公开(公告)号：USD634288S1

公开(公告)日：2011-03-15

申请号：US29360967

申请日：2010-05-04

申请人： Kazuyoshi Sugama

设计人： Kazuyoshi Sugama

公开(公告)号：US20100320877A1

公开(公告)日：2010-12-23

申请号：US12852001

申请日：2010-08-06

申请人： Osamu ONITSUKA ,  Kazuyoshi Sugama

发明人： Osamu ONITSUKA ,  Kazuyoshi Sugama

IPC分类号： H01L41/047 ,  H01L41/22

CPC分类号： H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H3/02 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42 ,  Y10T29/49165 ,  H01L2924/00

摘要： The piezoelectric vibrator manufacturing method of the invention is a method for manufacturing a plurality of piezoelectric vibrators in which a piezo-electric vibration member is sealed up in a cavity formed between a base substrate and a lid substrate bonded to each other, all at once by utilizing a base substrate wafer and a lid substrate wafer, and the method comprises a recess forming step of forming, in the lid substrate wafer, a plurality of cavity recesses for forming cavities when the two wafers are overlaid; a through-electrode forming step of forming a plurality of through-electrodes in and through the base substrate wafer; a routing electrode forming step of forming a plurality of routing electrodes connected electrically with the through-electrodes, on the upper face of the base substrate wafer; a mounting step of bonding the plural piezoelectric vibration members to the upper face of the base substrate wafer via the routing electrodes; an overlaying step of overlaying the base substrate wafer and the lid substrate wafer thereby to house the piezoelectric vibration members in the cavities surrounded by the recesses and the two wafers; a bonding step of bonding the base substrate wafer and the lid substrate wafer thereby to seal up the piezoelectric vibration members in the cavities; an external electrode forming step of forming a plurality of external electrodes connected electrically with the through-electrodes, on the lower face of the base substrate wafer; and a cutting step of cutting the two bonded wafers thereby to shred them into the plural piezoelectric vibrators. The through-electrode forming step includes a through-hole forming step of forming a plurality of through-holes in and through the base substrate wafer; a setting step of disposing electroconductive core members which are formed to have two flat ends and a thickness substantially equal to that of the base substrate wafer, in those plural through-holes, and disposing connection members between the core mem-bers and the through-holes; and a firing step of firing the connection members at a predetermined temperature to thereby integrally fix the through-hole, the connection member and the core member to each other.

公开(公告)号：US20100320872A1

公开(公告)日：2010-12-23

申请号：US12853659

申请日：2010-08-10

申请人： Masashi NUMATA ,  Kiyoshi Aratake ,  Kazuyoshi Sugama ,  Sumihiko Kurita

发明人： Masashi NUMATA ,  Kiyoshi Aratake ,  Kazuyoshi Sugama ,  Sumihiko Kurita

IPC分类号： H01L41/053 ,  H01L41/22

CPC分类号： H01L23/055 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/3011 ,  H03H3/02 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42 ,  H01L2924/00

摘要： The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads.

摘要翻译： 本发明的压电振动器包括：底座基板，形成有凹部的盖基板，并且在与基板相对的凹部的状态下与基板接合;压电振动部件， 基底基板，其被容纳在由基底基板和盖基板之间的凹部形成的空腔中，形成在基底基板的下表面上的外部电极，形成在基底和底部基板的底部的贯通电极 基板，并与外部电极电气连接，同时保持空腔内的气密性;以及布线电极，形成在基底基板的上表面上，以将通孔电连接到接合的压电振动件; 其特征在于，所述贯通电极是通过硬化含有多个金属微粒和多个玻璃珠的糊料形成的。

公开(公告)号：US20100308694A1

公开(公告)日：2010-12-09

申请号：US12857234

申请日：2010-08-16

申请人： Masashi NUMATA ,  Kiyoshi Aratake ,  Osamu Onitsuka ,  Junya Fukuda ,  Kazuyoshi Sugama

发明人： Masashi NUMATA ,  Kiyoshi Aratake ,  Osamu Onitsuka ,  Junya Fukuda ,  Kazuyoshi Sugama

IPC分类号： H01L41/053 ,  H01L41/22 ,  H01L41/047 ,  B23Q3/00

CPC分类号： H03H3/02 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42 ,  Y10T29/49165 ,  H01L2224/0401

摘要： The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through-hole running through the base substrate; and an electroconductive core member which is formed to have two flat ends and a thickness substantially equal to that of the base substrate and is inserted into the center hole of the cylindrical body; and the through-hole, the cylindrical body and the core member are integrally fixed to each other by firing.

