-
公开(公告)号：US20070108624A1
公开(公告)日：2007-05-17
申请号：US11381734
申请日：2006-05-04
CPC分类号： H01L23/49548 , H01L23/49503 , H01L23/4951 , H01L24/16 , H01L24/81 , H01L2224/10175 , H01L2224/13099 , H01L2224/16245 , H01L2224/8121 , H01L2224/81815 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/18301 , H01L2924/00
摘要： An integrated circuit package system includes an integrated circuit package having a downset terminal lead, a planar recessed lead surface of the downset terminal lead, and an attached integrated circuit over the planar recessed lead surface.
摘要翻译： 集成电路封装系统包括集成电路封装，其具有开路端子引线，开路端子引线的平面凹陷引线表面和平面凹陷引线表面上的附接集成电路。
-
公开(公告)号：US20070262423A1
公开(公告)日：2007-11-15
申请号：US11383038
申请日：2006-05-12
IPC分类号： H01L23/495
CPC分类号： H01L23/49541 , H01L21/565 , H01L23/49548 , H01L24/97 , H01L2224/16245 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit encapsulation system with vent is provided including providing a sheet material, forming a leadframe array on the sheet material, forming a leadframe air vent on the leadframe array, attaching an integrated circuit to the leadframe array, mounting the leadframe array in a mold and encapsulating the integrated circuit and the leadframe array.
摘要翻译： 提供具有通气孔的集成电路封装系统，包括提供片材，在片材上形成引线框架阵列，在引线框阵列上形成引线框架通气孔，将集成电路连接到引线框架阵列，将引线框阵列安装在模具中 并封装集成电路和引线框阵列。
-
公开(公告)号：US20070170570A1
公开(公告)日：2007-07-26
申请号：US11307129
申请日：2006-01-24
IPC分类号： H01L23/02
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/3128 , H01L23/3135 , H01L24/48 , H01L24/73 , H01L25/03 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system provides a known good die module by providing a leadframe, providing a first die, attaching the first die to the leadframe, and encapsulating at least the first die. A second die is attached to the known good die module such that the known good die module is a substrate for the second die. The second die is electrically attached to the known good die module. At least the second die is additionally encapsulated.
摘要翻译： 集成电路封装系统通过提供引线框架提供已知的良好管芯模块，提供第一管芯，将第一管芯附接到引线框架，以及至少封装第一管芯。 第二模具连接到已知的良好模具模块，使得已知的良好模具模块是用于第二模具的基板。 第二个模具电连接到已知的好的模具模块。 至少第二个管芯被另外封装。
-
公开(公告)号：US20070170554A1
公开(公告)日：2007-07-26
申请号：US11338328
申请日：2006-01-23
IPC分类号： H01L23/495
CPC分类号： H01L21/568 , H01L23/3135 , H01L23/495 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a lead from a padless lead frame, and encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.
摘要翻译： 提供了一种集成电路封装系统，其从无铅引线框架形成引线，并且封装所述引线以将第一模塑料与第二模塑料一起封装，用于支撑集成电路模具。
-
公开(公告)号：US20050253230A1
公开(公告)日：2005-11-17
申请号：US10837347
申请日：2004-04-30
申请人： Jeffrey Punzalan , Jose Caparas , Jae Ku
发明人： Jeffrey Punzalan , Jose Caparas , Jae Ku
IPC分类号： H01L23/02 , H01L23/31 , H01L23/495 , H01L29/06
CPC分类号： H01L23/49551 , H01L23/3107 , H01L23/4951 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L29/0657 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
摘要翻译： 提供一种用于制造大型封装结构的方法，其中引线框架的至少多个引线脚的至少部分引线电绝缘。 模具位于电绝缘引线上。 裸片与至少多个引线笔电连接。
-
公开(公告)号：US20070018290A1
公开(公告)日：2007-01-25
申请号：US11536544
申请日：2006-09-28
申请人： Jeffrey Punzalan , Jose Caparas , Jae Hun Ku
发明人： Jeffrey Punzalan , Jose Caparas , Jae Hun Ku
IPC分类号： H01L23/495 , H01L21/00
CPC分类号： H01L23/49551 , H01L23/3107 , H01L23/4951 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L29/0657 , H01L2224/16 , H01L2224/16245 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/10155 , H01L2924/10158 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/00 , H01L2224/05599 , H01L2924/00012
摘要： A method for fabricating large die package structures is provided wherein at least portions of the leadtips of at least a plurality of leadfingers of a leadframe are electrically insulated. A die is positioned on the electrically insulated leadtips. The die is electrically connected to at least a plurality of the leadfingers.
摘要翻译： 提供一种用于制造大型封装结构的方法，其中引线框架的至少多个引线脚的至少部分引线电绝缘。 模具位于电绝缘引线上。 裸片与至少多个引线笔电连接。
-
公开(公告)号：US20060186515A1
公开(公告)日：2006-08-24
申请号：US11379740
申请日：2006-04-21
申请人： Jeffrey Punzalan , Jose Caparas , Jae Hun Ku
发明人： Jeffrey Punzalan , Jose Caparas , Jae Hun Ku
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85207 , H01L2224/92247 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substantial alignment with the inner edges of the number of inner leads. A die is attached to the die attach paddle. A number of bonding wires is used to connect the die to the number of inner leads and the extended lead tips on the number of outer leads, and an encapsulant is formed over the leadframe and the die.
摘要翻译： 提供半导体封装。 引线框架包括管芯连接板，多个内部引线和多个外部引线，以及多个外部引线的多个延伸的引线端。 延伸引线头的数量的内边缘与内引线数量的内边缘基本对准。 模具附接到管芯附接板上。 多个接合线用于将管芯连接到外引线数目的内引线数量和延长引线端头，并且在引线框架和管芯上形成密封剂。
-
公开(公告)号：US20050260787A1
公开(公告)日：2005-11-24
申请号：US10846171
申请日：2004-05-13
申请人： Jeffrey Punzalan , Jose Caparas , Jae Ku
发明人： Jeffrey Punzalan , Jose Caparas , Jae Ku
IPC分类号： H01L21/44 , H01L23/31 , H01L23/495
CPC分类号： H01L23/3107 , H01L23/49503 , H01L23/49541 , H01L23/49548 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2224/73265 , H01L2224/85207 , H01L2224/92247 , H01L2924/01013 , H01L2924/01014 , H01L2924/01027 , H01L2924/01031 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10162 , H01L2924/14 , H01L2924/181 , H01L2924/30105 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor package is provided. A leadframe including a die attach paddle, a number of inner leads, and a number of outer leads, and a number of extended lead tips on the number of outer leads. The inner edges of the number of extended lead tips are in substantial alignment with the inner edges of the number of inner leads. A die is attached to the die attach paddle. A number of bonding wires is used to connect the die to the number of inner leads and the extended lead tips on the number of outer leads, and an encapsulant is formed over the leadframe and the die.
摘要翻译： 提供半导体封装。 引线框架包括管芯连接板，多个内部引线和多个外部引线，以及多个外部引线的多个延伸的引线端。 延伸引线头的数量的内边缘与内引线数量的内边缘基本对准。 模具附接到管芯附接板上。 多个接合线用于将管芯连接到外引线数目的内引线数量和延长引线端头，并且在引线框架和管芯上形成密封剂。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.022 秒)
