公开(公告)号：US20220128484A1

公开(公告)日：2022-04-28

申请号：US17507797

申请日：2021-10-21

Applicant: AP SYSTEMS INC.

Inventor： Yong Soo MOON ,  Hahn Joo YOON ,  Chan Ho HONG ,  Seung Hwan LEE ,  Oh Seung KWON

IPC: G01N21/95 ,  G01N21/88

Abstract: Provided are an apparatus for processing a substrate and a method for measuring a temperature of the substrate. The apparatus for processing the substrate includes a temperature measurement part and a light-transmitting shield plate. The temperature measurement part includes a light source, a light receiving part configured to receive reflected light reflected by the substrate or the shield plate among the light irradiated from the light source, and a radiant light emitted from the substrate to measure a quantity of the reflected light and an intensity of the radiant light and a temperature calculation part configured to calculate the temperature of the substrate, to which a contamination level of the shield plate is reflected, by using the quantity of the reflected light and the intensity of the radiant light.

公开(公告)号：US20210082737A1

公开(公告)日：2021-03-18

申请号：US16989864

申请日：2020-08-10

Applicant: AP SYSTEMS INC.

Inventor： Chang Kyo KIM ,  Chang Min KWON

IPC: H01L21/687 ,  H01L21/67 ,  C23C16/458

Abstract: Provided are an edge ring and a heat treatment apparatus having the same. The edge ring includes a main body having a ring shape. The main body includes a substrate support part configured to support an edge of a bottom surface of a substrate, an outer band provided outside the substrate support part and having a top surface that is higher than a top surface of the substrate support part and is parallel to a top surface of the substrate supported by the substrate support part, an outer sidewall provided outside the outer band, and a groove part provided between the substrate support part and the outer band.

公开(公告)号：US09470581B2

公开(公告)日：2016-10-18

申请号：US14190084

申请日：2014-02-25

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun Ji

IPC: F27D11/00 ,  G01J5/60 ,  G01J5/00 ,  G01J5/06

CPC classification number: G01J5/602 ,  G01J5/0007 ,  G01J2005/0048 ,  G01J2005/067

Abstract: Disclosed are an apparatus and method of detecting a temperature through a pyrometer in a non-contact manner, and an apparatus for processing a substrate using the apparatus, and more particularly, an apparatus and method of detecting a temperature, which precisely measures a temperature without any effect by humidity, and an apparatus for processing a substrate using the same. In an exemplary embodiment, an apparatus for detecting a temperature includes a humidity sensor configured to measure a humidity value, a temperature compensation database configured to store a temperature compensation value for each humidity value, and a pyrometer providing a non-contact temperature calculated by adding a temperature compensation value corresponding to a humidity value detected by the humidity sensor to a temperature to be compensated, which is obtained by converting a measured a wavelength intensity of a radiation radiated from an object in a wavelength band to be compensated.

Abstract translation: 公开了以非接触方式通过高温计检测温度的装置和方法，以及使用该装置处理基板的装置，更具体地，涉及一种检测温度的装置和方法，其精确地测量温度而没有 湿度的任何影响，以及使用其的基板的处理装置。 在一个示例性实施例中，用于检测温度的装置包括被配置为测量湿度值的湿度传感器，配置为存储每个湿度值的温度补偿值的温度补偿数据库，以及提供非接触温度的高温计， 将由湿度传感器检测到的湿度值对应的温度补偿值与要补偿的温度相对应的温度补偿值，该温度补偿值是通过将被测量的被测物体辐射的波长的波长强度转换成待补偿的波段而得到的。

公开(公告)号：US09386632B2

公开(公告)日：2016-07-05

申请号：US14403575

申请日：2013-05-21

Applicant: AP SYSTEMS INC.

Inventor： Sang-Hyun Ji

IPC: H05B1/02 ,  H05B3/00 ,  G01J5/00

CPC classification number: H05B1/0233 ,  G01J5/0007 ,  G01J5/0044 ,  H05B3/0047

Abstract: The present invention relates to a substrate treatment apparatus and method which perform heat treatment on a substrate, and can accurately measure the temperature of the substrate even at a low temperature. An embodiment of the present invention includes a process chamber that has a substrate treatment space, a heating housing that contains a plurality of heating lamps for generating radiant energy, a window that is placed between the heating housing and the process chamber to maintain the air-tightness of the process chamber and transmit the radiant energy to be transferred to a substrate, a first pyrometer that measures a wavelength generated at the substrate in the process chamber, and converts the wavelength into substrate measurement energy, a second pyrometer that measures a wavelength generated at the window, and converts the wavelength into window measurement energy; and a heating controller that compensates for the window measurement energy in the substrate measurement energy, thereby calculating the temperature of the substrate itself, and uses the calculated temperature of the substrate itself to control the heating lamps.

