公开(公告)号：US20060281347A1

公开(公告)日：2006-12-14

申请号：US11251718

申请日：2005-10-17

Applicant: Wen-Ching Wu

Inventor： Wen-Ching Wu

IPC: H01R12/00

CPC classification number: H01R13/115 ,  H01R43/0256

Abstract: A fixing auxiliary device includes a main body, at least an extension arm and an adhesive element. The main body has a first portion in contact with a connecting portion of a circuit board and a second portion coupled to an extension plate of a metallic assembly. The at least an extension arm extends from an edge of the main body and is bent toward one side of the main body so as to clamp the extension plate of the metallic assembly. The adhesive element is used for bonding the first portion of the main body onto the connecting portion of the circuit board.

Abstract translation: 固定辅助装置包括主体，至少延伸臂和粘合元件。 主体具有与电路板的连接部分接触的第一部分和联接到金属组件的延伸板的第二部分。 所述至少一个延伸臂从主体的边缘延伸并朝向主体的一侧弯曲，以夹紧金属组件的延伸板。 粘合元件用于将主体的第一部分接合到电路板的连接部分上。

公开(公告)号：US07066244B2

公开(公告)日：2006-06-27

申请号：US10756064

申请日：2004-01-13

Applicant: Yin-Yuan Chen ,  Wen-Ching Wu ,  Jui-Yuan Hsu

Inventor： Yin-Yuan Chen ,  Wen-Ching Wu ,  Jui-Yuan Hsu

IPC: F28F7/00

CPC classification number: H05K7/20436 ,  H01L23/36 ,  H01L23/433 ,  H01L2924/0002 ,  H05K7/20481 ,  H01L2924/00

Abstract: A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.

Abstract translation: 用于将电子设备中的电子部件产生的热量均匀地散发到电子设备的壳体的温度均化装置包括第一和第二较高导热层和第一下部导热层。 第一下部导热层设置在第一和第二较高导热层之间，并且由具有比每个第一和第二较高导热层的导热性低的材料或介质制成。 通过该温度均化装置，热量以更高的热传导速率均匀地分布在第一和第二较高的导热层中，并以较低的热传导速率转移通过第一较低导热层，以保持均匀 温度分布在房屋上。

公开(公告)号：US20060064618A1

公开(公告)日：2006-03-23

申请号：US11001345

申请日：2004-11-30

Applicant: Cheng-Wen Wu ,  Rei-Fu Huang ,  Chin-Lung Su ,  Wen-Ching Wu ,  Yeong-Jar Chang ,  Kun-Lun Luo ,  Shen-Tien Lin

Inventor： Cheng-Wen Wu ,  Rei-Fu Huang ,  Chin-Lung Su ,  Wen-Ching Wu ,  Yeong-Jar Chang ,  Kun-Lun Luo ,  Shen-Tien Lin

IPC: G01R31/28

CPC classification number: G11C29/4401 ,  G11C29/16 ,  G11C29/44 ,  G11C29/72 ,  G11C2029/0405 ,  G11C2029/3602

Abstract: The present invention provides a method and apparatus for a memory build-in self-diagnosis and repair with syndrome identification. It uses a fail-pattern identification and a syndrome-format structure to identify faulty rows, faulty columns and single faulty word in the memory during the testing process, then exports the syndrome information. Based on the syndrome information, a redundancy analysis algorithm is applied to allocate the spare memory elements repairing the faulty memory cells. It has a sequencer with enhanced fault syndrome identification, a build-in redundancy-analysis circuit with improved redundancy utilization, and an address reconfigurable circuit with reduced timing penalty during normal access. The invention reduces the occupation time and the required capture memory space in the automatic test equipment. It also increases the repair rate and reduces the required area overhead.