摘要翻译： 压电振子包括基底; 盖基板，其中形成有空腔凹部，并且在凹部面向基底基板的状态下结合到基底基板; 压电振动构件，其被接合到基底基板的上表面，其状态是将其容纳在由基底基板和盖基板之间的凹部形成的空腔中; 形成在所述基底基板的下表面上的外部电极; 形成在基底基板内并通过基底基板的贯通电极，与外部电极电连接，同时保持腔内的气密性; 以及布线电极，形成在所述基底基板的上表面上，以将所述通孔电连接到所述接合的压电振动部件; 其特征在于，所述贯通电极由圆筒体形成，所述圆筒体由玻璃材料形成，具有两个平坦的端部，并且基本上等于所述基底基板的厚度，并且被植入穿过所述基底基板的所述通孔中; 以及导电芯体，其形成为具有两个平坦端部，并且具有基本上等于所述基底基板的厚度并且被插入到所述圆筒体的中心孔中的厚度; 并且通孔，筒体和芯部件通过烧结而彼此一体地固定。

公开(公告)号：US08421546B2

公开(公告)日：2013-04-16

申请号：US13035490

申请日：2011-02-25

申请人： Kazuyoshi Sugama ,  Kyoshi Aratake ,  Masashi Numata

发明人： Kazuyoshi Sugama ,  Kyoshi Aratake ,  Masashi Numata

IPC分类号： H03B5/32 ,  H01L41/00 ,  H03H9/24

CPC分类号： H03H9/1021 ,  H03H9/21 ,  Y10T29/42

摘要： A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole.

摘要翻译： 根据本发明的压电振动器包括彼此连接并且在其间形成的空腔的基底基板和盖基板; 安装在空腔中的基底基板上的压电振动片; 外部电极，形成在所述基底基板的下表面上; 以及形成为穿过基底基板的贯通电极，保持空腔中的气密性，并将压电振动片与外部电极电连接。 贯通电极通过具有销的成型模具的压制成形而形成，并且包括锥形截面的通孔，其中锥角在15°以上且20°以下的范围内，以及 在填充在通孔中之后被硬化的导电膏。

公开(公告)号：US08407870B2

公开(公告)日：2013-04-02

申请号：US12978028

申请日：2010-12-23

申请人： Masashi Numata ,  Kazuyoshi Sugama ,  Hiroshi Higuchi

发明人： Masashi Numata ,  Kazuyoshi Sugama ,  Hiroshi Higuchi

IPC分类号： H01L41/04

CPC分类号： H03H9/21 ,  H03H3/02 ,  H03H9/0542 ,  H03H9/1021 ,  Y10T29/42

摘要： Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured. The manufacturing method includes a penetration hole forming step of forming a plurality of penetration holes 30 on a base substrate wafer 40; a core portion insertion step of inserting core portions 7 of a rivet member 9 into the penetration holes from one side of the wafer; a melting step of bringing the rear surface of the base portion 8 of the rivet member into contact with the wafer to close the opening end on the one side of the penetration holes, heating the wafer while pressing the other side of the wafer so as to melt a surface portion on the other side of the wafer to produce a liquid base substrate material 41, and causing the material to flow into gaps between the inner circumferential walls of the penetration holes and the rivet member from the other side of the penetration holes so as to close the gaps; a curing step of cooling and curing the material poured into the gaps; and a polishing step of removing the base portion and polishing the wafer and the rivet member so that the base substrate wafer and the core portion are planarized.

摘要翻译： 本发明提供一种制造高品质的压电振动器的方法，其中保持了空腔内部的可靠的气密性，并确保了压电振动片和外部电极之间的稳定的传导。 该制造方法包括在基底基板晶片40上形成多个贯通孔30的贯通孔形成工序; 将铆钉构件9的芯部7从晶片的一侧插入贯通孔的芯部插入工序; 熔融步骤，使铆钉部件的​​基部8的后表面与晶片接触，以封闭穿透孔的一侧上的开口端，同时按压晶片的另一侧加热晶片，以便 熔化晶片另一侧的表面部分以产生液体基底材料41，并使材料从穿透孔的另一侧流入穿透孔的内周壁和铆钉构件之间的间隙中 缩小差距; 固化步骤，冷却和固化注入到间隙中的材料; 以及抛光步骤，去除基底部分并抛光晶片和铆钉构件，使得基底基板晶片和芯部分平坦化。

