Abstract:
A yield evaluating apparatus and a method thereof are provided. The yield evaluating apparatus includes a spatial correlation module. The spatial correlation module receives at least one process-related data and a plurality of circuit layouts and obtains a correlation coefficient between unit elements in the circuit layouts according to the process-related data. The spatial correlation module calculates a spatial correlation between elements in each of the circuit layouts according to the correlation coefficient and selects one of the circuit layouts according to the spatial correlations.
Abstract:
A power supply apparatus includes a main body, a first power connecting part and a foldable electrical connector. The main body includes a power converting circuit therein and has a first socket at a first side thereof. The first power connecting part has an end connected to the main body. The foldable electrical connector includes a housing and at least a conductive pin. The housing includes a connecting member and a receiving portion. The connecting member is electrically connected to the first socket of the main body. The conductive pin is disposed in the receiving portion and multi-angularly rotatable with respect to the housing so as to be selectively stored in the receiving portion or protruded from the housing.
Abstract:
A built-in jitter measurement circuit for a VCO (voltage-controlled oscillator) and a PLL (phase-locked loop) is disclosed. The circuit includes a divider for dividing frequency of a signal, a time to digital converter (TDC) for converting the period of the divided signal into digital values, a variance calculator for calculating variance of the period of the divided signal, a mean calculator for calculating mean value of the period of the divided signal, a encoder and counter for encoding and calculating the period of the divided signal, and a state controller as a controller for all other components. The circuit disclosed utilizes output clock of an opened-loop circuit to be measured and a divider for increasing jitter of the original signal. By measuring the bandwidth of a closed-loop circuit, accordingly, jitter of output clock of an opened-loop or an closed-loop circuit is measured by correlating the measured bandwidth and the jitter values from extrapolation.
Abstract:
The present invention discloses an antenna with a fixed base rotary positioning structure, which can be placed on a table or hung on a wall, comprising: a fixed base; a protrusion disposed on the fixed base and having an open end on one side; a chamber enclosed by the rest of three sides; a pivotal axial hole and an arc groove being correspondingly disposed on both sides of the inner wall of the protrusion, such that the pivotal axial hole and the arc groove precisely and pivotally coupling the pivotal axis and the protruded fixing point to the two corresponding sides at one end of the antenna, and the antenna using such pivotal axis as the rotary axis to adjust the antenna to any angle by the open end of the protrusion.
Abstract:
A charger capable of providing illumination light is disclosed. The charger comprises a main body to be coupled with a power source for charging an electronic apparatus, an illumination device disposed on the main body for providing illumination light, and a control switch disposed on the main body and electrically coupled with the illumination device for controlling the illumination device to illuminate light.
Abstract:
A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.
Abstract:
The invention is a can-filter structure of an oxygen concentrator, which includes: a first can-filter having filter material; a second can-filter having filter material; and an outlet cover. The first can-filter includes an air inlet provided at the entrance side of the first can-filter and a first conical joint formed at the exit side of the first can-filter, wherein the first conical joint is hollow and at least one recess is provided on the outer surface thereof. The second can-filter includes a second conical joint formed at the entrance side of the second can-filter, wherein the second conical joint is hollow, and at least one engaging hook corresponding to the recess is provided on the inner surface thereof for coupling to the first conical joint. The outlet cover is provided at the exit side of the second can-filter and is coupled thereto by ultrasonic fusion.
Abstract:
The present invention relates to a power supply apparatus having a passive heat-dissipating mechanism. The power supply apparatus includes an insulating housing, a printed circuit board and at least an electronic component. The insulating housing has a closed receptacle therein and includes a first edge, a second edge and a third edge. The first edge is greater than the second edge and the second edge is greater than or equal to the third edge. An aspect ratio of the first edge to the second edge is greater than 2.5. The electronic component is mounted on the printed circuit board.
Abstract:
A fixing auxiliary device includes a main body, at least an extension arm and an adhesive element. The main body has a first portion in contact with a connecting portion of a circuit board and a second portion coupled to an extension plate of a metallic assembly. The at least an extension arm extends from an edge of the main body and is bent toward one side of the main body so as to clamp the extension plate of the metallic assembly. The adhesive element is used for bonding the first portion of the main body onto the connecting portion of the circuit board.
Abstract:
A wrapper testing circuit and method thereof for System-On-a-Chip is provided for electrical tests of core circuits of an integrated circuit. The testing circuit includes a decoding logic with an encoding table for receiving test signals and delivering control signals in response to the test signals according to the table; a plurality of registers for saving the control signals temporarily and delivering the control signals to the core circuits; a bypass circuit for delivering the test signals; and an instruction register for saving the test signals temporarily and refreshing the data in the registers and the bypass circuits after the decoding logic issues the control signals. The encoding of the control signals is completed in one period. Compared with the serial encoding in the prior art, test time is reduced.