Abstract translation: 本发明提供一种存储器建立自诊断和修复的方法和装置，其具有综合征识别。 它在测试过程中使用故障模式识别和故障排序格式结构来识别存储器中的故障行，故障列和单个故障字，然后输出故障信息。 基于综合信息，应用冗余分析算法来分配修复故障存储单元的备用存储单元。 它具有具有增强的故障综合征识别的定序器，具有改进的冗余利用率的内置冗余分析电路，以及在正常访问期间减少定时损失的地址可重构电路。 本发明减少了自动测试设备中的占用时间和所需的捕获存储空间。 它还增加了修复率，并减少了所需的面积开销。

公开(公告)号：US08858193B2

公开(公告)日：2014-10-14

申请号：US13586843

申请日：2012-08-15

Applicant: Wen-Ching Wu

Inventor： Wen-Ching Wu

IPC: F04B17/06 ,  F04B49/00 ,  B60C23/12 ,  F04B43/00 ,  H01F27/06 ,  B60C23/10

CPC classification number: B60C23/12 ,  B60C23/10 ,  F04B33/005 ,  F04B33/02 ,  F04B35/01 ,  F04B43/009 ,  H01F27/06

Abstract: The air pump is installed on the frame of a bicycle which utilizes the sprocket of the bicycle as the power source. The air pump contains a cylinder member, a transmission member, and a positioning member. The positioning and transmission members are connected to the cylinder member. The positioning member allows the adjustment and positioning of the cylinder member along the bicycle frame so that the cylinder member can be engaged by a front sprocket of the bicycle. The transmission member contains a shaft and a gear. The shaft has one end connected to the cylinder member and another end connected to the gear. When a rider rotates the front sprocket, the rotational power is delivered to the gear and then to the shaft of the transmission member, which in turn drives the cylinder member to pump air for inflation.

Abstract translation: 空气泵安装在利用自行车的链轮作为动力源的自行车的框架上。 气泵包括气缸构件，传动构件和定位构件。 定位和传动构件连接到气缸构件。 定位构件允许气缸构件沿着自行车框架的调节和定位，使得气缸构件可以由自行车的前链轮接合。 传动构件包括轴和齿轮。 轴的一端连接到气缸构件，另一端连接到齿轮。 当骑车人旋转前链轮时，旋转动力被传递到齿轮，然后传递到传动构件的轴，其又驱动气缸构件以泵送用于充气的空气。

公开(公告)号：US20090140093A1

公开(公告)日：2009-06-04

申请号：US12135112

申请日：2008-06-06

Applicant: Wen-Ching Wu

Inventor： Wen-Ching Wu

IPC: B65H75/48

CPC classification number: B65H75/4434 ,  B65H75/4449 ,  B65H2701/34

Abstract: A cable winding mechanism with reduced friction includes a cable, a case, a reel disc, a spring device, a roller and a friction-reducing member. The case includes a first case element and a second case element, wherein a cable locking structure is formed in an inner surface of the second case element. The reel disc has a confining groove. The roller is movable along the confining groove of the reel disc. When a pulling operation of the cable causes the roller to move in the cable locking structure of the second case element, a desired length of the cable is pulled out and locked. When the roller is detached from the cable locking structure, the cable pulled outside the case is rewound on the reel disc. The friction-reducing member is disposed on the reel disc for reducing friction during the process of pulling out or rewinding the cable.

Abstract translation: 具有减小的摩擦力的电缆缠绕机构包括电缆，壳体，卷盘，弹簧装置，辊和减摩构件。 壳体包括第一壳体元件和第二壳体元件，其中电缆锁定结构形成在第二壳体元件的内表面中。 卷盘具有限制槽。 滚轮可以沿着卷轴盘的限制槽移动。 当电缆的拉动操作导致辊在第二壳体元件的电缆锁定结构中移动时，电缆的期望长度被拉出并锁定。 当辊子从电缆锁定结构拆下时，拉出壳体外部的电缆在卷轴盘上重绕。 摩擦减小构件设置在卷盘上，用于在拉出或重绕电缆的过程中减少摩擦。

