Method of and apparatus for forming food
    21.
    发明授权
    Method of and apparatus for forming food 有权
    食品成型方法及装置

    公开(公告)号:US06817850B2

    公开(公告)日:2004-11-16

    申请号:US10203955

    申请日:2002-08-14

    IPC分类号: A21C900

    CPC分类号: A21C9/063 A23P20/20 A23P30/25

    摘要: There is provided a method of and apparatus for forming a food by wrapping an inner material with an outer skin material, and the method of and apparatus for sealing the outer skin material more surely in a state where the inner material is disposed on the outer skin material. The food forming apparatus comprises a first shutter (1), a second shutter (2) disposed under the first shutter (1), and support means (6) disposed under the second shutter (2) wherein an operation start timing of the second shutter (2) subsequent to starting of the operation of the first shutter (1) is adjusted appropriately, and a position of the support member (60) is adjusted appropriately, thereby adjusting the amount of collection of the peripheral portion of the curst material (F), thereby wrapping an inner material (G) with the outer skin material (F) in response to the different sizes of the curst material (F) and the inner material (G), thereby surely forming the food.

    摘要翻译: 提供了通过用外部皮肤材料包裹内部材料来形成食物的方法和装置,以及在内部材料设置在外皮上的状态下更可靠地密封外表皮材料的方法和装置 材料。 食品成型设备包括第一快门(1),设置在第一快门(1)下方的第二快门(2)和设置在第二快门(2)下方的支撑装置,其中第二快门 (2)在适当地调节第一挡板(1)的操作开始之后,适当地调整支撑构件(60)的位置,由此调节卷曲材料的周边部分(F ),从而根据不同的卷曲材料(F)和内部材料(G)的尺寸,与外皮材料(F)包裹内部材料(G),从而可靠地形成食品。

    Molded colored articles
    23.
    发明授权
    Molded colored articles 失效
    模制彩色文章

    公开(公告)号:US6068896A

    公开(公告)日:2000-05-30

    申请号:US808839

    申请日:1997-02-28

    IPC分类号: B29C45/00 B29C45/16 B60R13/04

    摘要: An injection molded colored article produced from colored material prepared by blending a coloring pigment with a synthetic resin. The article has the shape of a long main body section and a thin plate section integrally molded along a side edge of the main body section. A back surface of the main body has a curve formed from an inner end thereof. The thin plate section is formed into a tapered shape, having its thickness decreased toward its outer edge. An inclined angle .theta. defined between a upper surface and a back surface of said thin plate section, a ratio of distance A between an inner edge of said upper surface and an outer edge of said thin plate section to a distance B between said inner end of said back surface of said thin plate section and said outer edge, A/B, and a thickness C of said main body section are selected to fall within the following ranges;5.ltoreq..theta..ltoreq.45.degree.;0.3.ltoreq.A/B.ltoreq.1; and1.5.ltoreq.C.ltoreq.10 mm.

    摘要翻译: 由着色颜料与合成树脂混合制备的由有色材料制成的注射成型的有色制品。 该制品具有沿着主体部分的侧边缘整体模制的长主体部分和薄板部分的形状。 主体的后表面具有从其内端形成的曲线。 薄板部分形成为其厚度朝向其外边缘减小的锥形形状。 限定在所述薄板部分的上表面和后表面之间的倾斜角θ,所述上表面的内边缘和所述薄板部分的外边缘之间的距离A与所述薄板部分的所述内端之间的距离B的比率 所述薄板部分的所述后表面和所述外边缘A / B,并且所述主体部分的厚度C被选择为落在以下范围内; 5

    Method of producing transparent zinc oxide films
    24.
    发明授权
    Method of producing transparent zinc oxide films 失效
    透明氧化锌薄膜的制造方法

    公开(公告)号:US5252356A

    公开(公告)日:1993-10-12

    申请号:US840754

    申请日:1992-02-24

    摘要: There is disclosed a method of producing a transparent zinc oxide film having an even thickness especially useful as a ultraviolet rays cut off. The method comprises applying a solution of an organic zinc compound selected from the group consisting of a zinc salt of a fatty acid of 3-7 carbons and a chelate compound of a diketone of 5-8 carbons in an organic solution on a substrate, and then baking the resultant coating at temperatures of 300.degree.-600.degree. C. It is preferred that the solution of an organic zinc compound further contains at least one organometallic compound of a metal selected from the group consisting of aluminum, indium, tin and titanium.