Abstract translation: 本发明涉及对基板进行热处理的基板处理装置和方法，并且即使在低温也能够精确地测量基板的温度。 本发明的实施例包括具有基板处理空间的处理室，包含用于产生辐射能的多个加热灯的加热壳体，设置在加热壳体和处理室之间的窗口， 传递处理室的密封性并传输要转移到衬底的辐射能，测量在处理室中的衬底处产生的波长并将波长转换成衬底测量能量的第一高温计，测量所产生的波长的第二高温计 在窗口处，将波长转换成窗口测量能量; 以及加热控制器，其补偿基板测量能量中的窗口测量能量，由此计算基板本身的温度，并且使用所计算的基板本身的温度来控制加热灯。

公开(公告)号：US20130308928A1

公开(公告)日：2013-11-21

申请号：US13895331

申请日：2013-05-15

Applicant: AP SYSTEMS INC.

Inventor： Chang-Kyo KIM ,  Sung-Chul KIM ,  Chang-Min KWON ,  Ki-Nam KIM

IPC: H01L21/67

CPC classification number: H01L21/67115

Abstract: The present invention relates to a heater block and a substrate treatment apparatus, and more particularly to a heater block to perform heat treatment on a substrate and a substrate treatment apparatus having the same. According to embodiments of the present invention, it is provided a heater block for a substrate treatment apparatus having heating lamps on its one side to transfer heat to a target subjected to heat treatment, the heating lamps having different arrangement patterns in a plurality of regions on said one side.

Abstract translation: 本发明涉及一种加热器块和基板处理装置，更具体地涉及对基板进行热处理的加热器块和具有该加热块的基板处理装置。 根据本发明的实施例，提供了一种用于基板处理装置的加热器块，该基板处理装置的一侧具有加热灯，以将热量传递到经受热处理的目标，加热灯在多个区域中具有不同的布置图案 一方说

公开(公告)号：US20130294756A1

公开(公告)日：2013-11-07

申请号：US13886261

申请日：2013-05-02

Applicant: AP SYSTEMS INC.

Inventor： Il-Hwan LIM ,  Jang-Woo SHIM ,  Chul-Soo KIM ,  Seung-Ae CHOI

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  F27B17/0025 ,  H05B3/0047

Abstract: The present invention relates to an apparatus for heat-treating a substrate, and more particularly to an apparatus for substrate treatment to perform a heat treatment of a substrate for a flat panel display panel.An apparatus for substrate treatment according to an embodiment of the present invention comprises a processing chamber having a substrate treatment space; a heating housing having a heating lamp that emits radiant energy and a reflecting block that reflects radiant energy emitted from the heating lamp; and a window that maintains a sealing between the processing chamber and the heating housing and transmits the radiant energy to a substrate.

Abstract translation: 本发明涉及一种用于对基板进行热处理的装置，更具体地涉及用于对平板显示面板进行基板的热处理的基板处理装置。 根据本发明的实施例的用于基板处理的装置包括具有基板处理空间的处理室; 具有发射辐射能的加热灯的加热壳体和反射从加热灯发出的辐射能的反射块; 以及在处理室和加热壳体之间保持密封并将辐射能传递到基板的窗口。

公开(公告)号：US20180205018A1

公开(公告)日：2018-07-19

申请号：US15744029

申请日：2016-08-04

Applicant: AP SYSTEMS INC.

Inventor： Jong-Kab PARK ,  Bo-Ram KIM ,  Jun-Gyu HUR ,  Doh-Hoon KIM

IPC: H01L51/00 ,  H01L51/56 ,  C23C14/04 ,  G03F7/30 ,  B23K26/364 ,  B23K26/082 ,  B23K26/0622

Abstract: The present invention discloses a method of manufacturing a shadow mask, wherein hybrid processing is used to form a mask pattern on the shadow mask, the method includes: forming a laser-processed pattern by irradiating a laser beam from above a base; and forming a wet-etched pattern that continues from the laser-processing pattern, by performing wet etching from above the base or from below the base on which the laser-processed pattern is formed. The present invention uses hybrid processing including wet etching and laser processing for manufacturing a shadow mask. The method has an effect on solving the productivity degradation of the conventional laser processing and provides a shadow mask with high quality using wet etching.

