki Nakashima ,  Hiroshi Haji

IPC: H01L21/00 ,  H01L21/68 ,  H05K13/04 ,  H05K3/30

CPC classification number: H01L21/67259 ,  H01L21/67144 ,  H01L21/681 ,  H05K13/0452 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53039 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53204

Abstract: An electronic parts mount apparatus for taking out electronic parts from a parts supply section 3by a transfer head 9 and transporting and mounting the electronic parts to and on a board 2 has a board recognition camera 15 moving independently of the transfer head 9 and advancing to and retreating from the board 2 positioned on a transfer passage 1 for picking up an image of the board 2 to detect the position thereof. The image pickup step of the board 2 by the board recognition camera 15 and the parts taking out step in the parts supply section by the transfer head 9 are performed concurrently. Thus, the tact time can be shortened and the electronic parts can be mounted on the board efficiently.

Abstract translation: 一种用于通过转印头9从零件供应部分3中取出电子部件并将电子部件运输和安装到板2上的电子部件安装装置具有独立于转印头9移动并前进到 并且从位于传送通道1上的板2退回以拾取板2的图像以检测其位置。 同时执行由板识别摄像机15进行的板2的图像拾取步骤以及由转印头9在零件供给部中取出步骤的部分。 因此，可以缩短生产节拍时间，并且可以有效地将电子部件安装在板上。

公开(公告)号：US06874225B2

公开(公告)日：2005-04-05

申请号：US10316348

申请日：2002-12-11

Applicant: Hiroshi Haji ,  Wataru Hidese

Inventor： Hiroshi Haji ,  Wataru Hidese

IPC: H01L23/48 ,  H01L21/00 ,  B23P19/00

CPC classification number: H01L21/67253 ,  H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53261

Abstract: In this electronic component mounting apparatus, a mounting head is movably arranged between the electronic component supplying unit and the board holding unit. A first camera for taking an image of the board in the board holding unit and detecting an electronic component mounting position, and a second camera for taking images of the chips of the electronic component supplying unit are arranged in such a manner that the first camera and the second camera can be entered/evacuated as against the electronic component supplying unit. Therefore, the electronic component supplying unit and the board holding unit are defined as a range to be transported, and the mounting head, the first camera, and the second camera are relatively traveled in conjunction to each other, a loss-time in both the electronic component supplying unit and the board holding unit can be avoided, and tact time can be shortened to improve a work-efficiency.

Abstract translation: 在该电子部件安装装置中，安装头可移动地布置在电子部件供应单元和板保持单元之间。 用于拍摄板保持单元中的板的图像并检测电子部件安装位置的第一相机和用于拍摄电子部件供应单元的芯片的图像的第二相机被布置成使得第一相机和 可以相对于电子元件供应单元进入/排出第二相机。 因此，将电子元件供给单元和基板保持单元定义为要输送的范围，并且安装头，第一相机和第二相机彼此相对行进，在两者中的损失时间 可以避免电子元件供给单元和板保持单元，并且能够缩短节拍时间，提高作业效率。

公开(公告)号：US5342460A

公开(公告)日：1994-08-30

申请号：US152063

申请日：1993-11-12

Applicant: Wataru Hidese

Inventor： Wataru Hidese

IPC: B23K37/047 ,  H01L21/00 ,  B32B31/00

CPC classification number: H01L21/67138 ,  B23K37/047 ,  B32B38/1841 ,  B23K2201/36 ,  Y10T156/17 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183

Abstract: An outer lead bonding apparatus which includes a device supply section on which devices are arranged at predetermined positions, a transfer head assembly for picking up the devices from the device supply section, means for driving the transfer head assembly in a predetermined direction, a first monitoring camera for checking the devices picked up by the transfer head assembly for its positional exactness, a substrate driving means for moving the substrate in a predetermined direction, and a second monitoring camera for checking the electrodes of the substrate for their positional exactness.

Abstract translation: 一种外引线接合装置，包括设置在预定位置的装置供给部，用于从装置供给部拾取装置的转印头组件，用于沿预定方向驱动转印头组件的装置，第一监视 相机，用于检查由转印头组件拾取的装置的位置精确度，基板驱动装置，用于沿预定方向移动基板;以及第二监视照相机，用于检查基板的电极的位置精度。

公开(公告)号：US5338381A

公开(公告)日：1994-08-16

申请号：US53316

申请日：1993-04-27

Applicant: Wataru Hidese

Inventor： Wataru Hidese

IPC: H01L21/60 ,  H01L21/00 ,  H01L21/50 ,  B65G25/00 ,  B32B31/00

CPC classification number: H01L21/67132 ,  Y10T156/171 ,  Y10T156/1768 ,  Y10T29/53178

Abstract: A TAB method is known to manufacture an electrical component by bonding a semiconductor on a film carrier made of synthetic resin, then punching the lead of the film carrier, and bonding a device obtained by punching to a circuit board. A bonding of a semiconductor to a film carrier as described above is called "an inner lead bonding". Bonding a punched device to a circuit board is called "an outer lead bonding". In the invention, the film carrier fed from the supply reel is punched by a punching unit, and the device obtained by punching is picked up by a bonding head. Then, the positional deviation of the lead of the device picked up with respect to the electrode of the circuit board is detected by the optical means. Subsequently, the positional deviation of the lead is corrected, the device is placed on the circuit board, and the lead is fusion-bonded to the electrode of the circuit board.

Abstract translation: 已知TAB方法通过将由合成树脂制成的薄膜载体上的半导体结合，然后冲压薄膜载体的引线，并将通过冲孔获得的装置接合到电路板来制造电气部件。 如上所述将半导体与膜载体的接合称为“内引线接合”。 将穿孔装置连接到电路板上称为“外引线接合”。 在本发明中，由供给卷轴供给的胶片载体由冲压单元冲压，并且通过冲压获得的装置由接合头拾取。 然后，通过光学装置检测相对于电路板的电极拾取的装置的引线的位置偏移。 随后，对引线的位置偏差进行校正，将器件放置在电路板上，引线熔接到电路板的电极。

公开(公告)号：US5113581A

公开(公告)日：1992-05-19

申请号：US626060

申请日：1990-12-13

Applicant: Wataru Hidese

Inventor： Wataru Hidese

IPC: B23K3/047 ,  H05K13/04

CPC classification number: H05K13/0465 ,  B23K3/0471 ,  H05K13/0408 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

Abstract: A nozzle shaft is moved down, and a semiconductor chip sucked to the lower end of the nozzle shaft is placed on a circuit board. Then, a thermally press-bonding member is moved down, and the outer leads of the semiconductor chip are pressed to the circuit board by the thermally press-bonding member. Thereafter, the thermally press-bonded member is pressed by pressing means to strongly press the outer leads to the circuit board, the thermally press-bonding member is then raised to release the pressing state, and the outer leads are thermally press-bonded to the circuit board.

Abstract translation: 喷嘴轴向下移动，并且吸引到喷嘴轴的下端的半导体芯片被放置在电路板上。 然后，热压接部件向下移动，并且半导体芯片的外引线通过热压接部件压向电路板。 然后，通过按压机构按压热压接部件，将外部引线强力地按压到电路基板上，然后将热压接部件升高以解除加压状态，将外部引线热压接在 电路板。