公开(公告)号：US07506231B2

公开(公告)日：2009-03-17

申请号：US11819464

申请日：2007-06-27

Applicant: Yeong-Jar Chang ,  Wen-Ching Wu ,  Kun-Lun Luo ,  Chia-Jen Lee

Inventor： Yeong-Jar Chang ,  Wen-Ching Wu ,  Kun-Lun Luo ,  Chia-Jen Lee

IPC: G01R31/28 ,  G11C29/00

CPC classification number: G01R31/318555

Abstract: A wrapper testing circuit of system-on-a-chip for electrical tests of at least a core circuit of an integrated circuit and a wrapper testing method thereof are provided. A controller outputs control signals and test signals and receives result signals executed by the core circuit. The wrapper testing circuit comprises a decoding logic and a plurality of wrapper boundary registers. The decoding logic has a signal decoding table which receives and decodes the control signals and then issues decoded signals according to the signal decoding table. The WBR shifts, updates and captures the test signals for the core circuit to execute and output the result signals according to the decoded signals. In comparison with prior art, the testing time is reduced.

Abstract translation: 提供了一种用于至少集成电路的核心电路的电测试的片上系统的封装测试电路及其包装测试方法。 控制器输出控制信号和测试信号并接收由核心电路执行的结果信号。 包装测试电路包括解码逻辑和多个封装边界寄存器。 解码逻辑具有信号解码表，其接收并解码控制信号，然后根据信号解码表发出解码信号。 WBR移位，更新和捕获核心电路的测试信号，以根据解码的信号执行和输出结果信号。 与现有技术相比，测试时间缩短。

公开(公告)号：US20080133990A1

公开(公告)日：2008-06-05

申请号：US11672044

申请日：2007-02-07

Applicant: Shih-Ping Lin ,  Chung-Len Lee ,  Jwu E. Chen ,  Ji-Jan Chen ,  Kun-Lun Luo ,  Wen-Ching Wu

Inventor： Shih-Ping Lin ,  Chung-Len Lee ,  Jwu E. Chen ,  Ji-Jan Chen ,  Kun-Lun Luo ,  Wen-Ching Wu

IPC: G01R31/28

CPC classification number: G01R31/31725 ,  G01R31/3016 ,  G01R31/31727

Abstract: Disclosed is a scan test data compression method and decoding apparatus for multiple-scan-chain designs. The apparatus comprises a on-chip decoder connected to a tester. The decoder includes a decoding buffer configured as a multilayer architecture, a controller, and a switching box for receiving a shift signal or a copy signal. The decoding buffer is used to store decoded test data. While the decoder decodes the encoded data, it transmits control signals to both the decoding buffer and the switching box from the controller, and sends the decoded data to scan chains of a CUT for testing through the decoding buffer. This invention has the advantages of simple encoding method, high compression rate, low power consumption in testing, and without the fault coverage loss.

Abstract translation: 公开了一种用于多扫描链设计的扫描测试数据压缩方法和解码装置。 该装置包括连接到测试器的片上解码器。 解码器包括被配置为多层架构的解码缓冲器，控制器和用于接收移位信号或复制信号的开关盒。 解码缓冲器用于存储解码的测试数据。 当解码器解码编码数据时，它将控制信号从控制器发送到解码缓冲器和切换盒，并将解码的数据发送到CUT的扫描链，以通过解码缓冲器进行测试。 本发明具有编码方式简单，压缩率高，测试功耗低，无故障覆盖损失的优点。

公开(公告)号：US07228468B2

公开(公告)日：2007-06-05

申请号：US11001345

申请日：2004-11-30

Applicant: Cheng-Wen Wu ,  Rei-Fu Huang ,  Chin-Lung Su ,  Wen-Ching Wu ,  Yeong-Jar Chang ,  Kun-Lun Luo ,  Shen-Tien Lin

Inventor： Cheng-Wen Wu ,  Rei-Fu Huang ,  Chin-Lung Su ,  Wen-Ching Wu ,  Yeong-Jar Chang ,  Kun-Lun Luo ,  Shen-Tien Lin

IPC: G11C29/00

CPC classification number: G11C29/4401 ,  G11C29/16 ,  G11C29/44 ,  G11C29/72 ,  G11C2029/0405 ,  G11C2029/3602