公开(公告)号：US20140284316A1

公开(公告)日：2014-09-25

申请号：US14190084

申请日：2014-02-25

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI

IPC: G01J5/02

CPC classification number: G01J5/602 ,  G01J5/0007 ,  G01J2005/0048 ,  G01J2005/067

Abstract: Disclosed are an apparatus and method of detecting a temperature through a pyrometer in a non-contact manner, and an apparatus for processing a substrate using the apparatus, and more particularly, an apparatus and method of detecting a temperature, which precisely measures a temperature without any effect by humidity, and an apparatus for processing a substrate using the same. In an exemplary embodiment, an apparatus for detecting a temperature includes a humidity sensor configured to measure a humidity value, a temperature compensation database configured to store a temperature compensation value for each humidity value, and a pyrometer in which, assuming that a wavelength band including a transmittance limiting wavelength band as a wavelength band having a transmittance less than a first threshold value due to the humidity and a transmittance allowing wavelength band as a wavelength band having a transmittance more than a second threshold value due to the humidity is a wavelength band to be compensated, a non-contact temperature is calculated by adding a temperature compensation value corresponding to a humidity value detected by the humidity sensor to a temperature to be compensated calculated by measuring a wavelength intensity of the wavelength band to be compensated radiated from an object to be measured.

Abstract translation: 公开了以非接触方式通过高温计检测温度的装置和方法，以及使用该装置处理基板的装置，更具体地，涉及一种检测温度的装置和方法，其精确地测量温度而没有 湿度的任何影响，以及使用其的基板的处理装置。 在一个示例性实施例中，用于检测温度的装置包括被配置为测量湿度值的湿度传感器，配置成存储每个湿度值的温度补偿值的温度补偿数据库，以及高温计，其中， 作为具有由于湿度而导致的透射率小于第一阈值的波长带的透光率限制波长带和由于湿度导致的具有大于第二阈值的波长带的波长带的透射率为波长带宽 通过将对应于由湿度传感器检测到的湿度值的温度补偿值与通过测量从物体辐射的待补偿的波长带的波长强度计算得到的待补偿温度相加来计算非接触温度 被测量。

公开(公告)号：US20140219310A1

公开(公告)日：2014-08-07

申请号：US14173795

申请日：2014-02-05

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun Ji

IPC: G01J5/52

CPC classification number: G01J5/522 ,  G01J5/0007 ,  G01J5/0893

Abstract: Disclosed is a calibrating apparatus which is adapted to remove a measurement deviation of a pyrometer, and more particularly, to an apparatus for calibrating a pyrometer, which calibrates a reference value so as to remove a deviation in a temperature measured in a pyrometer. The apparatus for calibrating a pyrometer includes a blackbody including a radiant space from which radiant energy is radiated, a body housing configured to receive the blackbody therein and including a light output wall having a light output port connected with the radiant space, a light output wall protecting cover comprising a transparent blocking plate disposed at a position opposite to the light output port so as to transmit a long wavelength of approximately 5 μm to approximately 20 μm may and configured to be coupled with the light output wall of the body housing, and a fixing member configured to fix the light output wall protecting cover to the light output wall of the body housing.

Abstract translation: 公开了一种校准装置，其适于去除高温计的测量偏差，更具体地，涉及用于校准高温计的装置，其校准参考值以消除在高温计中测量的温度的偏差。 用于校准高温计的装置包括黑体，其包括辐射能量辐射的辐射空间，被构造为在其中接收黑体的主体壳体，并且包括具有与辐射空间连接的光输出端口的光输出壁，光输出壁 保护盖包括设置在与光输出端口相对的位置处的透明阻挡板，以将大约5μm的长波长传输到大约20μm，并且可以被配置为与主体外壳的光输出壁相连，并且 固定构件，其构造成将光输出壁保护盖固定到主体壳体的光输出壁。

公开(公告)号：US20140219309A1

公开(公告)日：2014-08-07

申请号：US14173793

申请日：2014-02-05

Applicant: AP SYSTEMS INC.

Inventor： Sang Hyun JI

IPC: G01J5/52

CPC classification number: G01J5/522 ,  G01J5/0007 ,  G01J5/0887

Abstract: Disclosed is a calibrating apparatus which is adapted to remove a measurement deviation of a pyrometer, and more particularly, to an apparatus for calibrating a pyrometer, which calibrates a reference value so as to remove a deviation in a temperature measured in a pyrometer. The apparatus for calibrating a pyrometer includes a blackbody including a radiant space from which radiant energy is radiated, a body housing configured to receive the blackbody therein and including a light output wall having a light output port connected with the radiant space, a light output wall protecting cover configured to be coupled with the light output wall of the body housing so as to define a passage connecting the light output wall of the body housing and an outside environment, and a fixing member configured to fix the light output wall protecting cover to the light output wall of the body housing.

Abstract translation: 公开了一种校准装置，其适于去除高温计的测量偏差，更具体地，涉及用于校准高温计的装置，其校准参考值以消除在高温计中测量的温度的偏差。 用于校准高温计的装置包括黑体，其包括辐射能量辐射的辐射空间，被构造为在其中接收黑体的主体壳体，并且包括具有与辐射空间连接的光输出端口的光输出壁，光输出壁 保护盖，其构造成与所述主体壳体的所述光输出壁联接，以便限定连接所述主体壳体的光输出壁和外部环境的通​​道;以及固定构件，其将所述光输出壁保护盖固定到 光输出墙体的外壳。