    Light-emitting diode
    26.
    发明授权
    Light-emitting diode 失效
    发光二极管

    公开(公告)号:US4975752A

    公开(公告)日:1990-12-04

    申请号:US250849

    申请日:1988-09-28

    CPC分类号: H01L33/24 H01L33/0062

    摘要: An LED includes a semiconductor substrate, a first blocking layer formed on this semiconductor substrate, a second blocking layer formed on this first blocking layer, a first V-channel extending from the second blocking layer to the semiconductor substrate, and a stripe-geometry light-emitting region formed in the first V-channel. Light is emitted from the LED from one edge of the light-emitting region due to a flow of current in the light-emitting region, to which the current is confined by the blocking layers. The LED also comprises a second V-channel disposed at a certain distance from the other edge of the light-emitting region, on the optical path of the light emitted from this other edge, and an absorbing region is formed in the second V-channel. This absorbing region absorbs the light emitted from the other edge of the light-emitting region. The LED has excellent characteristics in which a stable output of spontaneously-emitted light can be obtained under a wide variety of operating conditions.

    Mold member and rapidly solidifying water cooled rotary roll member
    27.
    发明授权
    Mold member and rapidly solidifying water cooled rotary roll member 失效
    模具构件和快速凝固水冷旋转辊构件

    公开(公告)号:US4830086A

    公开(公告)日:1989-05-16

    申请号:US238081

    申请日:1988-08-30

    IPC分类号: B22D11/059 B22D11/06

    CPC分类号: B22D11/0651 B22D11/059

    摘要: A mold member and a rapidly solidifying water cooled rotary roll member contain 1.3 to 5% of Ni, 0.2 to 2% of Ti, 0.1 to 1.5% of Cr, 0 to 0.5% of Zr, 0 to 1% of Al, 0 to 0.5% of at least one of Fe and Co, 0 to 1.2% of Sn, 0 to 1.2% of Mn, 0 to 1.2% of Zn, 0 to 0.2% of Mg, 0 to 0.2% of P, and 0 to 0.2% of a rare earth element, wherein the remainder of the material has a composition consisting of Cu and unavoidable impurities. Each of the members has superior thermal fatigue resistance and erosion resistance against molten metal, high-temperature strength, high-temperature hardness, high-temperature ductility and heat resistance.

    Process for the production of methacrylic acid
    28.
    发明授权
    Process for the production of methacrylic acid 失效
    生产甲基丙烯酸的方法

    公开(公告)号:US4803302A

    公开(公告)日:1989-02-07

    申请号:US103580

    申请日:1987-08-21

    摘要: A catalyst represented by the general formulaP.sub.a Mo.sub.b V.sub.c Fe.sub.d Cu.sub.e Z.sub.f X.sub.g Y.sub.h O.sub.iwherein X represents at least one or more of the elements selected form the group consisting of potassium, rubidium, cesium and thallium, Y represents at least one or more of the elements selected from the group consisting of tellurium, lanthanum, boron, silver, chromium, magnesium and barium, Z represents any one of the elements of zirconium or antimony, a to i denote atomic ratios of respective elements, and when b=12, a=0.3-4, c=0.01-3, d=0.01-4, e=0.01-3, f=0.01-3, g=0.01-3, h=0.001-5 and i denotes the number of oxygen atoms required for satisfying the valence number of the said ingredients, and a process for the production of methacrylic acid comprising contacting methacrolein in vapor phase in the presence of said catalyst.

    Copper alloy lead material for use in semiconductor device
    29.
    发明授权
    Copper alloy lead material for use in semiconductor device 失效
    铜合金铅材料用于半导体器件

    公开(公告)号:US4749548A

    公开(公告)日:1988-06-07

    申请号:US903514

    申请日:1986-09-03

    IPC分类号: C22C9/00 H01L23/495 C07C9/00

    摘要: Copper alloy lead materials used in the fabrication of semiconductor devices such as ICs and LSIs are required to have a tensile strength of 40 kgf/mm.sup.2 or more, an elongation of 4% or more, an electrical conductivity of 50% IACS or more, and a softening point of 400.degree. C. or higher.The copper alloy lead material of the present invention exhibits even higher degrees of tensile strength and elongation and yet satisfy the values of electrical conductivity and softening point that are required for Cu alloy lead materials to be used with ordinary semiconductor devices. Therefore, the Cu alloy lead material of the present invention is applicable not only to ordinary semiconductor devices but also to those with higher packing densities while displaying equally superior performance.

    摘要翻译: 用于制造半导体器件如IC和LSI的铜合金铅材料需要具有40kgf / mm 2以上的拉伸强度,4%以上的伸长率,IACS以上的导电率为50%以上,以及 软化点在400℃以上。 本发明的铜合金铅材料具有更高的拉伸强度和伸长率,并且还满足与普通半导体器件一起使用的Cu合金铅材料所需的导电性和软化点的值。 因此,本发明的Cu合金铅材料不仅适用于普通的半导体器件,而且也适用于具有较高包装密度的那些,同时具有优异的性能。