公开(公告)号：US08362846B2

公开(公告)日：2013-01-29

申请号：US13011401

申请日：2011-01-21

申请人： Kazuyoshi Sugama ,  Masashi Numata

发明人： Kazuyoshi Sugama ,  Masashi Numata

IPC分类号： H03B5/32

CPC分类号： H03H9/1021 ,  H01L2224/16225 ,  H03H9/21 ,  Y10T29/42

摘要： A package manufacturing method capable of preventing recess portions from being formed in penetration electrodes. The package manufacturing method includes an electrode member forming step of inserting core portions made of a metallic material into cylindrical members made of a first glass material and heating the cylindrical members so as to weld the cylindrical members to the core portions, thus forming electrode members; a hole forming step of forming holes, in which the electrode members 8 are disposed, on a penetration electrode forming board wafer made of a second glass material; an electrode member disposing step of disposing the electrode members in the holes formed on the wafer; a welding step of heating the wafer and the electrode members so as to be welded to each other; and a cooling step of cooling the wafer and the electrode members. In the welding step, a pressurizing mold is placed on the surface of the wafer, the wafer is pressed by the pressurizing mold, and the wafer and the electrode members are heated to a temperature higher than the softening point of the first glass material and the softening point of the second glass material, whereby the wafer and the electrode members are welded to each other.

摘要翻译： 一种能够防止在穿透电极中形成凹部的封装制造方法。 封装制造方法包括：将由金属材料制成的芯部插入由第一玻璃材料制成的圆柱形构件中并加热圆柱形构件以将圆柱形构件焊接到芯部的电极构件形成步骤，从而形成电极构件; 在由第二玻璃材料制成的穿透电极形成板晶片上形成电极构件8的孔的孔形成步骤; 电极构件设置步骤，其将电极构件设置在形成在晶片上的孔中; 焊接步骤，其将所述晶片和所述电极部件加热以彼此焊接; 以及冷却所述晶片和所述电极部件的冷却工序。 在焊接工序中，将加压模放置在晶片的表面上，通过加压模压制晶片，将晶片和电极部件加热到高于第一玻璃材料的软化点的温度， 第二玻璃材料的软化点，由此使晶片和电极构件彼此焊接。

公开(公告)号：US08104154B2

公开(公告)日：2012-01-31

申请号：US12357148

申请日：2009-01-21

申请人： Mitsuo Tomiyama ,  Takashi Kobayashi ,  Kazuyoshi Sugama

发明人： Mitsuo Tomiyama ,  Takashi Kobayashi ,  Kazuyoshi Sugama

IPC分类号： H04R17/10 ,  B23P19/10

CPC分类号： H03H3/02 ,  H03H3/04 ,  H03H9/17 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42 ,  Y10T29/49155 ,  Y10T29/49798 ,  Y10T29/53265

摘要： To efficiently fabricate a high quality piezoelectric vibrating piece regardless of an accuracy of an outer shape of a wafer, there is provided a method of fabricating a plurality of piezoelectric vibrating pieces at a time utilizing a wafer S, the method including a step of forming two or more of through holes 40 and forming outer shapes of a plurality of piezoelectric plates 10 simultaneously with the through holes by constituting reference points G by centers of the through holes by etching the wafer by a photolithography technology, a step of preparing a jig for a wafer having inserting pins formed to project by a number the same as a number of the through holes from above a flat plate portion, thereafter, mounting the wafer on the flat plate portion in a state of inserting the inserting pin into the through hole, a step of forming an electrode on outer surfaces of the plurality of piezoelectric plates, and a step of cutting to separate the plurality of piezoelectric plates from the wafer to fragment, and in the electrode forming step and the cutting step, positioning to the wafer is carried out by constituting the reference point by the center of the through hole.

