摘要:
A method capable of easily and simply manufacturing a conductive member pattern such as a nano-size fine wiring or electrode is disclosed. Specifically, the disclosed method for manufacturing a conductive member pattern includes the steps of: forming an ion-exchangeable resin pattern on a substrate by using a photosensitive resin; making the resin pattern absorb a metal component-containing solution; and baking the resin pattern having absorbed the metal component-containing solution, wherein the width and the ratio “width/height” of the resin pattern before baking are 1 μm or less and 5 or less, respectively.
摘要:
A boride film is deposited on a substrate through an opening portion a shield member located between the substrate and a target by means of a sputtering method. The shield member is arranged so as to shield between an erosion region of the target and the substrate. A distribution of plasma density in a space between the substrate and the target is set in such a manner that a plasma density in a region in which the opening portion is located becomes higher than a plasma density in a region shielded by the shield member.
摘要:
A method capable of easily and simply manufacturing a conductive member pattern such as a nano-size fine wiring or electrode is disclosed. Specifically, the disclosed method for manufacturing a conductive member pattern includes the steps of: forming an ion-exchangeable resin pattern on a substrate by using a photosensitive resin; making the resin pattern absorb a metal component-containing solution; and baking the resin pattern having absorbed the metal component-containing solution, wherein the width and the ratio “width/height” of the resin pattern before baking are 1 μm or less and 5 or less, respectively.
摘要:
There is disclosed a semiconductor laser diode assembly. A semiconductor laser diode emits a beam of light. A ring member has a heat sink formed integral therewith. The semiconductor laser diode is mounted on the heat sink through a sub-mount. A common electrode is formed integral with the ring member. The common electrode extends opposite to the heat sink. Lead electrodes are held by the ring member through an insulating material filled therebetween in an airtight manner. A stem unit formed by the ring member, the lead electrodes, and the insulating material to provide electrical connection to the semiconductor laser diode. A cap unit fixed on the stem unit for hermetically sealing the semiconductor laser diode. The cap unit has a window through which a beam of light emitted by the semiconductor laser diode is radiated. The semiconductor laser diode assembly is made compact in size and easy to manufacture, providing a source of laser beam adapted for CD players, CD-ROM players and so on.
摘要:
An optical fiber receptacle has a glass rod lens in its one end side and a front end of an optical fiber to be connected to the opposite end side of the receptcle is brought into physical contact with a spherical surface of the glass rod lens to thereby make the optical fiber optically couple with an optical element to be provided on the glass rod lens side, wherein a housing including a sleeve for insertion of the front end of the optical fiber therein is fixed to a lens holder for fixedly holding the glass rod lens by fusion so that the center of the sleeve and the center of the spherical surface of the glass rod lens are aligned.
摘要:
A mold-type semiconductor laser device comprises a metallic support plate, a semiconductor laser chip carried by the support plate, a resinous molded body for sealing the laser chip; and a transparent plate attached to the molded body in opposed relation to a front cleavage face of the laser chip. The support plate has a positioning face which is substantially parallel to the front cleavage face of the laser chip and comes into direct contact with the transparent plate.
摘要:
A laser diode which includes a substrate, a laser diode chip bonded on the substrate through a sub-mount, and a monitor element formed on the substrate or the sub-mount so as to monitor laser light emitted from a rear cleavage face of the laser diode chip. The rear cleavage face and the surface of the monitor element are connected, through a space between them, by a solid state waveguide device of a light-transmitting or semi-light transmitting nature.
摘要:
A motor-driven film winder for a camera has an internal gear portion (5a) fixed to a motor (1), one or two step-shaped planet gears (7), (8) having first gears (7a), (8a) to mesh with a pinion gear (4) driven by the motor and the internal gear portion (5a) and second gears (7b), (8b) having a larger diameter than first gears (7a), (8b), and engaging with an internal gear (11a) provided on inside wall of the take-up spool (11), whereby rotation of the motor is transmitted to the take-up spool (11) with largely reduced speed of rotation and largely multiplied torque.