公开(公告)号：US20070190694A1

公开(公告)日：2007-08-16

申请号：US11697779

申请日：2007-04-09

申请人： Jeffrey Punzalan ,  Jae Hun Ku ,  Byung Joon Han

发明人： Jeffrey Punzalan ,  Jae Hun Ku ,  Byung Joon Han

IPC分类号： H01L21/00

CPC分类号： H01L23/49503 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor including a leadframe having a die attach paddle and a number of leads is provided. The die attach paddle has a recess to provide a number of mold dams around the periphery of the die attach paddle. An integrated circuit is positioned in the recess. Electrical connections between the integrated circuit and the number of leads are made, and an encapsulant is formed over the integrated circuit and around the number of mold dams.

摘要翻译： 提供了包括具有管芯附接焊盘和多个引线的引线框的半导体。 管芯附接板具有凹部以在管芯附接板的周边周围提供多个模具坝。 集成电路位于凹槽中。 在集成电路和引线数之间进行电连接，并且在集成电路上形成密封剂并且围绕模具坝的数量。

公开(公告)号：US20050253230A1

公开(公告)日：2005-11-17

申请号：US10837347

申请日：2004-04-30

申请人： Jeffrey Punzalan ,  Jose Caparas ,  Jae Ku

发明人： Jeffrey Punzalan ,  Jose Caparas ,  Jae Ku

IPC分类号： H01L23/02 ,  H01L23/31 ,  H01L23/495 ,  H01L29/06

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.

摘要翻译： 提供一种用于制造大型封装结构的方法，其中引线框架的至少多个引线脚的至少部分引线电绝缘。 模具位于电绝缘引线上。 裸片与至少多个引线笔电连接。

公开(公告)号：US20070108624A1

公开(公告)日：2007-05-17

申请号：US11381734

申请日：2006-05-04

申请人： Jeffrey Punzalan ,  Sheila Alvarez ,  Jose Caparas ,  Robinson Quiazon

发明人： Jeffrey Punzalan ,  Sheila Alvarez ,  Jose Caparas ,  Robinson Quiazon

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： H01L23/49548 ,  H01L23/49503 ,  H01L23/4951 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10175 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/18301 ,  H01L2924/00

摘要： An integrated circuit package system includes an integrated circuit package having a downset terminal lead, a planar recessed lead surface of the downset terminal lead, and an attached integrated circuit over the planar recessed lead surface.

摘要翻译： 集成电路封装系统包括集成电路封装，其具有开路端子引线，开路端子引线的平面凹陷引线表面和平面凹陷引线表面上的附接集成电路。

公开(公告)号：US20070108568A1

公开(公告)日：2007-05-17

申请号：US11382983

申请日：2006-05-12

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Jeffrey Punzalan ,  Byung Joon Han ,  Kambhampati Ramakrishna

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Jeffrey Punzalan ,  Byung Joon Han ,  Kambhampati Ramakrishna

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49555 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package to package stacking system is provided including providing a first integrated circuit package, having a configured leadframe, providing a second integrated circuit package, having the configured leadframe, and forming an integrated circuit package pair by electrically connecting the configured leadframe of the first integrated circuit package to the configured leadframe of the second integrated circuit package.

摘要翻译： 提供集成电路封装到封装堆叠系统，包括提供第一集成电路封装，具有构造的引线框架，提供具有所配置的引线框架的第二集成电路封装，以及通过电连接所配置的引线框，形成集成电路封装对 第一集成电路封装到第二集成电路封装的配置的引线框架。

公开(公告)号：US20070018290A1

公开(公告)日：2007-01-25

申请号：US11536544

申请日：2006-09-28

申请人： Jeffrey Punzalan ,  Jose Caparas ,  Jae Hun Ku

发明人： Jeffrey Punzalan ,  Jose Caparas ,  Jae Hun Ku

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49551 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10155 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.

摘要翻译： 提供一种用于制造大型封装结构的方法，其中引线框架的至少多个引线脚的至少部分引线电绝缘。 模具位于电绝缘引线上。 裸片与至少多个引线笔电连接。

公开(公告)号：US20060249830A1

公开(公告)日：2006-11-09

申请号：US11126052

申请日：2005-05-09

申请人： Il Shim ,  Jeffrey Punzalan ,  Keng Lau

发明人： Il Shim ,  Jeffrey Punzalan ,  Keng Lau

IPC分类号： H01L23/48

CPC分类号： H01L24/83 ,  H01L21/565 ,  H01L23/4951 ,  H01L23/49531 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01031 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for fabricating a large die package with a leadframe having leads and a paddle is provided. An interposer is attached onto the leadframe with the interposer extending over at least a portion of the paddle and at least a portion of the leads of the leadframe. The interposer is insulated from the leads. A die is attached to the interposer.

摘要翻译： 提供一种制造具有引线框架的大型封装的方法，所述引线框架具有引线和桨。 插入器附接到引线框架上，插入件延伸至桨的至少一部分和引线框架的引线的至少一部分。 内插器与引线绝缘。 模具附着在插入器上。

公开(公告)号：US20060186515A1

公开(公告)日：2006-08-24

申请号：US11379740

申请日：2006-04-21

申请人： Jeffrey Punzalan ,  Jose Caparas ,  Jae Hun Ku

发明人： Jeffrey Punzalan ,  Jose Caparas ,  Jae Hun Ku

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substantial alignment with the inner edges of the number of inner leads. A die is attached to the die attach paddle. A number of bonding wires is used to connect the die to the number of inner leads and the extended lead tips on the number of outer leads, and an encapsulant is formed over the leadframe and the die.

摘要翻译： 提供半导体封装。 引线框架包括管芯连接板，多个内部引线和多个外部引线，以及多个外部引线的多个延伸的引线端。 延伸引线头的数量的内边缘与内引线数量的内边缘基本对准。 模具附接到管芯附接板上。 多个接合线用于将管芯连接到外引线数目的内引线数量和延长引线端头，并且在引线框架和管芯上形成密封剂。

公开(公告)号：US20050260787A1

公开(公告)日：2005-11-24

申请号：US10846171

申请日：2004-05-13

申请人： Jeffrey Punzalan ,  Jose Caparas ,  Jae Ku

发明人： Jeffrey Punzalan ,  Jose Caparas ,  Jae Ku

IPC分类号： H01L21/44 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/92247 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substantial alignment with the inner edges of the number of inner leads. A die is attached to the die attach paddle. A number of bonding wires is used to connect the die to the number of inner leads and the extended lead tips on the number of outer leads, and an encapsulant is formed over the leadframe and the die.

摘要翻译： 提供半导体封装。 引线框架包括管芯连接板，多个内部引线和多个外部引线，以及多个外部引线的多个延伸的引线端。 延伸引线头的数量的内边缘与内引线数量的内边缘基本对准。 模具附接到管芯附接板上。 多个接合线用于将管芯连接到外引线数目的内引线数量和延长引线端头，并且在引线框架和管芯上形成密封剂。