摘要翻译： 为了有效地制造高质量的压电振动片而不管晶片的外形精度如何，提供了一种利用晶片S一次制造多个压电振动片的方法，该方法包括形成两个 或多个通孔40，并且通过利用光刻技术蚀刻晶片，通过使通孔的中心构成参考点G，同时形成多个压电板10的外形，制备用于 晶片，其具有插入销，其形成为从平板部分的上方突出与多个通孔相同的数量，然后在将插入插入通孔的状态下将晶片安装在平板部分上， 在所述多个压电板的外表面上形成电极的步骤，以及从所述多个压电板的外表面分离多个压电板的步骤 e晶片碎片，并且在电极形成步骤和切割步骤中，通过通孔的中心构成参考点来执行对晶片的定位。

公开(公告)号：US20110291523A1

公开(公告)日：2011-12-01

申请号：US13204278

申请日：2011-08-05

申请人： Kazuyoshi Sugama

发明人： Kazuyoshi Sugama

IPC分类号： H01L41/053 ,  B65B7/00

CPC分类号： H03H9/215 ,  H03H3/02 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/022 ,  Y10T29/42

摘要： This package manufacturing method is a method for manufacturing a package using a rivet having a flat plate-shaped head portion and a core portion protruding from a rear surface of the head portion. The package includes: a plurality of substrates that are bonded to each other: a cavity that houses an object to be housed in an airtightly sealed state; the core portion which is disposed in a through hole that penetrates a base substrate and which electrically connects the object to be housed with the outside; and a glass frit that is filled between the through hole and the core portion and is fired to form a seal between the through hole and the core portion. The package manufacturing method includes: a rivet disposing step of inserting the core portion into the through hole until the rear surface of the head portion comes into contact with a first surface of the base substrate; a glass frit filling step of filling the glass frit in a paste form between the through hole and the core portion; and a firing step of integrally fixing the through hole, the rivet and the glass frit by firing the filled glass frit, and sealing between the through hole and the core portion. A gas relief passage, which leads from a base end of the core portion to a side surface or a front surface of the head portion, is formed on the rear surface of the head portion of the rivet.

摘要翻译： 该封装制造方法是使用具有平板状头部和从头部的后表面突出的芯部的铆钉制造封装的方法。 该包装包括：彼此粘合的多个基材：容纳要以气密密封状态容纳的物体的空腔; 所述芯部设置在穿过基底基板的贯通孔中，并将被容纳物与外部电连接; 以及填充在通孔和芯部之间的玻璃料，并且被烧制以在通孔和芯部之间形成密封。 封装制造方法包括：铆钉设置步骤，将芯部插入到通孔中，直到头部的后表面与基底基板的第一表面接触; 玻璃料填充步骤，在通孔和芯部之间以糊状填充玻璃料; 以及通过烧制填充的玻璃料一体地固定通孔，铆钉和玻璃料的烧制步骤，以及通孔和芯部之间的密封。 在铆钉的头部的后表面上形成有从芯部的基端引导到头部的侧面或前表面的气体释放通道。

公开(公告)号：US20110249535A1

公开(公告)日：2011-10-13

申请号：US13167283

申请日：2011-06-23

申请人： Yoichi Funabiki ,  Masashi Numata ,  Kazuyoshi Sugama

发明人： Yoichi Funabiki ,  Masashi Numata ,  Kazuyoshi Sugama

IPC分类号： G04F5/06 ,  G04C11/02 ,  H01L41/22 ,  H03B5/36

CPC分类号： H03H9/21 ,  H03H3/04 ,  H03H9/1021 ,  H03H2003/026 ,  H03H2003/0492 ,  H05K1/0306 ,  H05K3/4046 ,  H05K2201/09581 ,  H05K2201/10242 ,  Y10T29/42

摘要： A method of manufacturing a piezoelectric vibrator according to the invention includes the steps of: inserting a core portion of a conductive rivet member, which includes a planar base portion and the core portion extending in a direction vertical to the surface of a base portion, into a penetration hole of the base substrate and bringing the base portion of the rivet member into contact with a first surface of the base substrate; applying a paste-like glass frit on a second surface of the base substrate and moving a first squeegee which comes into contact with the second surface with an attack angle in one direction to thereby fill the glass frit in the penetration hole; and moving a second squeegee which comes into contact with the second surface with an attack angle in a direction opposite to the one direction to thereby fill the glass frit applied redundantly on the second surface in the penetration hole.

摘要翻译： 根据本发明的制造压电振动器的方法包括以下步骤：将导电铆钉构件的芯部插入到包括平面基部和在垂直于基部的表面的方向上延伸的芯部上， 所述基底基板的贯通孔，使所述铆钉部件的​​基部与所述基底基板的第一面接触; 在基底基板的第二表面上施加糊状玻璃料，并使与第二表面接触的第一刮板以一个方向的攻角移动，从而填充穿透孔中的玻璃料; 并且以与所述一个方向相反的方向的攻角来移动与所述第二表面接触的第二刮板，从而将穿透孔中的所述第二表面上冗余地施加的玻璃料填充。