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公开(公告)号：US09111690B2
公开(公告)日：2015-08-18
申请号：US12543549
申请日：2009-08-19
CPC分类号： H01G4/2325 , H01C1/148 , H01C7/18 , H01G4/30 , Y10T29/435
摘要： A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other.
摘要翻译： 一种方法用于制造包括多层复合材料的多层电子部件，所述多层复合材料包括具有在所述多层复合材料的预定表面露出的端部的内部电极。 在该方法中，内部电极的露出端涂覆有主要由选自Pd，Au，Pt和Ag的至少一种金属的金属膜，并且具有至少约0.1μm的厚度，通过将 在含有金属离子或金属络合物的液体中的多层复合材料。 然后，通过在暴露于多层复合材料的预定表面的内部电极的端部上沉积电镀金属，随后使电镀金属的沉积物彼此连接而形成连续镀层。 因此，内部电极的露出端彼此电连接。
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公开(公告)号：US08228663B2
公开(公告)日：2012-07-24
申请号：US12616844
申请日：2009-11-12
CPC分类号： H01G4/232 , H01G4/2325 , H01G4/30
摘要： In a laminated ceramic electronic component, external terminal electrodes include plating films directly covering exposed portions of internal electrodes on end surfaces of a ceramic element assembly. On the boundaries between the end surfaces and principal surfaces of the ceramic element assembly, substantially rounded corners are provided, and the plating films are arranged such that the ends of the plating films stop at the corners and do not project from the principal surfaces.
摘要翻译： 在层叠陶瓷电子部件中，外部端子电极包括直接覆盖陶瓷元件组件的端面上的内部电极的露出部分的电镀膜。 在陶瓷元件组件的端面和主面之间的边界上，设置大致圆角，并且镀膜被布置成使得镀膜的端部停止在角部并且不从主表面突出。
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23.发明授权公开(公告)号：US08077445B2
公开(公告)日：2011-12-13
申请号：US12405370
申请日：2009-03-17
申请人： Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Seiichi Nishihara , Shuji Matsumoto
发明人： Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Seiichi Nishihara , Shuji Matsumoto
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , B32B18/00 , C04B2237/346 , C04B2237/66 , C04B2237/68 , C04B2237/704 , H01C1/142 , H01C7/008 , H01G4/232 , Y10T428/265 , Y10T428/31678
摘要： A method for manufacturing a monolithic ceramic electronic component includes a plating substep of depositing precipitates primarily composed of a specific metal on an end of each of internal electrodes exposed at a predetermined surface of a laminate and growing the precipitates to coalesce into a continuous plated layer, wherein the specific metal is different from that of the internal electrodes, and the same or substantially the same metal that defines the internal electrodes is distributed throughout the plated layer.
摘要翻译： 一种用于制造单块陶瓷电子部件的方法包括：在层叠体的预定表面露出的每个内部电极的端部上沉积主要由特定金属构成的析出物的电镀子步骤，并使析出物凝聚成连续镀层， 其中特定金属与内部电极不同，并且限定内部电极的相同或基本相同的金属分布在整个镀层中。
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公开(公告)号：US08717739B2
公开(公告)日：2014-05-06
申请号：US13419545
申请日：2012-03-14
摘要： A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.
摘要翻译： 陶瓷电子部件包括大致矩形的陶瓷元件组件，第一外部电极和第二外部电极。 第一外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第一镀膜。 类似地，第二外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第二镀膜。 在平面图中，第一和第二电镀膜的每单位面积的表面积等于或大于约1.02。
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25.发明授权Method for manufacturing ceramic electronic component and ceramic electronic component 有权制造陶瓷电子部件和陶瓷电子部件的方法公开(公告)号：US08334748B2
公开(公告)日：2012-12-18
申请号：US13357671
申请日：2012-01-25
申请人： Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
发明人： Syunsuke Takeuchi , Teruyo Katayama , Toshiyuki Iwanaga , Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki
IPC分类号： H01F5/00
摘要： A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.
摘要翻译： 陶瓷电子部件的制造方法包括以下步骤：制备包括多个第一内部电极和多个第二内部电极的陶瓷体，将所述陶瓷体加工成约102％〜约153％的内部电极曝光率， 并对其进行电镀，在其上形成镀层。
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公开(公告)号：US08125763B2
公开(公告)日：2012-02-28
申请号：US12490471
申请日：2009-06-24
申请人： Tatsunori Kobayashi , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
发明人： Tatsunori Kobayashi , Akihiro Motoki , Makoto Ogawa , Toshiyuki Iwanaga , Shunsuke Takeuchi , Kenichi Kawasaki
CPC分类号： H01G4/005 , H01G4/232 , H01G4/30 , Y10T29/435
摘要： A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes.