Abstract: The present invention provides a method and apparatus for a memory build-in self-diagnosis and repair with syndrome identification. It uses a fail-pattern identification and a syndrome-format structure to identify faulty rows, faulty columns and single faulty word in the memory during the testing process, then exports the syndrome information. Based on the syndrome information, a redundancy analysis algorithm is applied to allocate the spare memory elements repairing the faulty memory cells. It has a sequencer with enhanced fault syndrome identification, a build-in redundancy-analysis circuit with improved redundancy utilization, and an address reconfigurable circuit with reduced timing penalty during normal access. The invention reduces the occupation time and the required capture memory space in the automatic test equipment. It also increases the repair rate and reduces the required area overhead.

Abstract translation: 本发明提供一种存储器建立自诊断和修复的方法和装置，其具有综合征识别。 它在测试过程中使用故障模式识别和故障排序格式结构来识别存储器中的故障行，故障列和单个故障字，然后输出故障信息。 基于综合信息，应用冗余分析算法来分配修复故障存储单元的备用存储单元。 它具有具有增强的故障综合征识别的定序器，具有改进的冗余利用率的内置冗余分析电路，以及在正常访问期间减少定时损失的地址可重新配置电路。 本发明减少了自动测试设备中的占用时间和所需的捕获存储空间。 它还增加了修复率，并减少了所需的面积开销。

公开(公告)号：US20060109634A1

公开(公告)日：2006-05-25

申请号：US11287023

申请日：2005-11-23

Applicant: Kuo-Liang Lee ,  Wen-Ching Wu ,  Jui-Yuan Hsu

Inventor： Kuo-Liang Lee ,  Wen-Ching Wu ,  Jui-Yuan Hsu

IPC: H05K7/20

CPC classification number: H05K7/20518

Abstract: An electronic device with a heat-dissipation structure is disclosed. The electronic device comprises a housing, a printed circuit board assembly, and a heat sink. The printed circuit board assembly is disposed in an interior of the housing, and the printed circuit board assembly forms a high-temperatured heat flow area and a low-temperatured heat flow area in the electronic device. The heat sink is disposed between the printed circuit board assembly and the housing and in the low-temperatured heat flow area for balancing heat flow and homogenizing temperature of the electronic device to enhance heat-dissipation efficiency.

Abstract translation: 公开了一种具有散热结构的电子设备。 电子设备包括壳体，印刷电路板组件和散热器。 印刷电路板组件设置在壳体的内部，并且印刷电路板组件在电子设备中形成高温热流区域和低温热流区域。 散热器布置在印刷电路板组件和壳体之间以及在低温热流区域中，用于平衡电子设备的热流和均匀化温度，以增强散热效率。

公开(公告)号：US06989504B1

公开(公告)日：2006-01-24

申请号：US10991391

申请日：2004-11-19

Applicant: Wen-Ching Wu

Inventor： Wen-Ching Wu

IPC: H01H15/02

CPC classification number: H01H15/005

Abstract: The present invention is to provide a case comprising a structure for fastening a sliding button having a fixing member and a manipulating member together forming an L-shaped member, two spaced ribs provided on an inner surface of the manipulating member above the fixing member, and a projection provided on an outer surface of the manipulating member and adapted to insert through an opening of the case and project therefrom to outside of the case while placing the sliding button in the case; and a circuit board threadedly secured to a bottom of the case for clamping the fixing member and thus fastening the sliding button.

Abstract translation: 本发明提供一种壳体，包括用于将具有固定构件和操纵构件的滑动按钮紧固在一起形成L形构件的结构，设置在操作构件的位于固定构件上方的内表面上的两个隔开的肋，以及 设置在所述操作构件的外表面上并且适于插入通过所述壳体的开口并从其突出到所述壳体外部的突起，同时将所述滑动按钮放置在所述壳体中; 以及电路板，其螺纹地固定到壳体的底部，用于夹紧固定构件，从而紧固滑动按钮。