摘要:
A mask or reticle is optimized for use in a lithographic system. The mask or reticle includes a substrate and a pupil filter pattern. The substrate includes an IC pattern representing at least one integrated circuit feature. The pupil filter pattern can enhance the resolution associated with the lithographic system.
摘要:
An optical monitor includes a body having a first plurality of parallel, substantially opaque, spaced apart lines thereon, and the second plurality of parallel, substantially opaque, spaced apart lines thereon, with a relatively small angle between the first and second pluralities of lines. A an image of the lines of the first plurality thereof is provided on the semiconductor body, upon relative movement of the monitor toward and away from the semiconductor body, the line images move relative to the semiconductor body. The images of the lines of the second plurality thereof provided on the semiconductor body move in a different manner upon relative movement if the monitor toward and away from the semiconductor body: The moiré fringe formed on the semiconductor body from images of the first and second plurality of lines during such movement is analyzed in order to achieve proper focus of the image on the semiconductor body.
摘要:
One illustrative method disclosed herein involves creating an overall target pattern that includes an odd-jogged feature with a crossover region that connects first and second line portions, wherein the crossover region has a first dimension in a first direction that is greater than a second dimension that is transverse to the first direction, decomposing the overall target pattern into a first sub-target pattern and a second sub-target pattern, wherein each of the sub-target patterns comprise a line portion and a first portion of the crossover region, and generating first and second sets of mask data corresponding to the first and second sub-target patterns, respectively.
摘要:
Methods are provided for fabricating a semiconductor device. One method comprises providing a first pattern having a first polygon, the first polygon having a first tonality and having a first side and a second side, the first side adjacent to a second polygon having a second tonality, and the second side adjacent to a third polygon having the second tonality, and forming a second pattern by reversing the tonality of the first pattern. The method further comprises forming a third pattern from the second pattern by converting the second polygon from the first tonality to the second tonality forming a fourth pattern from the second pattern by converting the third polygon from the first tonality to the second tonality forming a fifth pattern by reversing the tonality of the third pattern, and forming a sixth pattern by reversing the tonality of the fourth pattern.
摘要:
Photolithography methods using BARCs having graded optical properties are provided. In an exemplary embodiment, a photolithography method comprises the steps of depositing a BARC overlying a material to be patterned, the BARC having a refractive index and an absorbance. The BARC is modified such that, after the step of modifying, values of the refractive index and the absorbance are graded from first values at a first surface of the BARC to second values at a second surface of the BARC. The step of modifying is performed after the step of depositing.
摘要:
Accurate ultrafine patterns are formed using a multiple exposure technique comprising implementing an OPC procedure to form an exposure reticle to compensate for distortion of an overlying resist pattern caused by an underlying resist pattern. Embodiments include forming a first resist pattern in a first resist layer over a target layer using a first exposure reticle, forming a second exposure reticle by an OPC technique to compensate for distortion of a second resist pattern caused by the underlying first resist pattern, depositing a second resist layer on the first resist pattern, forming the second resist pattern in the second resist layer using the second exposure reticle, the first and second resist patterns constituting a final resist mask, and forming a pattern in the target layer using the final resist mask.
摘要:
A method for forming a semiconductor device is provided including processing a wafer having a target material; forming a first pattern over the target material; forming a protection layer over the first pattern; and forming a second pattern, over the target material and not over the protection layer, without an etching step between the forming the first pattern and the forming the second pattern.
摘要:
A method and apparatus for preventing contamination in a lithographic apparatus including a projection system, including providing the lithographic apparatus including the projection system for imaging an irradiated portion of a mask onto a target portion of a substrate and placing a pellicle over a surface of the projection system to inhibit contamination of the surface.
摘要:
A method of making a device using a lithographic system having a lens from which an exposure pattern is emitted. A conforming immersion medium can be positioned between a photo resist layer and the lens. The photo resist layer, which can be disposed over a wafer, and the lens can be brought into intimate contact with the conforming immersion medium. The photo resist can then be exposed with the exposure pattern so that the exposure pattern traverses the conforming immersion medium.
摘要:
In a method of determining a linewidth of a polysilicon line formed by a lithographic process, a polysilicon layer is formed on a substrate. A line is patterned from said polysilicon layer using said lithographic process and a Van der Pauw structure is patterned from said polysilicon layer. N2 is then implanted into the polysilicon line and the polysilicon Van der Pauw structure to form a depletion barrier. A P-type dopant is the implanted into the polysilicon line and the polysilicon Van der Pauw structure and the dopant is activated. A sheet resistivity of the Van der Pauw structure is determined, and the linewidth of the polysilicon line is then determined by electrical linewidth measurement using the sheet resistivity of the Van der Pauw structure as the sheet resistivity of the polysilicon line. A related test structure is also disclosed.
摘要翻译:在确定通过光刻工艺形成的多晶硅线的线宽的方法中,在衬底上形成多晶硅层。 使用所述光刻工艺从所述多晶硅层图案化线,并且从所述多晶硅层构图范德波瓦结构。 然后将N 2注入到多晶硅线和多晶硅Van der Pauw结构中以形成耗尽势垒。 P型掺杂剂被注入到多晶硅线中,并且多晶硅Van der Pauw结构和掺杂剂被激活。 确定Van der Pauw结构的薄层电阻率,然后通过使用Van der Pauw结构的薄层电阻率作为多晶硅线的薄层电阻率的电线宽测量来确定多晶硅线的线宽。 还公开了相关的测试结构。