摘要翻译： 多层陶瓷电子部件包括外部端子电极，其通过在嵌入陶瓷体的内部导体的露出部分上沉积金属电镀膜而形成，沉积覆盖金属电镀膜的铜电镀膜并与金属周围的陶瓷体接触 并对该陶瓷体进行热处理，以在铜镀膜和陶瓷体之间产生铜液相，氧液相，铜固相。 包括这些相的混合相至少在陶瓷体和镀铜膜之间的界面处形成铜镀层内不连续地存在氧化铜的区域。 铜氧化物将铜电镀膜牢固地附着在陶瓷体上，提高外部端子电极的结合力。
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公开(公告)号：US08633636B2
公开(公告)日：2014-01-21
申请号：US13189636
申请日：2011-07-25
申请人： Toshiyuki Iwanaga , Makoto Ogawa
发明人： Toshiyuki Iwanaga , Makoto Ogawa
IPC分类号： H01L21/20 , H01L41/047 , H01L41/083
摘要： In a method for manufacturing a laminated ceramic electronic component, when a plating film to define an external terminal electrode is formed by plating exposed ends of a plurality of internal electrodes at a WT surface of a component main body, ingress of a plating solution may be caused from a gap between an end edge of the plating film and the component main body to decrease the reliability of a laminated electronic component obtained. An internal dummy electrode is provided around a region where the exposed ends of the plurality of internal electrodes are distributed in the WT surface of the component main body. The internal dummy electrode includes two LW-direction sections extending parallel or substantially parallel to each other in a direction along the LW surface, and two LT-direction sections extending parallel or substantially parallel to each other in a direction along the LT surface. The plating film is formed at least over the exposed end of the internal dummy electrode. The internal dummy electrode is formed by wrapping an outer layer sheet with the internal dummy electrode formed around a laminate composed of ceramic layers and the internal electrodes.
摘要翻译： 在层叠陶瓷电子部件的制造方法中，当通过在组件主体的WT表面上镀覆多个内部电极的露出端来形成限定外部端子电极的镀膜时，电镀液的入射可以是 由镀膜的端部边缘与部件主体之间的间隙引起，从而降低了获得的层叠电子部件的可靠性。 在多个内部电极的露出端分布在构件主体的WT面内的区域周围设置有内部虚设电极。 内部虚拟电极包括沿着LW表面的方向彼此平行或基本平行延伸的两个LW方向部分和沿着LT表面的方向彼此平行或基本平行延伸的两个LT方向部分。 至少在内部虚拟电极的露出端上形成镀膜。 内部虚拟电极通过将外层片材包裹在由陶瓷层和内部电极构成的层叠体周围形成的内部虚拟电极而形成。
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28.发明授权公开(公告)号：US08154848B2
公开(公告)日：2012-04-10
申请号：US12354026
申请日：2009-01-15
摘要： A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less.
摘要翻译： 多层陶瓷电子部件包括层叠体，其包括多个陶瓷层的叠层和沿着陶瓷层之间的界面延伸的多个内部电极，以及电连接在层叠体的表面露出的内部电极的多个外部电极。 每个外部电极至少包括直接连接到内部电极的部分的镀层。 镀层的压缩应力为约100MPa以下或拉伸膜应力为约100MPa以下。
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公开(公告)号：US07764484B2
公开(公告)日：2010-07-27
申请号：US12142924
申请日：2008-06-20
IPC分类号： H01G4/00
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325 , H05K1/0306 , H05K1/092 , H05K3/102 , H05K3/246 , H05K3/403 , H05K2201/0347 , H05K2203/025 , Y10T29/417 , Y10T29/43 , Y10T29/435 , Y10T428/25
摘要： A method for manufacturing a multilayer electronic component includes a step of preparing a laminate which includes a plurality of stacked insulator layers and a plurality of internal electrodes extending along the interfaces between the insulator layers, and in which an end of each of the plurality of internal electrodes is exposed at a predetermined surface corresponding to one of the first and second end surfaces; a step of forming external electrodes on the predetermined surfaces; and a step of forming thick-film edge electrodes at edge portions. The step of forming external electrodes includes a step of attaching a plurality of conductive particles having a particle size of about 1 μm or more to the predetermined surfaces of the laminate, and a step of performing plating directly on the predetermined surfaces to which the conductive particles are attached.
摘要翻译： 一种制造多层电子部件的方法包括制备层压体的步骤，该层压体包括多个堆叠的绝缘体层和沿着绝缘体层之间的界面延伸的多个内部电极，并且其中多个内部 电极在对应于第一和第二端面之一的预定表面处露出; 在所述预定表面上形成外部电极的步骤; 以及在边缘部分形成厚膜边缘电极的步骤。 形成外部电极的步骤包括将多个具有约1μm以上的粒径的导电粒子附着在层叠体的规定表面上的步骤，以及在导电粒子的规定表面上直接进行电镀的工序 附上。
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公开(公告)号：US07589952B2
公开(公告)日：2009-09-15
申请号：US12109371
申请日：2008-04-25
IPC分类号： H01G4/228
CPC分类号： H01G4/2325 , H01G4/30 , Y10T29/435
摘要： A multilayer electronic device includes a laminate and an external electrode that is formed on an end surface of the laminate after a plurality of conductive particles having a particle diameter of about 1 μm or more is adhered to the end surface of the laminate, for example, by a sandblast method or a brush polishing method. The external electrode is defined by a plating film that is formed by electroplating or electroless plating.
摘要翻译： 例如，多层电子器件包括层压体和形成在层叠体的端面上的外部电极，该多个电子器件在层叠体的端面附着有多个粒径为1μm以上的导电粒子之后， 通过喷砂法或刷子抛光法。 外部电极由通过电镀或无电镀形成的电镀膜限定。
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